Comb MEMS device and method of making a comb MEMS device

US10259701B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10259701-B2
Application numberUS-201615345179-A
CountryUS
Kind codeB2
Filing dateNov 7, 2016
Priority dateJan 16, 2013
Publication dateApr 16, 2019
Grant dateApr 16, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A MEMS device and a method to manufacture a MEMS device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming conductive fingers by forming a conductive material in the trenches and forming an opening from a second main surface of the substrate thereby exposing the conductive fingers, the second main surface opposite the first main surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A MEMS device, comprising: a stator comprising a first set of fingers; a movable element comprising a second set of fingers at a first peripheral region of the movable element, wherein the first set of fingers and the second set of fingers are interdigitated; a first corrugation disposed in a second peripheral region of the movable element opposite the first peripheral region of the movable element, wherein the first corrugation is configured to increase a flexibility and mobility of the second peripheral region of the movable element; a second corrugation disposed in an interior region of the movable element between the second set of fingers and the first corrugation, wherein the second corrugation is configured to stiffen the interior region of the movable element, wherein the second corrugation comprises: a first plurality of corrugation lines having a major axis parallel to a major axis of the first corrugation; and a second plurality of corrugation lines having a major axis perpendicular to the major axis of the first corrugation; and an anti-sticking mechanism between the first set of fingers and the second set of fingers. 2. The MEMS device according to claim 1 , wherein the second set of fingers is disposed only on a first side of the movable element. 3. The MEMS device according to claim 1 , wherein the second set of fingers is disposed only on a first side and a second side of the movable element. 4. The MEMS device according to claim 1 , wherein the second set of fingers is disposed on all sides of the movable element or along a perimeter of the movable element. 5. The MEMS device according to claim 1 , wherein the first set of fingers and the second set of fingers comprise conductive fingers. 6. The MEMS device according to claim 5 , wherein the conductive fingers comprise polysilicon fingers. 7. The MEMS device according to claim 5 , wherein the conductive fingers comprise metallic fingers. 8. The MEMS device according to claim 1 , wherein the movable element comprises a cantilever. 9. The MEMS device according to claim 1 , wherein the anti-sticking mechanism comprises an anti-sticking coating. 10. The MEMS device according to claim 9 , wherein the anti-sticking coating comprises a hexamethyldisilazane (HDMS) or a self-assembling monolayer (SAM) based on octadecyltrichlorosilance (OTS) or perflourodecyltrichlorosilance (FDTS). 11. The MEMS device according to claim 1 , wherein the anti-sticking mechanism comprises an anti-sticking structure, the anti-sticking structure protruding out from at least one of the first set of fingers and the second set of fingers. 12. A MEMS device, comprising: a stator comprising a first set of fingers; and a deflectable element comprising a membrane layer having a first thickness, and a finger layer comprising a second set of fingers having a second thickness different from the first thickness, wherein the first set of fingers and the second set of fingers are interdigitated, wherein the membrane layer further comprises at least one first corrugation disposed in a peripheral region of the membrane layer, wherein the at least one first corrugation is configured to increase a flexibility and mobility of the membrane layer, wherein the membrane layer further comprises a second corrugation disposed in an interior region of the membrane layer between the second set of fingers and the at least one first corrugation, wherein the second corrugation is configured to stiffen the interior region of the membrane layer, wherein the second corrugation comprises a first plurality of corrugation lines having a major axis parallel to a major axis of the at least one first corrugation, and a second plurality of corrugation lines having a major axis perpendicular to the major axis of the at least one first corrugation. 13. The MEMS device according to claim 12 , wherein the second thickness is greater than the first thickness. 14. The MEMS device according to claim 12 , further comprising an anti-sticking mechanism disposed between facing walls the first set of fingers and the second set of fingers. 15. The MEMS device according to claim 12 , further comprising a support structure structurally coupled to the deflectable element. 16. The MEMS device according to claim 15 , further comprising an anchor coupled between the membrane layer and the support structure. 17. The MEMS device according to claim 15 , wherein the membrane layer of the deflectable element is in physical contact with the support structure. 18. A MEMS device, comprising: a first plurality of fingers protruding from a stator; a second plurality of fingers protruding from a first peripheral region of a membrane, wherein a thickness of the membrane is less than a thickness of the stator, wherein the first plurality of fingers and the second plurality of fingers are interdigitated, and wherein a first finger of the first plurality of fingers comprises a first face facing a second face of a second finger of the second plurality of fingers; a first corrugation disposed in a second peripheral region of the membrane opposite the first peripheral region of the membrane, wherein the first corrugation is configured to increase a flexibility and mobility of the membrane; a second corrugation disposed in an interior region of the membrane between the second plurality of fingers and the first corrugation, wherein the second corrugation is configured to stiffen the interior region of the membrane, wherein the second corrugation comprises: a first plurality of corrugation lines having a major axis parallel to a major axis of the first corrugation; and a second plurality of corrugation lines having a major axis perpendicular to the major axis of the first corrugation; and anti-sticking structures protruding from the first face of the first finger towards the second face of the second finger. 19. The MEMS device according to claim 18 , wherein the anti-sticking structures are not in physical contact with the second face of the second finger. 20. The MEMS device according to claim 18 , wherein the first plurality of fingers and the second plurality of fingers comprise silicon. 21. The MEMS device according to claim 18 , wherein the second plurality of fingers are configured to move relative to the first plurality of fingers in an axis substantially perpendicular to a normal of the first face. 22. The MEMS device according to claim 18 , wherein a thickness of the second finger is greater than the thickness of the membrane.

Assignees

Inventors

Classifications

  • Structures having a reduced contact area, e.g. with bumps or with a textured surface · CPC title

  • B81B3/0005Primary

    Anti-stiction coatings · CPC title

  • Cantilevers (switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244) · CPC title

  • Methods for breaking the stiction bond · CPC title

  • Microphones or microspeakers · CPC title

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What does patent US10259701B2 cover?
A MEMS device and a method to manufacture a MEMS device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming conductive fingers by forming a conductive material in the trenches and forming an opening from a second main surface of the substrate thereby exposing the conductive fingers, the second main surface opposite the first main surface.
Who is the assignee on this patent?
Infineon Technologies Ag
What technology area does this patent fall under?
Primary CPC classification B81B3/0005. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 16 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).