Wiring board and temperature sensing element

Patent metadata

Field	Value
Publication number	US-10247620-B2
Application number	US-201515303915-A
Country	US
Kind code	B2
Filing date	Apr 20, 2015
Priority date	Apr 21, 2014
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

A wiring board includes an insulating substrate composed of a stack of a plurality of insulating layers, the insulating substrate having an upper face, a lower face, and side faces; and a plurality of line conductors formed of platinum or a metallic material comprising platinum as a main component, the plurality of line conductors each including a first end and a second end located on a side opposite to the first end, the plurality of line conductors being respectively disposed in interlayers between the plurality of insulating layers, in the line conductors, a line width of a line conductor located in an interlayer among the interlayers which interlayer is closest to the upper face or the lower face of the insulating substrate being greater than a line width of a line conductor located in each of the other interlayers.

First claim

The invention claimed is:

1. A wiring board, comprising:
an insulating substrate composed of a stack of a plurality of insulating layers, the insulating substrate having an upper face, a lower face, and side faces; and
a plurality of line conductors formed of platinum or a metallic material comprising platinum as a main component, the plurality of line conductors each including a first end and a second end located on a side opposite to the first end, the plurality of line conductors being respectively disposed in interlayers between the plurality of insulating layers,
in the line conductors, a line width of a line conductor located in an interlayer among the interlayers which interlayer is closest to the upper face or the lower face of the insulating substrate being greater than a line width of a line conductor located in each of the other interlayers.

2. A wiring board, comprising:
an insulating substrate composed of a stack of a plurality of insulating layers, the insulating substrate having an upper face, a lower face, and side faces; and
a line conductor formed of platinum or a metallic material comprising platinum as a main component, the line conductor including a first end and a second end located on a side opposite to the first end, the line conductor being disposed between the plurality of insulating layers in a pattern including at least one folded portion which faces a side face of the insulating substrate,
line widths of the at least one folded portion and a portion of the line conductor which faces the side face of the insulating substrate being greater than line widths of the other portions of the line conductor,
the line conductor having a meander-shaped pattern including a plurality of straight portions aligned in parallel to each other and a plurality of folded portions each connecting ends of adjacent straight portions among the plurality of straight portions, and within the meander-shaped pattern, line widths of a straight portion located on the outermost side and the plurality of folded portions being greater than line widths of the other straight portions.

3. The wiring board according to claim 1 , wherein the insulating substrate includes a plurality of insulating layers which are each composed of a ceramic sintered body and are stacked on one another, and the line conductor or the line conductors are composed of a thick film conductor.

4. The wiring board according to claim 3 , wherein the ceramic sintered body is an aluminum-oxide based sintered body, and among the plurality of insulating layers, a lower insulating layer is an aluminum oxide sintered body of higher purity than a purity of the aluminum oxide sintered body of the uppermost insulating layer.

5. The wiring board according to claim 2 , wherein the insulating layer has a quadrangular shape, and in the meander-shaped pattern, the straight portions and the folded portions are arranged in parallel to an outer periphery of the insulating layer.

6. The wiring board according to claim 1 , wherein one of the line conductors which is disposed in one interlayer among the interlayers, has a pattern including a folded portion which faces a side face of the insulating substrate, and line widths of the folded portion and a portion of the line conductor which faces the side face of the insulating substrate are greater than line widths of the other portions of the line conductor.

7. The wiring board according to claim 3 , wherein a granular insulating body enters at least a part of the line conductor in a thickness direction thereof.

8. The wiring board according to claim 7 , wherein the insulating body is composed of a ceramic particle.

9. The wiring board according to claim 8 , wherein the ceramic particles contain at least one selected from aluminum oxide, zirconium oxide, zirconium silicate, and magnesium oxide.

10. A temperature sensing element, comprising:
the wiring board according to claim 1 ; and
terminals electrically connected to the first end and the second end of the line conductor, respectively.

11. The wiring board according to claim 2 , wherein the insulating substrate includes a plurality of insulating layers which are each composed of a ceramic sintered body and are stacked on one another, and the line conductor or the line conductors are composed of a thick film conductor.

12. The wiring board according to claim 11 , wherein the ceramic sintered body is an aluminum-oxide based sintered body, and among the plurality of insulating layers, a lower insulating layer is an aluminum oxide sintered body of higher purity than a purity of the aluminum oxide sintered body of the uppermost insulating layer.

13. The wiring board according to claim 11 , wherein a granular insulating body enters at least a part of the line conductor in a thickness direction thereof.

14. The wiring board according to claim 13 , wherein the insulating body is composed of a ceramic particle.

15. The wiring board according to claim 14 , wherein the ceramic particles contain at least one selected from aluminum oxide, zirconium oxide, zirconium silicate, and magnesium oxide.

16. A temperature sensing element, comprising:
the wiring board according to claim 2 ; and
terminals electrically connected to the first end and the second end of the line conductor, respectively.

17. A wiring board, comprising:
an insulating substrate composed of a stack of a plurality of insulating layers, the insulating substrate having an upper face, a lower face, and side faces; and
a line conductor formed of platinum or a metallic material comprising platinum as a main component, the line conductor including a first end and a second end located on a side opposite to the first end, the line conductor being disposed between the plurality of insulating layers in a pattern including at least one folded portion which faces a side face of the insulating substrate,
line widths of the at least one folded portion and a portion of the line conductor which faces the side face of the insulating substrate being greater than line widths of the other portions of the line conductor,
the insulating substrate including a plurality of insulating layers which are each composed of a ceramic sintered body and are stacked on one another, and the line conductor or the line conductors being composed of a thick film conductor.

18. The wiring board according to claim 17 , wherein
the line conductor has a meander-shaped pattern including a plurality of straight portions aligned in parallel to each other and a plurality of folded portions each connecting ends of adjacent straight portions among the plurality of straight portions, and within the meander-shaped pattern, line widths of a straight portion located on the outermost side and the plurality of folded portions are greater than line widths of the other straight portions, and
the insulating layer has a quadrangular shape, and in the meander-shaped pattern, the straight portions and the folded portions are arranged in parallel to an outer periphery of the insulating layer.

19. The wiring board according to claim 17 , wherein the ceramic sintered body is an aluminum-oxide based sintered body, and among the plurality of insulating layers, a lower insulating layer is an aluminum oxide sintered body of higher purity than a purity of the aluminum oxide sintered body of the uppermost insulating layer.

20. The wiring board according to claim 17 , wherein a granular insulating body enters at least a part of the line conductor in a thickness direction thereof.

Assignees

• Kyocera Corp

Inventors

• Matsumoto Hiroshi
• Morioka Kengo
• Hirata Takahito

Classifications

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2201/10151

  Sensor · CPC title

• G01K7/20

  in a specially-adapted circuit, e.g. bridge circuit · CPC title

• G01K7/18 Primary

  the element being a linear resistance, e.g. platinum resistance thermometer (G01K7/26 takes precedence) · CPC title