Solder alloy, and LED module

Patent metadata

Field	Value
Publication number	US-10272527-B2
Application number	US-201515300929-A
Country	US
Kind code	B2
Filing date	Apr 2, 2015
Priority date	Apr 2, 2014
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.

First claim

The invention claimed is:

1. A solder alloy for use in a module in which a component and an Al substrate are bonded, the component having a main body made of ceramic and having a side-surface electrode with an area of not more than 30% of an entire area of a side surface, the solder alloy consisting of, by mass %: 0 to 4% of Ag; 0.3 to 1.2% of Cu; 3 to 10% of Sb, optionally not more than 0.15% in total of at least one element selected from Ni and Co, optionally not more than 0.1% in total of at least one element selected from P and Ge, and a balance of Sn.

2. The solder alloy according to claim 1 , comprising, by mass %, not more than 0.15% in total of at least one element selected from Ni and Co.

3. The solder alloy according to claim 2 , wherein a minimum shear stress is 15 MPa or higher.

4. The solder alloy according to claim 2 , further comprising, by mass %, not more than 0.1% in total of at least one element selected from P and Ge.

5. The solder alloy according to claim 4 , wherein a minimum shear stress is 15 MPa or higher.

6. The solder alloy according to claim 4 , wherein an average shear stress is 25 MPa or higher.

7. The solder alloy according to claim 6 , wherein a minimum shear stress is 15 MPa or higher.

8. The solder alloy according to claim 2 , wherein an average shear stress is 25 MPa or higher.

9. The solder alloy according to claim 8 , wherein a minimum shear stress is 15 MPa or higher.

10. The solder alloy according to claim 1 , comprising, by mass %, not more than 0.1% in total of at least one element selected from P and Ge.

11. The solder alloy according to claim 10 , wherein an average shear stress is 25 MPa or higher.

12. The solder alloy according to claim 11 , wherein a minimum shear stress is 15 MPa or higher.

13. The solder alloy according to claim 10 , wherein a minimum shear stress is 15 MPa or higher.

14. The solder alloy according to claim 1 , wherein an average shear stress is 25 MPa or higher.

15. The solder alloy according to claim 14 , wherein a minimum shear stress is 15 MPa or higher.

16. The solder alloy according to claim 1 , wherein a minimum shear stress is 15 MPa or higher.

17. The solder alloy according to claim 1 , wherein the component is an LED component.

18. An LED module in which an LED component having the solder alloy according to claim 1 is mounted.

19. An LED module in which an LED component and an Al substrate are bonded with the solder alloy according to claim 1 , the LED component having a ceramic substrate and a light emitting device disposed on the ceramic substrate, being cut at a through-hole via portion in the ceramic substrate after the light emitting device is molded, and having a side-surface electrode with an area of not more than 30% of an entire area of a side surface,
and the Al substrate having an insulation layer formed thereon and a Cu electrode formed on the insulation layer.

Assignees

• Senju Metal Industry Co

Inventors

• Ueshima Minoru
• Sakamoto Takeshi
• FUJIMAKI Rei

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/07236

  Soldering or alloying · CPC title