Method of coating both sides of a substrate using a sacrificial coating

US10273573B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10273573-B2
Application numberUS-201615368962-A
CountryUS
Kind codeB2
Filing dateDec 5, 2016
Priority dateDec 11, 2015
Publication dateApr 30, 2019
Grant dateApr 30, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of depositing coating onto both sides of a substrate is provided, which includes steps of upwardly sputtering one or more lower targets to deposit a sacrificial coating onto a second surface and downwardly sputtering one or more upper targets to deposit a first functional coating onto a first surface, washing the substrate with one or more washers to remove the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface, and downwardly sputtering the one or more upper targets to deposit a second functional coating onto the second surface.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of depositing coating onto both sides of a substrate having a first surface and a second surface using a production line comprising a series of sputtering chambers and a plurality of transport rollers for conveying the substrate along the production line, the series of sputtering chambers comprising one or more upper targets positioned above the plurality of transport rollers and one or more lower targets positioned beneath the plurality of transport rollers, the method comprising; positioning the substrate on the production line such that the first surface is oriented toward said one or more upper targets and the second surface contacts two or more of the plurality of transport rollers; upwardly sputtering said one or more lower targets to deposit a sacrificial coating directly onto the second surface and downwardly sputtering said one or more upper targets to deposit a first functional coating onto the first surface; re-positioning the substrate on the production line such that the second surface is oriented toward said one or more upper targets and the first surface contacts two or more of the plurality of transport rollers, wherein the re-positioning occurs after depositing the first functional coating onto the first surface; removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface; and downwardly sputtering said one or more upper targets to deposit a second functional coating onto the second surface after removing the sacrificial coating from the second surface. 2. The method according to claim 1 wherein the upwardly sputtering said one or more lower targets to deposit the sacrificial coating directly onto the second surface occurs before the downwardly sputtering said one or more upper targets to deposit the first functional coating onto the first surface. 3. The method according to claim 1 wherein the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises removing the sacrificial coating from the second surface while not functionally altering the first functional coating. 4. The method according to claim 1 wherein the first functional coating provides the substrate with a surface roughness and the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises removing the sacrificial coating from the second surface without changing the surface roughness by more than 10%. 5. The method according to claim 4 wherein the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises removing the sacrificial coating from the second surface without changing the surface roughness by more than 5%. 6. The method according to claim 1 wherein the first functional coating provides the substrate with a sheet resistance and the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises removing the sacrificial coating from the second surface without changing the sheet resistance by more than 10%. 7. The method according to claim 6 wherein the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises removing the sacrificial coating from the second surface without changing the sheet resistance by more than 5%. 8. The method according to claim 1 wherein the first functional coating provides the substrate with a monolithic visible transmittance and the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises removing the sacrificial coating from the second surface without changing the monolithic visible transmittance by more than 10%. 9. The method according to claim 8 wherein the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises removing the sacrificial coating from the second surface without changing the monolithic visible transmittance by more than 5%. 10. The method according to claim 1 wherein the first functional coating provides the substrate with a haze level and the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises removing the sacrificial coating from the second surface without changing the haze level by more than 10%. 11. The method according to claim 10 wherein the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises removing the sacrificial coating from the second surface without changing the haze level by more than 5%. 12. The method according to claim 1 wherein the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises removing the sacrificial coating from the second surface while not removing more than 10% of thickness of the first functional coating. 13. The method according to claim 1 wherein the first functional coating comprises a transparent conductive oxide coating, wherein the transparent conductive oxide coating includes a transparent conductive oxide film and an outer dielectric film, and wherein the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises removing the sacrificial coating from the second surface while not removing any thickness of the transparent conductive oxide film. 14. The method according to claim 1 wherein the sacrificial coating has a thickness of less than 150 angstroms and the first functional coating has a thickness of at least 500 angstroms. 15. The method according to claim 1 wherein the first functional coating comprises a transparent conductive oxide coating, and the second functional coating is a low-emissivity coating comprising one or more silver layers. 16. The method according to claim 1 wherein the sacrificial coating consists of a single oxide film and the first functional coating consists of two or more layers each comprising oxide film, nitride film or oxynitride film. 17. The method according to claim 1 wherein the sacrificial coating is a single layer comprising zinc oxide. 18. The method according to claim 1 further comprising heat treating the substrate after downwardly sputtering said one or more upper targets to deposit the second functional coating onto the second surface. 19. The method according to claim 1 further comprising heat treating the substrate after removing the sacrificial coating from the second surface but before downwardly sputtering said one or more upper targets to deposit the second functional coating onto the second surface. 20. The method according to claim 1 wherein the removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface comprises conveying the substrate through one or more washers to deposit a removal solution onto the second surface, such that the removal solution removes the sacrificial coating but does not remove the first functional coating. 21. The method according to claim 20 wherein the removing the sacrificial coating from the second surfac

Assignees

Inventors

Classifications

  • C23C14/568Primary

    Transferring the substrates through a series of coating stations (C23C14/562 takes precedence) · CPC title

  • Means for minimising impurities in the coating chamber such as dust, moisture, residual gases · CPC title

  • Coating different sides of a glass substrate · CPC title

  • Temporary coating · CPC title

  • by etching · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10273573B2 cover?
A method of depositing coating onto both sides of a substrate is provided, which includes steps of upwardly sputtering one or more lower targets to deposit a sacrificial coating onto a second surface and downwardly sputtering one or more upper targets to deposit a first functional coating onto a first surface, washing the substrate with one or more washers to remove the sacrificial coating from…
Who is the assignee on this patent?
Cardinal Cg Co
What technology area does this patent fall under?
Primary CPC classification C23C14/568. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 30 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).