Light-irradiation heat treatment apparatus

Patent metadata

Field	Value
Publication number	US-10249519-B2
Application number	US-201715420134-A
Country	US
Kind code	B2
Filing date	Jan 31, 2017
Priority date	Feb 24, 2016
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

A semiconductor wafer held by a holder within a chamber is irradiated and heated with halogen light emitted from multiple halogen lamps. A cylindrical louver made of opaque quartz and a light-shielding member of a ring shape having a cut-out portion are provided between the halogen lamps and the semiconductor wafer. When the semiconductor wafer is heated with the light emitted from the halogen lamps, a shadow region will appear in the semiconductor wafer as a result of the louver blocking off the emitted light. However, in the presence of the cut-out portion of the light-shielding member, the light emitted from the halogen lamps will reach the shadow region through the cut-out portion. This configuration allows the shadow region to be heated in the same manner as the other regions, and accordingly will help make uniform the in-plane temperature distribution of the semiconductor wafer during light irradiation heating.

First claim

What is claimed is:

1. A heat treatment apparatus for heating a disk-shaped substrate by irradiating the substrate with light, comprising:
a chamber that houses a substrate;
a holder that holds said substrate in said chamber;
a light irradiation part in which a plurality of rod-shaped lamps are arranged in a light source region that is larger than a major surface of said substrate held by said holder and that faces the major surface;
a cylindrical louver that is provided between said light irradiation part and said holder, with a central axis of said louver passing through a center of said substrate, and that is impervious to light emitted from said light irradiation part, and an outer diameter of said louver being smaller than said light source region; and
a light-shielding member that is provided between said light irradiation part and said holder and that is impervious to the light emitted from said light irradiation part,
wherein said light-shielding member has a cut-out portion that allows light to reach a region of said substrate that is shielded from the light emitted from said light irradiation part by said louver.

2. The heat treatment apparatus according to claim 1 , wherein
said light-shielding member includes:
a light-shielding ring having said cut-out portion; and
a light-shielding piece arranged inside said light-shielding ring.

3. A heat treatment apparatus for heating a disk-shaped substrate by irradiating the substrate with light, comprising:
a chamber that houses a substrate;
a holder that holds said substrate within said chamber;
a light irradiation part in which a plurality of rod-shaped lamps are arranged in a light source region that is larger than a major surface of said substrate held by said holder and that faces the major surface;
a cylindrical louver that is provided between said light irradiation part and said holder, with a central axis of said louver passing through a center of said substrate, and that is impervious to light emitted from said light irradiation part, and an outer diameter of said louver being smaller than said light source region; and
a light-shielding member that is provided between said light irradiation part and said holder and that is impervious to the light emitted from said light irradiation part,
wherein part of said light-shielding member is made of a transparent member to allows light to reach a region of said substrate that is shielded from the light emitted from said light irradiation part by said louver.

4. The heat treatment apparatus according to claim 3 , wherein
said part of said light-shielding member is made of transparent quartz, and a remaining part of said light-shielding member is made of opaque quartz.

Assignees

• Screen Holdings Co Ltd

Inventors

• Abe Makoto

Classifications

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H05B3/0047

  for semiconductor manufacture · CPC title

• H01L21/67115 Primary

  Electricity · mapped topic