Fan-out in ball grid array (BGA) package

Patent metadata

Field	Value
Publication number	US-10249596-B1
Application number	US-201615198253-A
Country	US
Kind code	B1
Filing date	Jun 30, 2016
Priority date	Jun 30, 2016
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

In some examples, a device includes at least two integrated circuits (ICs) and a first multi-chip module (MCM) substrate coupled to the at least two ICs, the first MCM substrate comprising a first ball grid array (BGA), wherein the first BGA comprises a first pitch indicative of a distance between balls of the first BGA. The device further includes a second MCM substrate coupled to the first MCM substrate with the first BGA, the second MCM substrate comprising a second BGA, wherein the second BGA comprises a second pitch indicative of a distance between balls of the second BGA, and wherein the second pitch is greater than the first pitch. The device further includes a printed circuit board (PCB) coupled to the second MCM substrate with the second BGA, wherein the first MCM substrate and the second MCM substrate comprise organic, non-silicon insulating material.

First claim

What is claimed is:

1. A device comprising:
a set of at least four integrated circuits (ICs);
a first multi-chip module (MCM) substrate comprising a communication link and a first ball grid array (BGA), wherein the first BGA comprises a first pitch indicative of a distance between balls of the first BGA, wherein each IC of the set of at least four ICs is coplanar mounted to a surface of the first MCM substrate, wherein the communication link couples a first IC of the set of at least four ICs to a second IC of the set of at least four ICs, and wherein the first MCM substrate comprises organic, non-silicon insulating material;
a second MCM substrate coupled to the first MCM substrate with the first BGA, the second MCM substrate comprising a second BGA, wherein the second BGA comprises a second pitch indicative of a distance between balls of the second BGA, wherein the second pitch is greater than the first pitch, and wherein the second MCM substrate comprises organic, non-silicon insulating material; and
a printed circuit board (PCB) coupled to the second MCM substrate with the second BGA.

2. The device of claim 1 , wherein the first IC is configured to:
transmit information to the second IC through the communication link; and
receive information from the second IC through the communication link.

3. The device of claim 1 , wherein:
the communication link comprises a first communication link;
the first MCM substrate comprises at least a second communication link that couples at least one of the first IC or the second IC to the second MCM substrate; and
the at least one of the first IC or the second IC is configured to:
transmit information to the second MCM substrate through the second communication link; and
receive information from the second MCM substrate through the second communication link.

4. The device of claim 3 ,
wherein the first IC is coupled to the second MCM substrate through the second communication link,
wherein the first MCM substrate further comprises:
a third communication link that couples the second IC to the second MCM substrate;
a fourth communication link that couples a third IC of the set of at least four ICs to the second MCM substrate; and
a fifth communication link that couples a fourth IC of the set of at least four ICs to the second MCM substrate.

5. The device of claim 1 , wherein a distance between a side of the first IC and an adjacent side of the second IC is more than ten millimeters.

6. The device of claim 1 , wherein each IC of the set of at least four ICs comprises a serializer-deserializer circuit.

7. The device of claim 1 , wherein the second pitch is greater than or equal to one millimeter.

8. The device of claim 1 , wherein the first pitch is less than or equal to five hundred micrometers.

9. The device of claim 1 , wherein a width of the second MCM substrate is greater than sixty-five millimeters.

10. The device of claim 1 , wherein a width of the first MCM substrate is less than sixty-five millimeters.

11. The device of claim 1 ,
wherein each IC of the set of at least four ICs is coupled to the first MCM substrate by at least one bump; and
wherein a diameter of the at least one bump is less than two hundred micrometers.

12. The device of claim 11 , wherein the at least one bump comprises a copper pillar.

13. The device of claim 1 , wherein the organic, non-silicon insulating material in the first MCM substrate and the organic, non-silicon insulating material in the second MCM substrate comprise epoxy resin and glass.

14. The device of claim 1 , wherein:
each IC of the set of at least four ICs includes a width of twenty millimeters, a length of twenty millimeters, and one-hundred and twenty-eight input-output contacts;
the first MCM substrate includes a width of fifty millimeters, a length of fifty millimeters, a first set of communications links that couple the set of at least four ICs, and a second set of communications links that couple the set of at least four ICs to the second MCM substrate, wherein the first set of communications links includes the first communication link;
the first pitch is five hundred micrometers;
the second MCM substrate includes a width of one hundred millimeters and a length of one hundred millimeters; and
the second pitch is one millimeter.

15. The device of claim 1 , wherein each IC of the set of at least four ICs is coupled to at least two other ICs of the set of at least four ICs through a first set of communication links in the first MCM substrate, the first set of communication links including the first communication link.

16. A method comprising:
electrically coupling a set of at least four integrated circuits (ICs) to a first multi-chip module (MCM) substrate comprising a communication link and a first ball grid array (BGA) at least in part by coplanar mounting each IC of the set of at least four ICs to a surface of the first MCM substrate, wherein the first BGA comprises a first pitch indicative of a distance between balls of the first BGA;
electrically coupling a first IC of the set of at least four ICs to a second IC of the set of at least four ICs through the communication link; and
electrically coupling the first MCM substrate to a second MCM substrate comprising a second BGA, wherein:
the second BGA comprises a second pitch indicative of a distance between balls of the second BGA,
the second pitch is greater than the first pitch,
the second MCM substrate is configured to be electrically coupled to a printed circuit board (PCB), and
the first MCM substrate and the second MCM substrate comprise organic, non-silicon insulating material.

17. The method of claim 16 , wherein:
a pitch of the second BGA is greater than or equal to one millimeter, and
a pitch of the first BGA is less than five hundred micrometers.

18. The method of claim 16 , wherein the organic, non-silicon insulating material in the first MCM substrate and the organic, non-silicon insulating material in the second MCM substrate comprise epoxy resin and glass.

19. The method of claim 16 , wherein electrically coupling the first IC to the second IC comprises:
electrically coupling the first IC to the communication link; and
electrically coupling the second IC to the communication link such that the first IC transmits information to and receives information from the second IC through the communication link.

20. A device comprising:
a first multi-chip module (MCM) substrate comprising:
first, second, third, fourth, fifth, sixth, seventh, and eighth communication links;
a first ball grid array (BGA) comprising a first pitch indicative of a distance between balls of the first BGA; and
organic, non-silicon insulating material;

a second MCM substrate coupled to the first MCM substrate with the first BGA, the second MCM substrate comprising a second BGA and organic, non-silicon insulating material, wherein the second BGA comprises a second pitch indicative of a distance between balls of the second BGA, and wherein the second pitch is greater than the first pitch;
a first integrated circuit (IC) coupled to the second MCM substrate through the fifth communication link;
a second IC coupled to the first IC through the first communication link and coupled to the second MCM substrate through the sixth communication link;
a third IC coupled to the second IC through the second communication link and coupled to the second MCM substrate through the seventh communication link;
a fourth IC coupled to the third IC through the t

Assignees

• Juniper Networks Inc

Inventors

• Kugel Valery
• Patel Bhavesh
• Sindhu Pradeep

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W70/69

  Insulating materials thereof · CPC title