Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-10249517-B2
Application number	US-201615172613-A
Country	US
Kind code	B2
Filing date	Jun 3, 2016
Priority date	Jun 15, 2015
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

A substrate processing apparatus has a labyrinth around a processing liquid nozzle above a nozzle gap, and a seal gas is supplied to the labyrinth to seal the nozzle gap from an external space. Consequently, the entry of the atmosphere of the external space into a processing space through the nozzle gap can be suppressed. An opposing-member flange part of a top plate has a first uneven part on the upper surface, and a holder body of an opposing-member moving mechanism has a second uneven part on the lower surface. The labyrinth is formed by raised portions of one of the first and second uneven parts being disposed within recessed portions of the other of the first and second uneven parts with a gap therebetween only when the top plate is located at a second position (i.e., the processing space is created). This achieves flattening of the substrate processing apparatus.

First claim

The invention claimed is:

1. A substrate processing apparatus for processing a substrate, comprising:
a substrate holder for holding a substrate in a horizontal position;
an opposing member that opposes an upper surface of said substrate and has an opposing-member opening in a central part;
an opposing-member moving mechanism for holding said opposing member and moving said opposing member relative to said substrate holder in an up-down direction between a first position and a second position that is below said first position;
a substrate rotation mechanism for rotating said substrate along with said substrate holder about a central axis pointing in said up-down direction;
a processing liquid nozzle for supplying a processing liquid to said upper surface of said substrate through said opposing-member opening; and
a gas supply part for supplying a treatment atmospheric gas to a space between said opposing member and said substrate,
wherein said opposing member includes:
an opposing-member body that opposes said upper surface of said substrate and has said opposing-member opening in the central part;
an opposing-member tubular part that has a tubular shape and protrudes upward from a periphery of said opposing-member opening of said opposing-member body and in which said processing liquid nozzle is inserted;
an opposing-member flange part that annularly extends radially outward from an upper end of said opposing-member tubular part and is held by said opposing-member moving mechanism; and
a first uneven part in which a recessed portion and a raised portion are alternately disposed concentrically on an upper surface of said opposing-member flange part,
said opposing-member moving mechanism includes:
a holder lower part that opposes a lower surface of said opposing-member flange part in said up-down direction;
a holder upper part that opposes said upper surface of said opposing-member flange part in said up-down direction; and
a second uneven part in which a recessed portion and a raised portion are alternately disposed concentrically on a lower surface of said holder upper part,
in a state in which said opposing member is located at said first position, said opposing-member flange part is supported from below by said holder lower part, and said opposing member is held by said opposing-member moving mechanism and spaced above said substrate holder, and
in a state in which said opposing member is located at said second position, said opposing member is spaced from said opposing-member moving mechanism, is held by said substrate holder, and is rotatable along with said substrate holder by said substrate rotation mechanism, a labyrinth is formed as a result of the raised portion of one of said first uneven part and said second uneven part being disposed within the recessed portion of the other of said first uneven part and said second uneven part with a gap therebetween, and a seal gas is supplied to said labyrinth to seal a nozzle gap from a space located on the radially outer side of said labyrinth, said nozzle gap being a space between said processing liquid nozzle and said opposing-member tubular part.

2. The substrate processing apparatus according to claim 1 , wherein
said holder upper part includes a peripheral jet opening for jetting said seal gas toward said labyrinth, between radially inner and outer ends of said labyrinth.

3. The substrate processing apparatus according to claim 2 , further comprising:
an annular manifold for temporarily storing said seal gas supplied from said seal gas supply part, between a seal gas supply part that is a supply source of said seal gas and said peripheral jet opening.

4. The substrate processing apparatus according to claim 2 , wherein
a surface of said labyrinth that opposes said peripheral jet opening is an inclined surface that is inclined downward outwardly in a radial direction.

5. The substrate processing apparatus according to claim 1 , wherein
said first uneven part includes a plurality of recessed portions, and
a radially innermost recessed portion among said plurality of recessed portions is provided in an upper portion of said opposing-member tubular part and is larger than the other recessed portions in said up-down direction.

6. The substrate processing apparatus according to claim 1 , wherein
said holder upper part includes a peripheral suction port for sucking a gas that is in said labyrinth in a radially outer end of said labyrinth.

7. The substrate processing apparatus according to claim 1 , wherein
said gas supply part causes said treatment atmospheric gas to be jetted diagonally downward from a side surface of said processing liquid nozzle toward said nozzle gap.

8. A substrate processing apparatus for processing a substrate, comprising:
a substrate holder for holding a substrate in a horizontal position;
a substrate rotation mechanism for rotating said substrate along with said substrate holder about a central axis pointing in an up-down direction;
an opposing member including an opposing-member body that opposes an upper surface of said substrate and has an opposing-member opening in a central part, and an opposing-member tubular part that has a tubular shape and protrudes upward from a periphery of said opposing-member opening of said opposing-member body;
a processing liquid nozzle inserted in said opposing-member tubular part and for supplying a processing liquid to said upper surface of said substrate through said opposing-member opening;
a gas supply part for supplying a treatment atmospheric gas to a space between said opposing member and said substrate;
a labyrinth that is contiguous with a nozzle gap and seals said nozzle gap from an external space as a result of a seal gas being supplied thereto, said nozzle gap being a space between said processing liquid nozzle and said opposing-member tubular part; and
a seal-gas flow rate controller for controlling a flow rate of said seal gas supplied to said labyrinth on the basis of a relative relationship between a pressure in said labyrinth and a pressure in said external space.

9. The substrate processing apparatus according to claim 8 , wherein
said relative relationship varies due to variations in pressure in said nozzle gap.

10. The substrate processing apparatus according to claim 9 , wherein
said gas supply part causes said treatment atmospheric gas to be jetted diagonally downward from a side surface of said processing liquid nozzle toward said nozzle gap, and
in a case where a flow rate of said treatment atmospheric gas jetted toward said nozzle gap varies, said seal-gas flow rate controller controls the flow rate of said seal gas on the basis of said variations in pressure in said nozzle gap that are caused by the variations in the flow rate of said treatment atmospheric gas.

11. The substrate processing apparatus according to claim 9 , wherein
in a case where a rotation speed of said substrate rotated by said substrate rotation mechanism varies, said seal-gas flow rate controller controls the flow rate of said seal gas on the basis of said variations in pressure in said nozzle gap that are caused by the variations in said rotation speed.

12. The substrate processing apparatus according to claim 9 , wherein
in a case where a type of processing performed on said substrate changes, said seal-gas flow rate controller controls the flow rate of said seal gas on the basis of said variations in pressure in said nozzle gap that are caused by the change in said type of processing.

13. The substrate processing apparatus according to claim 8 , further comprising:
a first pressure measuring part fo

Assignees

• Screen Holdings Co Ltd

Inventors

• Iwao Michinori
• Muramoto Ryo

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0424 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/04 Primary

  Apparatus for manufacture or treatment · CPC title

• H01L21/67051

  Electricity · mapped topic

• H01L21/6708 Primary

  Electricity · mapped topic