Housing, electronic device using same, and method for making same

Patent metadata

Field	Value
Publication number	US-2016185067-A1
Application number	US-201514692217-A
Country	US
Kind code	A1
Filing date	Apr 21, 2015
Priority date	Dec 31, 2014
Publication date	Jun 30, 2016
Grant date	—

Abstract

A housing includes a substrate having an opening, a plurality of metal sheets and a plurality of non-conductive members, the metal sheets are bonded with each other through non-conductive members, forming a metal sheets member, the metal sheets member is located in the opening, the metal sheets member is bonded with substrate through the non-conductive members.

First claim

What is claimed is:

1 . A housing comprising:
a substrate having an opening; a plurality of non-conductive members; and a plurality of metal sheets bonded with each other through the non-conductive members, forming a metal sheets member, the metal sheets member being located in the opening and bonded with the substrate through the non-conductive members.

2 . The housing as claimed in claim 1 , wherein the substrate is separated by the opening, forming at least two main bases, the main bases are separated from each other.

3 . The housing as claimed in claim 1 , wherein surfaces of the metal sheets and surfaces of the main bases bonded with the non-conductive members all have a plurality of holes, surfaces of the non-conductive members bonded with the metal sheets and the main bases have a plurality of ribs, the ribs are engaged in the holes.

4 . The housing as claimed in claim 3 , wherein the holes have a diameter of about 1 nm to about 1 mm.

5 . The housing as claimed in claim 1 , wherein each non-conductive member has an insulative member and two adhesive layers formed on two opposite sides of the insulative member.

6 . The housing as claimed in claim 1 , wherein each non-conductive member has an adhesive layer located between each two adjacent metal sheets, and between each main base and one metal sheets adjacent to the main base.

7 . The housing as claimed in claim 1 , wherein each non-conductive member has a width of about 0.2 mm to about 1.0 mm along a direction from an adjacent non-conductive member located at one side of metal sheet to another adjacent non-conductive member located at an opposite side of the metal sheet.

8 . The housing as claimed in claim 1 , wherein each metal sheet has a width of about 0.1 mm to about 1.0 mm along a direction from an adjacent non-conductive member located at one side of metal sheet to another adjacent non-conductive member located at an opposite side of the metal sheet.

9 . A method of making a housing comprising:
providing a substrate having an opening; providing a plurality of metal sheets; providing a plurality of non-conductive members, and bonding the metal sheets together through the non-conductive members, forming a metal sheets member; placing the metal sheets member in the opening, bonding the metal sheets member with the substrate through non-conductive members; and removing useless parts of the substrate, forming the housing.

10 . The method as claimed in claim 9 , wherein the substrate has two main bases, one end of each main base has a lateral surface, each metal sheet has two opposite lateral surfaces, a plurality of holes are formed on the lateral surfaces of the main bases and the metal sheets through a surface treatment, the adhesive is filled in the holes, such forming a plurality of ribs, the ribs are engaged in the holes.

11 . The method as claimed in claim 9 , wherein each non-conductive member includes an insulative member and two adhesive layers formed on two opposite sides of the insulative member, each lateral surface of the metal sheet are coated with the adhesive, the insulative members are respectively positioned between two adjacent metal sheets coated with the adhesive, such that the insulative members bond with the metal sheets, forming the metal sheets member.

12 . The method as claimed in claim 9 , wherein one lateral surface of each metal sheet is coated with the adhesive, the insulative members respectively bond with the lateral surfaces of the metal sheets through the adhesive, each metal sheet coated with the insulative member bond with one lateral surface of the metal sheet uncoated with the insulative member through adhesive, forming the metal sheets member.

13 . An electronic device, comprising:
a body; a housing assembled to the body comprising:
a substrate having an opening;
a plurality of non-conductive members; and
a plurality of metal sheets bonded with each other through the non-conductive members, forming a metal sheets member, the metal sheets member being located in the opening and bonded with the substrate through the non-conductive members; and
an antenna located inside the body, the metal sheets member aligning with the antenna.

14 . The electronic device as claimed in claim 13 , wherein the substrate is separated by the opening, forming at least two main bases, the main bases are separated from each other.

15 . The electronic device as claimed in claim 13 , wherein surfaces of the metal sheets and surfaces of the main bases bonded with the non-conductive members all have a plurality of holes, surfaces of the non-conductive members bonded with the metal sheets and the main bases have a plurality of ribs, the ribs are engaged in the holes.

16 . The electronic device as claimed in claim 15 , wherein the holes have a diameter of about 1 nm to about 1 mm.

17 . The electronic device as claimed in claim 13 , wherein each non-conductive member has an insulative member and two adhesive layers formed on two opposite sides of the insulative member.

18 . The electronic device as claimed in claim 13 , wherein each non-conductive member has an adhesive layer located between each two adjacent metal sheets, and between each main base and one metal sheets adjacent to the main base.

19 . The electronic device as claimed in claim 13 , wherein each non-conductive member has a width of about 0.2 mm to about 1.0 mm along a direction from an adjacent non-conductive member located at one side of metal sheet to another adjacent non-conductive member located at an opposite side of the metal sheet.

20 . The electronic device as claimed in claim 13 , wherein each metal sheet has a width of about 0.1 mm to about 1.0 mm along a direction from an adjacent non-conductive member located at one side of metal sheet to another adjacent non-conductive member located at an opposite side of the metal sheet.

Assignees

• Shenzhen Futaihong Prec Ind Co
• Fih Hong Kong Ltd

Inventors

• Chen Wei-Ben
• Liu Min
• Lin Chao-Hsun
• Lan Chao

Classifications

• B32B2311/00

  Metals, their alloys or their compounds · CPC title

• B32B3/266

  characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12 · CPC title

• B32B1/02 Primary

  Operations & Transport · mapped topic

• B32B15/043

  of metal (B32B15/01 takes precedence) · CPC title

• B32B2255/06

  on metal layer · CPC title