Method for making housing

US10230158B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10230158-B2
Application numberUS-201715658488-A
CountryUS
Kind codeB2
Filing dateJul 25, 2017
Priority dateDec 31, 2014
Publication dateMar 12, 2019
Grant dateMar 12, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of making a housing includes providing a substrate having an opening, providing a plurality of metal sheets, providing a plurality of non-conductive members, and bonding the metal sheets together through the non-conductive members, forming a metal sheets member, placing the metal sheets member in the opening, bonding the metal sheets member with the substrate through the non-conductive members, and removing excess parts of the substrate to form the housing.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of making a housing comprising: providing a substrate having an opening; providing a plurality of metal sheets; providing a plurality of non-conductive members, and forming a metal sheets member by bonding the metal sheets together through some of the plurality of non-conductive members; and placing the metal sheets member in the opening, forming the housing by bonding the metal sheets member with the substrate through other of the plurality of non-conductive members. 2. The method as claimed in claim 1 , wherein the substrate has two main bases, one end of each of the two main bases has a lateral surface, each of the plurality of metal sheets has two opposite lateral surfaces, a plurality of holes is formed on the two opposite lateral surfaces of the main bases and the plurality of metal sheets through a surface treatment, a plurality of ribs engaged in the plurality of holes is formed by filling an adhesive in the plurality of holes. 3. The method as claimed in claim 1 , wherein each of the plurality of non-conductive members includes an insulative member and two adhesive layers formed on two opposite sides of the insulative member, each lateral surface of each of the plurality of metal sheets is coated with the adhesive, the insulative members are respectively positioned between two adjacent ones of the plurality of metal sheets coated with the adhesive, such that the insulative members bond with the metal sheets, forming the metal sheets member. 4. The method as claimed in claim 1 , wherein one lateral surface of each of the plurality of metal sheets is coated with the adhesive, the insulative members respectively bond with the lateral surfaces of the plurality of metal sheets through the adhesive, the metal sheets member is formed by each of the plurality of metal sheets coated with the insulative member bonding with one lateral surface of the metal sheet uncoated with the insulative member through the adhesive. 5. The method as claimed in claim 2 , wherein each the plurality of holes has a diameter of 1 nm to 1 mm. 6. The method as claimed in claim 3 , wherein each of the plurality of non-conductive members has a width of 0.2 mm to 1.0 mm. 7. The method as claimed in claim 3 , wherein each metal sheet has a width of 0.1 mm to 1.0 mm.

Assignees

Inventors

Classifications

  • comprising a metallic grid · CPC title

  • H01Q1/243Primary

    with built-in antennas · CPC title

Patent family

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Frequently asked questions

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What does patent US10230158B2 cover?
A method of making a housing includes providing a substrate having an opening, providing a plurality of metal sheets, providing a plurality of non-conductive members, and bonding the metal sheets together through the non-conductive members, forming a metal sheets member, placing the metal sheets member in the opening, bonding the metal sheets member with the substrate through the non-conductive…
Who is the assignee on this patent?
Shenzhen Futaihong Prec Ind Co, Fih Hong Kong Ltd
What technology area does this patent fall under?
Primary CPC classification H01Q1/243. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 10 related publications on this page (citations in our corpus or others sharing the same primary CPC).