Gated diode in a press-fit housing and an alternator assembly having a gated diode arranged in a load path

Patent metadata

Field	Value
Publication number	US-10276706-B2
Application number	US-201615132709-A
Country	US
Kind code	B2
Filing date	Apr 19, 2016
Priority date	May 31, 2012
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A gated diode in a press-fit housing includes a base configured to be press-fit into an opening of a diode carrier plate and including a pedestal portion with a first flat surface, and a head wire including a head portion with a second flat surface and a wire portion. The base and the head wire form parts of the press-fit housing. The gated diode in the press-fit housing further includes a semiconductor die, a first solder layer engaging and electrically connecting the semiconductor die with the first flat surface of the base, and a second solder layer engaging and electrically connecting the semiconductor die with the second flat surface of the head wire.

First claim

What is claimed is:

1. A gated diode in a press-fit housing, comprising:
a base configured to be press-fit into an opening of a diode carrier plate and comprising a pedestal portion with a first flat surface;
a head wire comprising a head portion with a second flat surface and a wire portion, the base and the head wire forming parts of the press-fit housing;
a semiconductor die;
a first solder layer engaging and electrically connecting the semiconductor die with the first flat surface of the base; and
a second solder layer engaging and electrically connecting the semiconductor die with the second flat surface of the head wire,
wherein the semiconductor die comprises a source zone and a drain zone of a first conductivity type and a base zone of a second conductivity type, which is the opposite of the first conductivity type, the base zone formed between and separating the source zone and the drain zone, and a gate electrode electrically connected to the source zone and the base zone.

2. The gated diode of claim 1 , wherein the source zone directly adjoins a first surface of the semiconductor die and wherein the drain zone directly adjoins an opposite second surface of the semiconductor die and comprises a drift zone.

3. The gated diode of claim 2 , wherein the drain zone comprises an adjustment zone between the base zone and the second surface and in a, with respect to the first surface, vertical projection of the base zone, wherein a net dopant concentration in the adjustment zone is at least twice a net dopant concentration in portions of the drift zone adjoining the adjustment zone.

4. The gated diode of claim 3 , wherein the adjustment zone adjoins the base zone in a section where a gradient of the net dopant concentration in the base zone in a vertical direction orthogonal to the first surface is steepest.

5. The gated diode of claim 2 , wherein the drain zone comprises a substrate layer having a net dopant concentration at least ten times the net dopant concentration in the drift zone.

6. The gated diode of claim 5 , wherein the drift zone separates the substrate layer from the adjustment zone.

7. The gated diode of claim 3 , further comprising:
first columns of the first conductivity type extending in a vertical direction between the base zones and the drift layer; and
second columns of the second conductivity type extending in the vertical direction and connected with the base zones,
wherein the adjustment zone is formed in the vertical direction of the second columns and directly adjoins the second columns.

8. The gated diode of claim 1 , wherein the base comprises a socket portion with a serrated lateral surface.

9. A gated diode in a press-fit housing, comprising:
a base configured to be press-fit into an opening of a diode carrier plate and comprising a pedestal portion with a first flat surface;
a head wire comprising a head portion with a second flat surface and a wire portion, the base and the head wire forming parts of the press-fit housing;
a semiconductor die;
a first solder layer engaging and electrically connecting the semiconductor die with the first flat surface of the base; and
a second solder layer engaging and electrically connecting the semiconductor die with the second flat surface of the head wire,
wherein the semiconductor die comprises:
a source zone and a drain zone of a first conductivity type and a base zone of a second conductivity type, which is the opposite of the first conductivity type, the base zone formed between and separating the source zone and the drain zone; and
a gate electrode electrically connected to the source zone and the base zone,
wherein the source zone directly adjoins a first surface of the semiconductor die and wherein the drain zone directly adjoins an opposite second surface of the semiconductor die and comprises a drift zone,
wherein the drain zone comprises an adjustment zone between the base zone and the second surface and in a, with respect to the first surface, vertical projection of the base zone, wherein a net dopant concentration in the adjustment zone is at least twice a net dopant concentration in portions of the drift zone adjoining the adjustment zone.

10. A gated diode in a press-fit housing, comprising:
a base configured to be press-fit into an opening of a diode carrier plate and comprising a pedestal portion with a first flat surface;
a head wire comprising a head portion with a second flat surface and a wire portion, the base and the head wire forming parts of the press-fit housing;
a semiconductor die;
a first solder layer engaging and electrically connecting the semiconductor die with the first flat surface of the base;
a second solder layer engaging and electrically connecting the semiconductor die with the second flat surface of the head wire; and
a passivation structure sealing an inner portion of a first gap between the semiconductor die and a space shrouded by a sleeve enclosing a space between the head portion and the pedestal portion.

Assignees

• Infineon Technologies Ag

Inventors

• Ahlers Dirk
• Zundel Markus
• Bonart Dietrich
• Borucki Ludger

Classifications

• H10W76/47

  Solid or gel fillings · CPC title

• H10W76/138

  having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type · CPC title

• H02J7/24

  using discharge tubes or semiconductor devices · CPC title

• H02J7/14

  for charging batteries from dynamo-electric generators driven at varying speed, e.g. on vehicle · CPC title

• H02M7/003

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title