Thin wafer shipper

Patent metadata

Field	Value
Publication number	US-10276414-B2
Application number	US-201615269368-A
Country	US
Kind code	B2
Filing date	Sep 19, 2016
Priority date	Mar 11, 2010
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

An improved wafer support mechanism in a wafer container useful for carrying a plurality of axially aligned thin mostly circular wafer substrates. The container includes a cassette that has a plurality of adjacently disposed teeth for receiving the substrates, wherein each rib member is continuous from the cassette open top to the cassette open bottom, a removable top cover portion, a removable bottom cover portion, a cushion assembly removably attached to the container top cover, and another cushion assembly removably located in the container bottom cover and held in place by the weight of the wafer cassette. The top cushions are formed of individual segments having an extended lead-in feature at the end of each segment, spring sections in each segment and each segment has a V-shaped cross section to receive the wafer edge. The top and bottom cushions are installed in the top and bottom container covers, respectively, and extend the wafer support to approximately the entire circumference of each wafer.

First claim

The invention claimed is:

1. A wafer cushion comprising:
first and second rails configured for attachment to an inside surface of a top cover of a wafer shipper;
a plurality of arcuate wafer engaging portions each having a first end and a second end and extending from the first rail to the second rail, the arcuate wafer engaging portions defining a plurality of grooves for holding wafers in the shipper; and
a plurality of guides located adjacent to each of the first and second ends of the arcuate wafer engaging portions, the plurality of guides extending radially inward for placement in between wafers held in the plurality of grooves,
wherein the wafer cushion has an elastic resilience which facilitates its attachment to the inside surface of a top cover of a wafer shipper.

2. The wafer cushion of claim 1 , wherein the plurality of grooves comprises V-shaped grooves for receiving the periphery of the wafers, the V-shaped grooves defining wafer slots.

3. The wafer cushion of claim 1 , wherein the plurality of grooves defines a plurality of wafer slots, and the plurality of guides comprises a plurality of prongs each positioned intermediate the wafer slots.

4. The wafer cushion of claim 1 , wherein the plurality of guides comprises a plurality of prongs that extend radially inward at least 5 mm from the peripheral edge of a 100 mm wafer when a wafer is seated in the cassette.

5. The wafer cushion of claim 1 , wherein the plurality of arcuate wafer-engaging portions are connected to the pair of rails by a corresponding pair of springs.

6. The wafer cushion of claim 5 , wherein the springs are U-shaped springs formed of the same material as the wafer engaging portions.

7. The wafer cushion of claim 1 , wherein each of the guides has a downwardly extending tip, the guides being positioned such that the tips of the guides move past a periphery of wafers in the cassette before the wafer peripheries enter the grooves.

8. The wafer cushion of claim 1 , wherein the plurality of guides comprises a plurality of prongs, wherein each of the prongs are tapered.

9. The wafer cushion of claim 1 , wherein the elastic resilience of the cushion exhibits a dampening effect to vibration and mechanical shock.

10. A wafer shipper comprising: a container portion; a base portion; a top cover portion; and a wafer cushion attached to an inner surface of the top cover, the wafer cushion comprising first and second rails configured for attachment to an inside surface of a top cover of a wafer shipper, a plurality of arcuate wafer engaging portions each having a first end and a second end and extending from the first rail to the second rail, the arcuate wafer engaging portions defining a plurality of grooves for holding wafers in the shipper, and a plurality of guides located adjacent to each of the first and second ends of the wafer engaging portions, the plurality of guides extending radially inward for placement in between wafers held in the plurality of grooves, wherein the wafer cushion has an elastic resilience which facilitates its attachment to the inside surface of a top cover of a wafer shipper.

Assignees

• Entegris Inc

Inventors

• Gregerson Barry
• Steffens Jason Todd
• Raschke Russ V

Classifications

• H10P72/1922

  characterised by the construction of the closed carrier · CPC title

• H10P72/1921

  characterised by substrate supports · CPC title

• H10P72/1912 Primary

  characterised by shock absorbing elements, e.g. retainers or cushions · CPC title

• H10P72/10

  using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] · CPC title

• H01L21/67383

  Electricity · mapped topic