Underfill dispensing using funnels

Patent metadata

Field	Value
Publication number	US-9852960-B2
Application number	US-201615072957-A
Country	US
Kind code	B2
Filing date	Mar 17, 2016
Priority date	Mar 17, 2016
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate. The void-free layer of underfill material is cured to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.

First claim

The invention claimed is:

1. A method for underfilling an array of objects on a substrate, comprising:
forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate by dispensing underfill material at multiple points on the substrate at substantially the same time; and
curing the void-free layer of underfill material to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.

2. The method of claim 1 , wherein dispensing the underfill material at multiple points comprises filling a funnel reservoir with underfill material at each of the respective multiple points.

3. The method of claim 2 , wherein each funnel comprises a broad head configured to rest on neighboring objects and having a length configured to dispense underfill material to the layer of underfill material.

4. The method of claim 2 , wherein dispensing the underfill material at multiple points comprises filling each funnel reservoir in sequence, such that underfill material continues to dispense from previously filled funnels while subsequent funnel reservoirs are being filled.

5. The method of claim 2 , wherein filling each funnel reservoir comprises dispensing a predetermined volume of underfill material in to the respective funnel reservoir, said predetermined volume being sufficient to underfill neighboring objects without overflowing onto other layers.

6. The method of claim 1 , wherein the substrate is a wafer and the objects are laminates.

7. The method of claim 1 , wherein the substrate is a laminate and the objects are chips.

8. A system for underfilling an array of objects on a substrate, comprising:
a plurality of funnels disposed at multiple points of a substrate, each comprising a funnel reservoir; and
a dispenser configured to maneuver an underfill dispensing nozzle to each of the funnels in sequence and to dispense underfill material into each respective funnel reservoir.

9. The system of claim 8 , wherein each funnel comprises a broad head configured to rest on neighboring objects and having a length configured to dispense underfill material to the layer of underfill material.

10. The system of claim 8 , wherein the dispenser is configured to maneuver to a next funnel while a previous funnel continues to dispense underfill material.

11. The system of claim 8 , wherein the dispenser is configured to maneuver the underfill dispensing nozzle according to a predetermined pattern.

12. The system of claim 8 , wherein the dispenser is configured to dispense a predetermined volume of underfill material into each respective funnel reservoir, said predetermined volume being sufficient to underfill neighboring chips without overflowing onto other layers.

13. The system of claim 8 , wherein each funnel is placed at an intersection where corners of four objects leave an opening.

14. The system of claim 8 , wherein the underfill material has a glass transition temperature of about 80° C., a coefficient of thermal expansion of about 35 ppm/° C., and a modulus of elasticity of about 7.2 GPa when cured.

15. The system of claim 8 , further comprising a heater configured to cure the underfill material at about 135° C. for about six hours.

16. A multi-laminate wafer, comprising:
an array of a plurality of laminates individually bonded to a first layer of a wafer;
one or more second circuit layers bonded to the plurality of laminates; and
a void-free layer of cured underfill material that completely fills a space between each of the plurality of laminates and the first layer.

17. The multi-chip wafer of claim 16 , wherein the void-free layer of cured underfill material does not extend between the plurality of laminates and the one or more upper circuit layers.

18. The multi-chip wafer of claim 16 , wherein the cured underfill material has a glass transition temperature of about 80° C., a coefficient of thermal expansion of about 35 ppm/° C., and a modulus of elasticity of about 7.2 GPa.

Assignees

• IBM

Inventors

• Colgan Evan George
• Gaynes Michael Anthony
• Sakuma Katsuyuki
• Merte Donald Alan

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012 Primary

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title

• H01L21/563

  Electricity · mapped topic