Tunneling transistor and method of fabricating the same

US10276663B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10276663-B2
Application numberUS-201615213370-A
CountryUS
Kind codeB2
Filing dateJul 18, 2016
Priority dateJul 18, 2016
Publication dateApr 30, 2019
Grant dateApr 30, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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A tunneling transistor and a method of fabricating the same, the tunneling transistor includes a fin shaped structure, a source structure and a drain structure, and a gate structure. The fin shaped structure is disposed in a substrate, and the source structure and the drain structure are disposed the fin shaped structure, wherein an entirety of the source structure and an entirety of the drain structure being of complementary conductivity types with respect to one another and having different materials. A channel region is disposed in the fin shaped structure between the source structure and the drain structure and the gate structure is disposed on the channel region. That is, a hetero tunneling junction is vertically formed between the channel region and the source structure, and between the channel region and the drain structure in the fin shaped structure.

First claim

Opening claim text (preview).

What is claimed is: 1. A tunneling transistor comprising: a fin shaped structure disposed in a substrate; a source structure disposed in the fin shaped structure; a drain structure disposed in the fin shaped structure, an entirety of the source structure and an entirety of the drain structure being of complementary conductivity types with respect to one another, wherein the source structure comprises SiGe with a concentration of Ge therein being gradually decreased along a direction away from a channel region, and the drain structure comprises SiP with a concentration of C being gradually decreased along a direction away from the channel region; or alternatively wherein the drain structure comprises SiGe with a concentration of Ge therein being gradually decreased along the direction away from the channel region, and the source structure comprises SiP with a concentration of C being gradually decreased along a direction away from the channel region; the channel region disposed in the fin shaped structure between the source structure and the drain structure, and a sidewall of the source structure and a sidewall of the drain structure being inclined toward the channel region; a gate structure disposed on the channel region; and a hetero tunneling junction vertically disposed between the channel region and the source structure, and between the channel region and the drain structure in the fin shaped structure. 2. The tunneling transistor according to claim 1 , wherein the source structure and the drain structure comprise an asymmetric shape. 3. The tunneling transistor according to claim 1 , wherein the source structure and the drain structure are respectively disposed in two recesses and each of the recesses comprises a sidewall having an edge inclined toward the gate structure. 4. The tunneling transistor according to claim 3 , further comprising a doped region disposed on surfaces of the sidewall. 5. The tunneling transistor according to claim 3 , wherein the gate structure comprises a spacer and the sidewall of the source structure or the drain structure is disposed under the spacer in a projecting direction. 6. The tunneling transistor according to claim 1 , wherein an opposite sidewall opposite to the sidewall of the source structure, or an opposite sidewall opposite to the sidewall of the drain structure also has an inclined edge vertical to the substrate. 7. The tunneling transistor according to claim 1 , wherein an opposite sidewall opposite to the sidewall of the source structure, or an opposite sidewall opposite to the sidewall of the drain structure also has an inclined edge.

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What does patent US10276663B2 cover?
A tunneling transistor and a method of fabricating the same, the tunneling transistor includes a fin shaped structure, a source structure and a drain structure, and a gate structure. The fin shaped structure is disposed in a substrate, and the source structure and the drain structure are disposed the fin shaped structure, wherein an entirety of the source structure and an entirety of the drain …
Who is the assignee on this patent?
United Microelectronics Corp
What technology area does this patent fall under?
Primary CPC classification H01L29/0847. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 30 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).