Transducer array subdicing

Patent metadata

Field	Value
Publication number	US-10233076-B2
Application number	US-201615154896-A
Country	US
Kind code	B2
Filing date	May 13, 2016
Priority date	May 20, 2015
Publication date	Mar 19, 2019
Grant date	Mar 19, 2019

Abstract

Systems and techniques are provided for transducer array subdicing. A laminate material may include two laminate material flexures which each have a flexure boundary defined by a gap in the piece of laminate material. A trench may be located between the two flexures. The trench may be defined by a removal of a portion of laminate material from the piece of laminate material. A second trench may be on an opposite surface of the piece of laminate material from the trench. The second trench may be partially aligned with the trench. The trench and the second trench may result from the removal of laminate material from the piece of laminate material to a depth of 20% to 60% of the thickness of the piece of laminate material.

First claim

The invention claimed is:

1. A substrate comprising:
two or more cavities in a material of the substrate;
a trench disposed in between two of the two or more cavities, the trench comprising removal of a portion of the material of the substrate from the substrate; and
a second trench, the second trench on an opposite surface of the substrate material from the trench.

2. The substrate of claim 1 , wherein the second trench is at least partially aligned with the trench.

3. The substrate of claim 2 , wherein the trench and the second trench each comprise a removal of material from the substrate to a depth of 20% to 60% of the thickness of the substrate, and wherein a total removal of material from the substrate in an area where the trench and the second trench are aligned is to a depth of less than 100% of the thickness of the substrate.

4. The substrate of claim 3 , wherein a portion of the substrate with a thickness at least 20% of the thickness of the substrate remains disposed between the trench and the second trench.

5. The substrate of claim 1 , wherein the trench comprises a removal of material from the substrate to a depth of 100% of the thickness of the substrate.

6. The substrate of claim 1 , further comprising a plurality of additional trenches, each of the plurality of additional trenches disposed on the substrate between at least two of the two or more cavities.

7. The substrate of claim 6 , wherein the trench and the plurality of additional trenches form a subdicing pattern on a first surface of the substrate.

8. The substrate of claim 7 , wherein the subdicing pattern comprises trenches forming a disconnected square around each of the two or more cavities of substrate that is not at an edge of the substrate.

9. The substrate of claim 8 , wherein the subdicing pattern further comprises trenches forming cross patterns at the corners of the disconnected squares.

10. The substrate of claim 7 , wherein a second plurality of additional trenches form the subdicing pattern on a second surface of the substrate on the opposite side of the substrate from the first surface.

11. The substrate of claim 1 , further comprising an electromechanically active device disposed in each of the two or more cavities, each electromechanically active device attached to the substrate.

12. The substrate of claim 11 , wherein each cavity and electromechanically active device form an ultrasonic transducer.

13. The substrate of claim 1 , wherein the substrate comprises material for a layer of printed circuit board (PCB).

14. The substrate of claim 1 , wherein the substrate comprises a component of a transducer array.

Assignees

• Ubeam Inc

Inventors

• Joyce Andrew

Classifications

• H01L41/338

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