Method and apparatus for improved cooling of a heat sink using a synthetic jet

Patent metadata

Field	Value
Publication number	US-10274263-B2
Application number	US-201113074700-A
Country	US
Kind code	B2
Filing date	Mar 29, 2011
Priority date	Apr 9, 2009
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A system for cooling a device includes a heat sink comprising a substrate having a plurality of fins arranged thereon, a fan positioned to direct an ambient fluid in a first direction across the heat sink, and a first synthetic jet assembly comprising one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets. The first synthetic jet assembly is configured to direct the ambient fluid in a second direction across the heat sink, wherein the second direction is approximately perpendicular to the first direction.

First claim

What is claimed is:

1. A system for cooling a device comprising:
a heat sink comprising a substrate having a plurality of fins arranged thereon;
a fan positioned to direct a stream of ambient fluid in a first direction towards the heat sink; and
a first synthetic jet assembly comprising one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets;
wherein the first synthetic jet assembly is configured to direct ambient fluid in a second direction across the heat sink, wherein the second direction is approximately perpendicular to the first direction;
wherein a first portion of the stream of ambient fluid directed by the fan flows across the heat sink and a second portion of the stream of ambient fluid directed by the fan bypasses the heat sink; and
wherein the second portion of the stream of ambient fluid that bypasses the heat sink is directed back toward the heat sink by the first synthetic jet assembly.

2. The system of claim 1 wherein the fan is positioned at a first side of the heat sink, the fan configured to direct the ambient fluid across a length of the heat sink; and
wherein the first synthetic jet assembly is positioned at a second side of the heat sink adjacent to the first side, the first synthetic jet assembly configured to direct the ambient fluid across a width of the heat sink.

3. The system of claim 1 wherein the plurality of fins comprises an array of pin fins.

4. The system of claim 3 wherein the plurality of fins comprises a rectangular array of pin fins.

5. The system of claim 3 wherein the plurality of fins comprises a staggered array of pin fins.

6. The system of claim 1 wherein the heat sink comprises an upstream section, a downstream section, and a central section between the upstream section and the downstream section; and
wherein the first synthetic jet assembly is aligned with at least one of the central section and the downstream section of the heat sink.

7. The system of claim 1 further comprising a second synthetic jet assembly positioned adjacent to a third side of the heat sink, the third side opposite the second side of the heat sink.

8. The system of claim 7 wherein the synthetic jets of the first synthetic jet assembly are positioned in a staggered pattern along a sub-portion of the length of the heat sink with respect to the synthetic jets of the second synthetic jet assembly.

9. The system of claim 1 wherein the fan is sized to direct ambient fluid at a velocity not more than half the velocity of ambient fluid provided from the first synthetic jet assembly.

10. A method of fabricating a system for cooling an electronic device comprising:
providing and positioning a fan adjacently to a heat sink such that air flow from the fan is directed in a first direction through an array of fins of the heat sink; and
providing and positioning a first synthetic jet assembly adjacently to the heat sink such that air flow from the first synthetic jet assembly is directed in a second direction through the array of fins of the heat sink, wherein the second direction is approximately perpendicular to the first direction, and wherein the first synthetic jet assembly comprises one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets;
wherein, in providing the fan, a fan is provided that is sized to direct a stream of ambient fluid at a velocity not more than half the velocity of the air flow provided from the one of the multi-orifice synthetic jet and the plurality of single orifice synthetic jets.

11. The method of claim 10 further comprising positioning the fan adjacently to an inlet side of the heat sink such that air flow from the fan is directed along a length of the heat sink toward an outlet side thereof.

12. The method of claim 10 further comprising:
positioning the first synthetic jet assembly adjacently to a first side of the heat sink such that air flow from the first synthetic jet assembly is directed along a width of the heat sink; and
positioning a second synthetic jet assembly adjacently to a second side of the heat sink such that air flow from the second synthetic jet assembly is directed along the width of the heat sink in a direction opposite a direction of air flow from the first synthetic jet assembly.

13. The method of claim 12 further comprising positioning the second synthetic jet assembly adjacently to the second side of the heat sink such that air flow from the second synthetic jet assembly is non-opposing to air flow from the first synthetic jet assembly.

14. The method of claim 10 wherein a first portion of the air flow directed by the fan flows across the heat sink and a second portion of the air flow directed by the fan bypasses the heat sink; and
wherein the second portion of the air flow that bypasses the heat sink is directed back toward the heat sink by the first synthetic jet assembly.

15. A cooling system comprising:
a fan disposed adjacently to a heat sink to direct a first stream of ambient fluid through an array of fins of the heat sink;
a first multi-orifice synthetic jet positioned adjacently to the heat sink to direct a second stream of ambient fluid through the array of fins of the heat sink; and
a synthetic jet driver electrically coupled to the first multi-orifice synthetic jet to actuate the first multi-orifice synthetic jet;
wherein the first multi-orifice synthetic jet is positioned with respect to the fan such that the second stream of ambient fluid is approximately perpendicular to the first stream of ambient fluid; and
wherein the fan is sized to direct the first stream of ambient fluid at a velocity not more than half the velocity of the second stream of fluid provided from the first multi-orifice synthetic jet.

16. The cooling system of claim 15 wherein the fan is disposed at an inlet side of the heat sink; and
wherein the first multi-orifice synthetic jet is disposed at a first side of the heat sink, the first side adjacent to the inlet side.

17. The cooling system of claim 15 further comprising a second multi-orifice synthetic jet positioned adjacently to the heat sink to direct a third stream of ambient fluid through the array of fins of the heat sink.

18. The cooling system of claim 17 wherein the second multi-orifice synthetic jet is positioned at a second side of the heat sink, the second side opposite the first side.

19. The cooling system of claim 17 wherein the first multi-orifice synthetic jet is positioned a first distance from an intersection of the first side with the inlet side of the heat sink; and
wherein the second multi-orifice synthetic jet is positioned a second distance from an intersection of the second side with the inlet side of the heat sink, the second distance greater than the first distance.

20. The cooling system of claim 15 wherein the fan is sized to direct the first stream of ambient fluid at a first velocity; and
wherein the first multi-orifice synthetic jet is sized to direct the second stream of ambient fluid at a second velocity, the second velocity greater than the first velocity.

Assignees

• Arik Mehmet
• Utturkar Yogen Vishwas
• Gen Electric

Inventors

• Arik Mehmet
• Utturkar Yogen Vishwas

Classifications

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H01L2924/0002

  Electricity · mapped topic

• Y10T29/4935

  Heat exchanger or boiler making · CPC title

• F28F3/022 Primary

  the means being wires or pins · CPC title

• H01L2924/00

  Electricity · mapped topic