Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces

Patent metadata

Field	Value
Publication number	US-10244623-B2
Application number	US-201615196280-A
Country	US
Kind code	B2
Filing date	Jun 29, 2016
Priority date	Dec 2, 2014
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

A method and apparatus for forming a circuit on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface of an object is described. An amount of electrically conductive material to form a circuit between two points on the object is determined. The determined amount of electrically conductive material is deposited on a first surface of a stretchable substrate. The stretchable substrate with the deposited electrically conductive material is applied to the object to form a circuit between two points on the object.

First claim

What is claimed is:

1. A system for electrically connecting uneven two-dimensional (2-D) or three-dimensional (3-D) surfaces of an object, comprising:
a printer;
a stretchable substrate comprising a first surface and a second surface;
a conductive material; and
the object, wherein
an amount of the conductive material required is based on a length between two points on a surface of the object,
the surface of the object includes at least an uneven surface,
the printer deposits the conductive material on the first surface of the stretchable substrate, and
the second surface of the stretchable substrate mates with the object.

2. The system of claim 1 , wherein the amount of the conductive material deposited is based on a calculated volume of the amount of the conductive material required to electrically connect the two points of the object.

3. The system of claim 1 , wherein the conductive material is a stretchable conductive material.

4. The system of claim 1 , wherein the conductive material forms a patterned circuit on the stretchable substrate.

5. The system of claim 4 , wherein the patterned circuit is a horseshoe patterned circuit.

6. The system of claim 1 , wherein the conductive material is conductive ink.

7. The system of claim 6 , wherein the conductive ink includes conductive particles.

8. The system of claim 1 , wherein the second surface of the stretchable substrate includes an adhesive material.

9. The system of claim 1 , wherein the printer is a 3-D printer and the 3-D printer further deposits the conductive material into a reservoir area within the stretchable substrate.

Assignees

• Flextronics Ap Llc

Inventors

• Mohammed Anwar
• Liu Weifeng
• Kurwa Murad

Classifications

• H05K1/0284 Primary

  Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014) · CPC title

• H05K3/0058

  Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence) · CPC title

• B29C65/72

  by combined operations {or combined techniques}, e.g. welding and stitching · CPC title

• H05K2201/0323

  Carbon · CPC title

• H05K3/20

  by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)} · CPC title