Magnetic field sensor integrated circuit with integral ferromagnetic material

Patent metadata

Field	Value
Publication number	US-10234513-B2
Application number	US-201213424618-A
Country	US
Kind code	B2
Filing date	Mar 20, 2012
Priority date	Mar 20, 2012
Publication date	Mar 19, 2019
Grant date	Mar 19, 2019

Abstract

A magnetic field sensor includes a lead frame, a semiconductor die supporting a magnetic field sensing element, a non-conductive mold material enclosing the die and a portion of the lead frame, a ferromagnetic mold material secured to the non-conductive mold material and a securing mechanism to securely engage the mold materials. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet. The ferromagnetic mold material may be tapered and includes a non-contiguous central region, as may be an aperture or may contain the non-conductive mold material or an overmold material. Further embodiments include die up, lead on chip, and flip-chip arrangements, wafer level techniques to form the concentrator or bias magnet, integrated components, such as capacitors, on the lead frame, and a bias magnet with one or more channels to facilitate overmolding.

First claim

What is claimed is:

1. A magnetic field sensor, comprising:
a lead frame comprising at least one die attach pad, an extension extending from a first side of the at least one die attach pad, and at least one lead extending from a second side of the at least one die attach pad substantially orthogonal to the first side of the at least one die attach pad;
a semiconductor die attached to a surface of the at least one die attach pad of the lead frame and comprising a magnetic field sensing element;
a non-conductive mold material comprising a thermoset and enclosing the semiconductor die, wherein the extension extends beyond the non-conductive mold material; and
a ferromagnetic mold material secured to a portion of the non-conductive mold material, wherein the ferromagnetic mold material is tapered from a first end proximate to the lead frame to a second end distal and spaced from the lead frame and wherein the ferromagnetic mold material is further secured to, and is in direct contact with the extension, wherein the extension comprises a bend enclosed by the non-conductive mold material and a barb extending from the bend at a non-zero angle from a plane parallel to the surface of the die attach pad to which the semiconductor die is attached into the ferromagnetic mold material to terminate in the ferromagnetic mold material, wherein the extension provides a securing mechanism for engaging the ferromagnetic mold material.

2. The magnetic field sensor of claim 1 wherein the ferromagnetic mold material comprises a hard ferromagnetic material to form a bias magnet.

3. The magnetic field sensor of claim 2 wherein the hard ferromagnetic material is selected from the group consisting of a ferrite, a SmCo alloy, a NdFeB alloy, a thermoplastic polymer with hard magnetic particles, or a thermoset polymer with hard magnetic particles.

4. The magnetic field sensor of claim 1 wherein the ferromagnetic mold material comprises a soft ferromagnetic material to form a concentrator.

5. The magnetic field sensor of claim 4 wherein the soft ferromagnetic material consists at least one of NiFe, Ni, a Ni alloy, steel, or ferrite.

6. The magnetic field sensor of claim 1 wherein the ferromagnetic mold material has a central aperture having a surface extending from the first end proximate to the lead frame to the second end distal and spaced from the lead frame, wherein the taper of the ferromagnetic mold material comprises the surface of the central aperture.

7. The magnetic field sensor of claim 6 wherein the ferromagnetic mold material forms a substantially D-shaped, O-shaped, U-shaped, or C-shaped structure.

8. The magnetic field sensor of claim 6 further comprising a third mold material entirely filling the central aperture of the ferromagnetic mold material, wherein the third mold material is comprised of a soft ferromagnetic material.

9. The magnetic field sensor of claim 1 further comprising a thermoset adhesive, wherein the ferromagnetic mold material is secured to the portion of the non-conductive mold material with the thermoset adhesive.

10. A magnetic field sensor comprising:
a lead frame comprising at least one die attach pad, an extension extending from a first side of the at least one die attach pad, and at least one lead extending from a second side of the at least one die attach pad substantially orthogonal to the first side of the at least one die attach pad;
a semiconductor die attached to a surface of the at least one die attach pad of the lead frame and comprising a magnetic field sensing element;
a non-conductive mold material comprising a thermoset and enclosing the semiconductor die, wherein the extension extends beyond the non-conductive mold material; and
a ferromagnetic mold material secured to a portion of the non-conductive mold material and secured to, and in direct contact with the extension, wherein the extension comprises a bend enclosed by the non-conductive mold material and a barb extending from the bend at a non-zero angle from a plane parallel to the surface of the die attach pad to which the semiconductor die is attached into the ferromagnetic mold material to terminate in the ferromagnetic mold material and provides a securing mechanism for engaging the ferromagnetic mold material, wherein the ferromagnetic mold material has a central aperture extending from a first end proximate to the lead frame to a second end distal and spaced from the lead frame.

11. The magnetic field sensor of claim 10 wherein the ferromagnetic mold material is a hard ferromagnetic material.

12. The magnetic field sensor of claim 11 wherein the hard ferromagnetic material is selected from the group consisting of a ferrite, a SmCo alloy, a NdFeB alloy, a thermoplastic polymer with hard magnetic particles, or a thermoset polymer with hard magnetic particles.

13. The magnetic field sensor of claim 11 further comprising a third mold material entirely filling the central aperture of the ferromagnetic mold material, wherein the third mold material is comprised of a soft ferromagnetic material.

14. The magnetic field sensor of claim 6 wherein the taper of the ferromagnetic mold material comprising the surface of the central aperture comprises a first taper of the ferromagnetic mold material and wherein the ferromagnetic mold material further comprises a second taper, and wherein the second taper of the ferromagnetic mold material is linear and comprises an outer circumferential surface of the ferromagnetic mold material extending from the first end proximate to the lead frame to the second end distal and spaced from the lead frame, wherein the outer circumferential surface of the ferromagnetic mold material is distal from the central aperture.

Assignees

• Vig Ravi
• Taylor William P
• Friedrich Andreas P
• David Paul
• Lo Marie Adelaide
• Burdette Eric
• Shoemaker Eric
• Doogue Michael C
• Allegro Microsystems Llc

Inventors

• Vig Ravi
• Taylor William P
• Friedrich Andreas P
• David Paul
• Lo Marie-Adelaide
• Burdette Eric
• Shoemaker Eric
• Doogue Michael C

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/865

  Die-attach connectors and bond wires · CPC title

• G01B7/30

  for measuring angles or tapers; for testing the alignment of axes · CPC title

• G01R33/0047 Primary

  Housings or packaging of magnetic sensors (packaging of semiconductor devices H10W99/00); Holders · CPC title

• G01R33/0011

  comprising means, e.g. flux concentrators, flux guides, for guiding or concentrating the magnetic flux, e.g. to the magnetic sensor · CPC title