Substrate for camera module and camera module having the same

Patent metadata

Field	Value
Publication number	US-10270948-B2
Application number	US-201615370604-A
Country	US
Kind code	B2
Filing date	Dec 6, 2016
Priority date	Apr 11, 2016
Publication date	Apr 23, 2019
Grant date	Apr 23, 2019

Abstract

A substrate for a camera module includes: a first substrate; an image sensor installed on the first substrate and a memory chip installed to be embedded in the first substrate. The first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion, and at least a portion of the memory chip is disposed in an installation hole formed in the soft substrate portion.

First claim

What is claimed is:

1. A substrate for a camera module, the substrate comprising:
a first substrate;
an image sensor installed on the first substrate so as to be disposed below a lens; and
a memory chip embedded in the first substrate,
wherein the first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion,
at least a portion of the memory chip is disposed in an installation hole formed in the soft substrate portion,
the hard substrate portion disposed on the upper portion of the soft substrate portion includes a via for a connection with the memory chip, and
the memory chip includes a connection pad exposed to a top surface of the memory chip to be connected to the via.

2. The substrate for a camera module of claim 1 , wherein a mounting groove connecting the hard substrate portion disposed on the lower portion of the soft substrate portion to the hard substrate portion disposed on the upper portion of the soft substrate portion, through the soft substrate portion, is formed in the first substrate.

3. The substrate for a camera module of claim 2 , wherein a resin layer is formed in a space formed by the installation hole and the memory chip.

4. The substrate for a camera module of claim 1 , wherein a reinforcement plate is installed on a bottom surface of the first substrate.

5. A camera module comprising:
a lens barrel in which at least one lens is installed; and
the substrate for a camera module of claim 1 on which the lens barrel is installed and in which an image sensor is disposed below the lens.

Assignees

• Samsung Electro Mech

Inventors

• Lee Seung Eun
• Park Jin Seon
• Chung Yul Kyo
• Choi Chul
• Jung Dae Young
• Kook Seung Yeop

Classifications

• H10W42/284

  shielding resins · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title