Processing method and purification system

US10266789B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10266789-B2
Application numberUS-201615194906-A
CountryUS
Kind codeB2
Filing dateJun 28, 2016
Priority dateAug 11, 2015
Publication dateApr 23, 2019
Grant dateApr 23, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A processing method includes processing a metal wire rod using an emulsion lubricant that includes an oil and a nonionic surfactant at an oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio). The method may include purifying the emulsion lubricant after being used for processing the metal wire rod while maintaining the oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio) and then reusing the purified emulsion lubricant to process the metal wire rod.

First claim

Opening claim text (preview).

What is claimed is: 1. A processing method comprising: drawing a metal wire down to a diameter of 0.5 to 1.5 mm in a wire drawing machine, by using an emulsion lubricant comprising an oil and a nonionic surfactant at an oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 in mass ratio; purifying the emulsion lubricant after being used for drawing the metal wire while maintaining the oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio) to be free of a copper powder of not less than 5 μm, the purifying comprising settling and removing the copper powder of not less than 30 μm in size in the emulsion lubricant used to drawing the metal wire, and successively centrifuging to remove smaller copper powder than the already removed copper powder from the emulsion lubricant using a centrifugal filter; and returning the purified emulsion lubricant to the wire drawing machine. 2. The method according to claim 1 , wherein the metal wire rod comprises a copper or aluminum material having a diameter of not more than 8 mm. 3. A purification system, comprising: a settling tank for settling copper powder in an emulsion lubricant that has been used in a wire drawing machine for drawing a metal wire down to a diameter of 0.5 to 1.5 mm, the emulsion lubricant comprising an oil and a nonionic surfactant at an oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 in mass ratio, the settling tank settling and removing the copper powder of not less than 30 μm in size; an inlet-receiving tank that receives the emulsion lubricant after the settling of the copper powder of not less than 30 μm in size; and a centrifugal filter for removing smaller copper powder than the already removed copper powder from the emulsion lubricant that is transferred from the inlet-receiving tank, the smaller copper powder being not less than 5 μm, wherein the purification system maintains the oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio) after the emulsion lubricant passes through the centrifugal filter. 4. The purification system according to claim 3 , wherein the settling tank comprises a removal system for removing the settled copper powder to outside.

Assignees

Inventors

Classifications

  • Cooling, heating or lubricating drawing material (B21C3/14 takes precedence) · CPC title

  • by filtration and centrifugation processes; apparatus therefor · CPC title

  • Emulsions, colloids, or micelles · CPC title

  • Treatment of oils in a continuous lubricating circuit (e.g. motor oil system) · CPC title

  • Filtration systems specially adapted for cutting liquids (filtration in general B01D24/00 - B01D41/00) · CPC title

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What does patent US10266789B2 cover?
A processing method includes processing a metal wire rod using an emulsion lubricant that includes an oil and a nonionic surfactant at an oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio). The method may include purifying the emulsion lubricant after being used for processing the metal wire rod while maintaining the oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio)…
Who is the assignee on this patent?
Hitachi Metals Ltd
What technology area does this patent fall under?
Primary CPC classification C10M175/0058. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 23 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).