Method for embossing of substrates

Patent metadata

Field	Value
Publication number	US-10239253-B2
Application number	US-201514717003-A
Country	US
Kind code	B2
Filing date	May 20, 2015
Priority date	Aug 22, 2009
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

A method for embossing a structure material on a substrate disposed within a device having side walls, a base plate and a cover that define a working space that is isolated from a surrounding environment. The method includes the steps of: a) moving the substrate using a first calibration means and aligning the substrate with an application means, b) applying the structure material to the substrate, c) moving the substrate using a second calibration means that is located at least partially in the working space wherein the substrate is disposed within the working space and is aligned with an embossing means that is located at least partially in the working space, and d) embossing the structure material on the substrate while the substrate is in the working space using the embossing means, wherein the working space has a defined atmosphere, before and during the step of embossing, without interruption.

First claim

Having described the invention, the following is claimed:

1. A method for applying a structure material to a substrate and embossing the structure material on the substrate, the applying and embossing being performed in an embossing device, the embossing device having side walls, a base plate, and a cover that define a working space that is isolated from a surrounding environment, the method comprising:
first calibrating and aligning the substrate with an application means of the embossing device, the first calibrating and aligning being performed within the embossing device by a calibrating means of the embossing device, the calibrating means being located at least partially in the working space of the embossing device,
performing one or more applications of the structure material to the first calibrated and aligned substrate while the first calibrated and aligned substrate is in the working space, the applications being performed using the application means,
second calibrating and aligning the first calibrated and aligned substrate with an embossing means of the embossing device, the embossing means being located at least partially in the working space of the embossing device, the second calibrating and aligning being performed within the embossing device by the calibrating means of the embossing device, the embossing means comprising an embossing die, one or more actuators that are individually position-controlled and/or force controlled, and one or more dynamometer cells respectively corresponding with the actuators, the dynamometer cells being configured to measure an embossing force applied by the actuators and/or respective positions of the actuators, and
performing one or more embossings of the structure material on the second calibrated and aligned substrate while the second calibrated and aligned substrate is in the working space, the performing the embossings comprising:
respectively operating the actuators to move the embossing die and apply the embossing force to the structure material and the second calibrated and aligned substrate via the embossing die;
respectively operating the dynamometer cells to measure the embossing force applied to the structure material by the actuators acting on the embossing die and/or the respective positions of the actuators,

wherein the working space has a defined atmosphere, before and during performing of the one or more embossings, without interruption,
wherein the application means includes at least one nozzle disposed in the working space and an actuator for moving the at least one nozzle in a direction perpendicular to the substrate, and
wherein an actuator rod of the actuator extends through the cover of the device.

2. A method as claimed in claim 1 , wherein the defined atmosphere is different than the surrounding environment that is isolated from the isolated working space.

3. A method as claimed in claim 1 , wherein the defined atmosphere has a gas pressure that is less than a gas pressure in the surrounding environment that is isolated from the working space.

4. A method as claimed in claim 1 , wherein the defined atmosphere is free of gases.

5. A method as claimed in claim 1 , wherein the defined atmosphere is a vacuum.

6. A method as claimed in claim 1 , wherein the performing the one or more applications of the structure material includes at least one of the following: pneumatic or thermal methods, a piezo method, a screen printing method, a spray method or a spin method.

7. A method as claimed in claim 1 , wherein the embossing means comprises an embossing die, and
wherein the performing of the one or more applications of the structure material comprises applying defined structure material units of the structure material to a top of the substrate at locations that correspond to cavities in the embossing die.

8. A method as claimed in claim 7 , wherein the locations at which the defined structure material units are placed have respective volumes that are 10% larger than volumes of the corresponding cavities in the embossing die.

9. A method as claimed in claim 1 , wherein after said performing of the one or more embossings, said method further comprising:
curing the structure material,
removing the embossing means from the substrate, and
etching the substrate using the structure material as an etching mask.

10. A method as claimed in claim 1 , wherein the first calibrating and aligning takes place within the isolated working space.

11. A method as claimed in claim 10 , wherein said first calibrating and aligning and the performing the one or more applications occur in an atmosphere that is different than the defined atmosphere of the working space before and during the performing of the one or more embossings.

12. A method as claimed in claim 10 , wherein a pressure in the working space during the first calibrating and aligning and the performing the one or more applications is greater than a pressure in the working space during the performing of the one or more embossings.

13. A method as claimed in claim 1 , further comprising:
curing the structure material after said performing of the one or more embossings, the cured structure material being configured to act as a functional layer or an etching mask that is configured to transfer a structure into the substrate.

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Lindner Friedrich Paul
• Glinsner Thomas
• Wimplinger Markus

Classifications

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title

• G03F7/0002

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• B29C2059/023

  Microembossing · CPC title

• B29C59/026 Primary

  of layered or coated substantially flat surfaces · CPC title

• B29C59/022

  characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor · CPC title