Method of manufacturing a sensor

Patent metadata

Field	Value
Publication number	US-9266267-B2
Application number	US-201313780731-A
Country	US
Kind code	B2
Filing date	Feb 28, 2013
Priority date	Oct 2, 2008
Publication date	Feb 23, 2016
Grant date	Feb 23, 2016

Abstract

A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

First claim

What is claimed:

1. A method for manufacturing a sensor comprising:
at least partially encapsulating a sensor element using a first encapsulation molding process to form a sensor housing;
coupling the sensor element to a support element; and
at least partially encapsulating the sensor housing and the support element together using a second encapsulation molding process.

2. The method of claim 1 , wherein the coupling further comprises connecting the sensor element to the support element using a holding device of the sensor element.

3. The method of claim 2 , wherein the coupling further comprises holding the holding device of the sensor element using at least one clamping device of the support element.

4. The method of claim 2 , wherein the coupling further comprises embracing the holding device from an outside of the holding device.

5. The method of claim 1 , wherein the coupling occurs before the encapsulating of the sensor housing and the support element.

6. The method of claim 1 , further comprising positioning the support element in an injection molding tool using at least one positioning element after the coupling of the sensor element to the support element.

Assignees

• Continental Teves Ag & Co Ohg

Inventors

• De Volder Edmond
• Huber Dietmar
• Doering Andreas
• Schillinger Jakob
• Watzlawik Martin
• Biebricher Lothar

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title