3D fin tunneling field effect transistor
US-9508597-B1 · Nov 29, 2016 · US
US10276663B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10276663-B2 |
| Application number | US-201615213370-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 18, 2016 |
| Priority date | Jul 18, 2016 |
| Publication date | Apr 30, 2019 |
| Grant date | Apr 30, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A tunneling transistor and a method of fabricating the same, the tunneling transistor includes a fin shaped structure, a source structure and a drain structure, and a gate structure. The fin shaped structure is disposed in a substrate, and the source structure and the drain structure are disposed the fin shaped structure, wherein an entirety of the source structure and an entirety of the drain structure being of complementary conductivity types with respect to one another and having different materials. A channel region is disposed in the fin shaped structure between the source structure and the drain structure and the gate structure is disposed on the channel region. That is, a hetero tunneling junction is vertically formed between the channel region and the source structure, and between the channel region and the drain structure in the fin shaped structure.
Opening claim text (preview).
What is claimed is: 1. A tunneling transistor comprising: a fin shaped structure disposed in a substrate; a source structure disposed in the fin shaped structure; a drain structure disposed in the fin shaped structure, an entirety of the source structure and an entirety of the drain structure being of complementary conductivity types with respect to one another, wherein the source structure comprises SiGe with a concentration of Ge therein being gradually decreased along a direction away from a channel region, and the drain structure comprises SiP with a concentration of C being gradually decreased along a direction away from the channel region; or alternatively wherein the drain structure comprises SiGe with a concentration of Ge therein being gradually decreased along the direction away from the channel region, and the source structure comprises SiP with a concentration of C being gradually decreased along a direction away from the channel region; the channel region disposed in the fin shaped structure between the source structure and the drain structure, and a sidewall of the source structure and a sidewall of the drain structure being inclined toward the channel region; a gate structure disposed on the channel region; and a hetero tunneling junction vertically disposed between the channel region and the source structure, and between the channel region and the drain structure in the fin shaped structure. 2. The tunneling transistor according to claim 1 , wherein the source structure and the drain structure comprise an asymmetric shape. 3. The tunneling transistor according to claim 1 , wherein the source structure and the drain structure are respectively disposed in two recesses and each of the recesses comprises a sidewall having an edge inclined toward the gate structure. 4. The tunneling transistor according to claim 3 , further comprising a doped region disposed on surfaces of the sidewall. 5. The tunneling transistor according to claim 3 , wherein the gate structure comprises a spacer and the sidewall of the source structure or the drain structure is disposed under the spacer in a projecting direction. 6. The tunneling transistor according to claim 1 , wherein an opposite sidewall opposite to the sidewall of the source structure, or an opposite sidewall opposite to the sidewall of the drain structure also has an inclined edge vertical to the substrate. 7. The tunneling transistor according to claim 1 , wherein an opposite sidewall opposite to the sidewall of the source structure, or an opposite sidewall opposite to the sidewall of the drain structure also has an inclined edge.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Related publications grouped by family.
Answers are generated from the same data shown on this page.