Printed circuit board and a method for producing a printed circuit board

Patent metadata

Field	Value
Publication number	US-10251276-B2
Application number	US-201715797542-A
Country	US
Kind code	B2
Filing date	Oct 30, 2017
Priority date	May 7, 2015
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

The disclosure relates to a printed circuit board for an electronic component. The printed circuit board includes: an electrically insulating substrate; a number of electrically conductive conductor tracks; and at least one sensor dome having a sensor head and having a carrier body for accommodating the sensor head. The carrier body is formed integrally with the substrate. The disclosure also relates to a method for producing the printed circuit board.

First claim

What is claimed is:

1. A printed circuit board for an electronic component, the printed circuit board comprising:
an unpopulated circuit board;
an electrically insulating substrate;
a foil comprising an anti-adhesion coating, the foil arranged within the electrically insulating substrate;
a number of electrically conductive conductor tracks; and
at least one sensor dome having:
a sensor head arranged within the electrically insulating substrate, wherein the sensor head is arranged above the foil in relation to a vertical axis relative to a surface side of the electrically insulating substrate; and
a carrier body supporting the sensor head, the carrier body formed integrally with the electrically insulating substrate, the carrier body is cut out with a predefined contour encompassing a section surrounding the sensor head from the electrically insulating substrate, at least a part of the carrier body remains integrally connected to the electrically insulating substrate,
wherein the cut-out carrier body with the sensor head is positioned in a direction of the vertical axis,
wherein the sensor dome is positioned such that the cut-out carrier body with the sensor head is moved in the direction of the vertical axis relative to the surface side; and

a cover encapsulating the sensor dome.

2. The printed circuit board of claim 1 , wherein the electrically insulating substrate is formed from a fiber-reinforced plastic.

3. The printed circuit board of claim 1 , wherein the carrier body projects perpendicularly from a surface side of the electrically insulating substrate.

4. The printed circuit board of claim 1 , wherein the sensor head is connected mechanically and in electrically conductive fashion to at least one conductor track.

5. A method for producing a printed circuit board having an electrically insulating substrate, a number of electrically conductive conductor tracks, and at least one sensor dome having a sensor head and having a carrier body for accommodating the sensor head, wherein the carrier body is formed integrally with the substrate, the method comprising:
integrally forming the carrier body of the sensor dome with the substrate of the printed circuit board by:
providing an unpopulated circuit board;
arranging a foil with an anti-adhesion coating within the electrically insulating substrate;
arranging the sensor head within the electrically insulating substrate, wherein the sensor head is arranged above the foil in relation to a vertical axis relative to a surface side of the electrically insulating substrate;
cutting out the carrier body with a predefined contour, which encompasses a section surrounding the sensor head;
positioning the sensor dome, wherein the cut-out carrier body with the sensor head is moved in a direction of the vertical axis relative to the surface side; and
encapsulating the sensor dome with a cover,

wherein the carrier body is cut out, with the predefined contour, from the electrically insulating substrate, wherein at least a part of the carrier body remains integrally connected to the electrically insulating substrate, and
wherein the cut-out carrier body is positioned with the sensor head in the direction of the vertical axis.

6. The method of claim 5 , wherein a penetration depth of a cutting tool for cutting out the carrier body is set in a manner dependent on a situation of the foil in the electrically insulating substrate.

Assignees

• Conti Temic Microelectronic Gmbh

Inventors

• Bock Johannes
• Schmidt Thomas
• Schuch Bernhard

Classifications

• H05K5/0082

  specially adapted for transmission control units, e.g. gearbox controllers · CPC title

• H05K2201/10166

  Transistor · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title

• H05K3/303

  with surface mounted components (H05K3/32 takes precedence) · CPC title

• H05K1/0278

  Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material · CPC title