Microchip and film forming method for metal thin film of microchip
US-2016109356-A1 · Apr 21, 2016 · US
Microchip
US10261007B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10261007-B2 |
| Application number | US-201715408072-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 17, 2017 |
| Priority date | Jun 4, 2013 |
| Publication date | Apr 16, 2019 |
| Grant date | Apr 16, 2019 |
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Abstract
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Disclosed herein are a microchip provided with a titanium oxide film between a glass substrate and a metal thin film; and a method for forming the metal thin film and the titanium oxide film on the glass substrate of the microchip. The microchip has a second microchip substrate that has the metal thin film inside a channel, and the titanium oxide film, which has a low extinction coefficient, is provided as a buffer layer between the substrate and the metal thin film such as a gold film.
First claim
Opening claim text (preview).
What is claimed is: 1. A microchip comprising: a substrate made of glass on which metal thin film is formed; a channel formed in a space including the metal thin film; and a titanium oxide film provided between the substrate and the metal thin film, the titanium oxide film having a rutile type structure and an anatase type structure being mixed; the titanium oxide film contacting the substrate on one face of the titanium oxide film, and contacting the metal thin film with the other face of the titanium oxide film, and the titanium oxide film being bound to a surface of the substrate made of glass such that titanium ions of the titanium oxide film are directly covalent-bound to oxygen radicals cleaved and exposed from the surface of the substrate made of glass by UV excitation. 2. The microchip according to claim 1 , wherein the metal thin film is composed of any of gold (Au), platinum (Pt), rhodium (Rh), palladium (Pd), or palladium-platinum alloy (Pd—Pt alloy).
Assignees
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Classifications
the multilayer coating containing a metal layer · CPC title
Coatings of the type glass/inorganic compound/metal · CPC title
- C01G23/053Primary
Producing by wet processes, e.g. hydrolysing titanium salts · CPC title
by dipping, immersion · CPC title
Properties of coatings · CPC title
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Frequently asked questions
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- What does patent US10261007B2 cover?
- Disclosed herein are a microchip provided with a titanium oxide film between a glass substrate and a metal thin film; and a method for forming the metal thin film and the titanium oxide film on the glass substrate of the microchip. The microchip has a second microchip substrate that has the metal thin film inside a channel, and the titanium oxide film, which has a low extinction coefficient, is…
- Who is the assignee on this patent?
- Ushio Electric Inc
- What technology area does this patent fall under?
- Primary CPC classification C01G23/053. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Apr 16 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).