Micromechanical component

Patent metadata

Field	Value
Publication number	US-10273146-B2
Application number	US-201715711888-A
Country	US
Kind code	B2
Filing date	Sep 21, 2017
Priority date	Sep 30, 2016
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A micromechanical component is provided, the micromechanical component enclosing a cavity, the micromechanical component including a sensor element situated in the cavity, and the micromechanical component including a getter situated in the cavity. The micromechanical component includes a structure, situated between the sensor element and the getter, which is designed in such a way that a particle that is desorbed by the getter is sorbed onto and/or into an area of the micromechanical component that is spaced apart from the sensor element.

First claim

What is claimed is:

1. A micromechanical component, the micromechanical component enclosing a cavity, the micromechanical component including a sensor element situated in the cavity, the micromechanical component including a getter situated in the cavity, wherein the micromechanical component includes a structure, situated between the sensor element and the getter, which is designed in such a way that a particle that is desorbed by the getter is sorbed on and/or in an area of the micromechanical component that is spaced apart from the sensor element.

2. The micromechanical component as recited in claim 1 , wherein the micromechanical component is designed in such a way that the particle is desorbed by the getter by introducing energy into an area of the micromechanical component that absorbs the energy.

3. The micromechanical component as recited in claim 1 , wherein the micromechanical component includes a transparent area situated between the getter and a surroundings of the micromechanical component, a degree of transmission of the transparent area for a wavelength interval and a wall thickness interval of the transparent area being greater than a degree of transmission threshold value.

4. The micromechanical component as recited in claim 1 , wherein the structure is situated between the getter and a cap of the micromechanical component.

5. The micromechanical component as recited in claim 1 , wherein a projection of the getter onto a main plane of extension of a substrate of the micromechanical component and a projection of the structure onto the main plane of extension overlap.

6. The micromechanical component as recited in claim 1 , wherein a projection of the getter onto a projection plane extending perpendicularly with respect to a main plane of extension of a substrate of the micromechanical component and a projection of the structure onto the projection plane overlap.

7. A method for setting an internal pressure in a cavity of a micromechanical component, the method comprising:
providing the micromechanical component, the micromechanical component including a sensor element situated in the cavity, the micromechanical component including a getter situated in the cavity, the micromechanical component including a structure situated between the sensor element and the getter;
desorbing, by the getter, a particle; and
sorbing the particle on and/or in an area of the micromechanical component that is spaced apart from the sensor element.

8. The method as recited in claim 7 , wherein the particle is desorbed by the getter by introducing energy into an area of the micromechanical component that absorbs the energy.

9. The method as recited in claim 7 , wherein the energy is introduced into the absorbing area via a transparent area of the micromechanical component situated between the getter and a surroundings of the micromechanical component.

10. A system, comprising:
a micromechanical component, the micromechanical component enclosing a cavity, the micromechanical component including a sensor element situated in the cavity, the micromechanical component including a getter situated in the cavity, wherein the micromechanical component includes a structure, situated between the sensor element and the getter, which is designed in such a way that a particle that is desorbed by the getter is sorbed on and/or in an area of the micromechanical component that is spaced apart from the sensor element; and
an energy source for introducing energy into an area of the micromechanical component that absorbs the energy.

Assignees

• Bosch Gmbh Robert

Inventors

• Guenther Sebastian
• Frey Tobias Sebastian

Classifications

• G01C19/5783

  Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719 · CPC title

• G01P15/0802

  Details · CPC title

• G01P2015/088

  for providing wafer-level encapsulation · CPC title

• G01P15/006

  by making use of fluid seismic masses · CPC title

• B81B2201/025

  Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242 · CPC title