Underfill dispensing using funnels

Patent metadata

Field	Value
Publication number	US-10249516-B2
Application number	US-201715643700-A
Country	US
Kind code	B2
Filing date	Jul 7, 2017
Priority date	Mar 17, 2016
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate. The void-free layer of underfill material is cured to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.

First claim

The invention claimed is:

1. A method for underfilling an array of objects on a substrate, comprising:
forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate; and
curing the void-free layer of underfill material to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.

2. The method of claim 1 , further comprising filling funnel reservoirs with underfill material at multiple points on the substrate.

3. The method of claim 2 , wherein each funnel comprises a broad head configured to rest on neighboring objects and having a length configured to dispense underfill material to the layer of underfill material.

4. The method of claim 2 , wherein filling the funnel reservoirs comprises filling each funnel reservoir in sequence, such that underfill material continues to dispense from previously filled funnels while subsequent funnel reservoirs are being filled.

5. The method of claim 2 , wherein filling the funnel reservoirs comprises dispensing a predetermined volume of underfill material in to each respective funnel reservoir, said predetermined volume being sufficient to underfill neighboring objects without overflowing onto other layers.

6. The method of claim 1 , wherein the substrate is a wafer and the objects are laminates.

7. The method of claim 1 , wherein the substrate is a laminate and the objects are chips.

8. A multi-laminate wafer, comprising:
an array of a plurality of laminates individually bonded to a first layer of a wafer; and
a void-free layer of cured underfill material that completely fills a space between each of the plurality of laminates and the first layer.

9. The multi-laminate wafer of claim 8 , wherein the cured underfill material has a glass transition temperature of about 80° C., a coefficient of thermal expansion of about 35 ppm/° C., and a modulus of elasticity of about 7.2 GPa.

10. A multi-laminate wafer, comprising:
an array of a plurality of laminates individually bonded to a first layer of a wafer; and
a void-free layer of cured underfill material that completely fills a space between each of the plurality of laminates and the first layer and that does not extend between the plurality of laminates and one or more upper circuit layers.

11. The multi-laminate wafer of claim 10 , wherein the cured underfill material has a glass transition temperature of about 80° C., a coefficient of thermal expansion of about 35 ppm/° C., and a modulus of elasticity of about 7.2 GPa.

Assignees

• IBM

Inventors

• Colgan Evan George
• Gaynes Michael Anthony
• Sakuma Katsuyuki
• Merte Donald Alan

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012 Primary

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title

• H01L2924/15311

  Electricity · mapped topic