Negative photosensitive composition and pattern formation method

Patent metadata

Field	Value
Publication number	US-10241403-B2
Application number	US-201615546132-A
Country	US
Kind code	B2
Filing date	Mar 25, 2016
Priority date	Mar 26, 2015
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

A negative photosensitive composition including an epoxy group-containing resin; and a cationic polymerization initiator containing one or more types of the following cationic polymerization initiators: a compound represented by formula (b0-1) and a compound represented by formula (b0-2), and a cationic polymerization initiator which generates an acid having a pKa of −3 or more. In the formulae, R b01 to R b04 are each independently a fluorine atom or an aryl group which may have a substituent, R b05 is a fluorine atom or a fluorinated alkyl group which may have a substituent, a plurality of R b05 's may be the same as or different from each other, q is an integer of 1 or more, and Q q+ 's are each independently a q-valent organic cation.

First claim

The invention claimed is:

1. A negative photosensitive composition comprising:
an epoxy group-containing resin (A); and
a cationic polymerization initiator (B) which comprises at least one cationic polymerization initiator (B0) selected from the group consisting of compounds represented by general formula (b0-1) and compounds represented by general formula (b0-2), and a cationic polymerization initiator (B1) which generates an acid having a pKa of −3 or more,
wherein a ratio between the cationic polymerization initiator (B0) and the cationic polymerization initiator (B1) is 5 to 200 as a mass ratio represented by component (B0)/component (B1), and
the cationic polymerization initiator (B1) comprises at least one compound selected from the group consisting of compounds represented by general formula (b1-1′) and compounds represented by general formula (b1-2′):

wherein R b01 to R b04 are each independently a fluorine atom or an aryl group which may have a substituent, R b05 is a fluorine atom or a fluorinated alkyl group which may have a substituent, plural R b05 's may be the same as or different from each other, q is an integer of 1 or more, and Q q+ 's are each independently a q-valent organic cation; and

wherein R b11 and R b12 each are a cyclic group which may have a substituent other than a halogen atom, a chain alkyl group which may have a substituent other than a halogen atom, or a chain alkenyl group which may have a substituent other than a halogen atom, R 201 to R 203 each independently represent an aryl group which may have a substituent, a heteroaryl group, an alkyl group, or an alkenyl group, and R 201 to R 203 , may be bonded to each other to form a ring with the sulfur atom in the formula, provided that at least one of R 201 , R 202 , and R 203 is an organic group having 16 or more carbon atoms.

2. The negative photosensitive composition according to claim 1 , wherein the cation moiety of the cationic polymerization initiator (B1) is a cation represented by formula (ca-1-25), (ca-1-26), (ca-1-28), (ca-1-29), (ca-1-30), (ca-1-31), (ca-1-32), (ca-1-33), (ca-1-34), (ca-1-35), (ca-1-38), or (ca-1-46):

wherein R′ 211 is an alkyl group and R hal is a hydrogen atom or a halogen atom.

3. The negative photosensitive composition according to claim 1 ,
wherein the epoxy group-containing resin (A) comprises at least one resin selected from the group consisting of a novolac epoxy resin, a bisphenol A epoxy resin, and a bisphenol F epoxy resin.

4. A pattern formation method comprising:
forming a film on a support using the negative photosensitive composition according to claim 1 ;
selectively exposing the film; and
developing the exposed film to form a negative pattern.

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Imai Hirofumi
• Ando Tomoyuki

Classifications

• G03F7/0385

  using epoxidised novolak resin · CPC title

• G03F7/038 Primary

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/004

  Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title