Semiconductor device with a resistance element and an electrostatic protection element

Patent metadata

Field	Value
Publication number	US-10229903-B2
Application number	US-201715635441-A
Country	US
Kind code	B2
Filing date	Jun 28, 2017
Priority date	Sep 14, 2016
Publication date	Mar 12, 2019
Grant date	Mar 12, 2019

Abstract

In a semiconductor device including a resistance element, an electrostatic protection element, including a parasitic bipolar transistor having the resistance element as a component, is provided. That is, instead of providing a dedicated electrostatic protection element in a semiconductor device, a function as an electrostatic protection element is also achieved by using a resistance element provided in a semiconductor device.

First claim

What is claimed is:

1. A semiconductor device comprising:
a semiconductor substrate of a first conductivity type;
an epitaxial layer of a second conductivity type opposite to the first conductivity type;
a resistance region of the first conductivity type formed in the epitaxial layer;
a buried semiconductor region of the second conductivity type that is formed across a boundary between the semiconductor substrate and the epitaxial layer and has a higher impurity concentration than the epitaxial layer;
a first semiconductor region of the second conductivity type that is in direct contact with the buried semiconductor region, reaches the surface of the epitaxial layer, is electrically coupled to the resistance region, and has a higher impurity concentration than the epitaxial layer; and
an isolated semiconductor region of the first conductivity type that is formed to be spaced apart from the buried semiconductor region and is in contact with the semiconductor substrate,
wherein the resistance region extends in a first direction in plan view, and
wherein the first semiconductor region includes:
a first portion extending, in plan view, in the first direction; and
a second portion extending, in plan view, in the first direction in parallel with the first portion, and
wherein the resistance region is interposed, in plan view, between the first portion of the first semiconductor region and the second portion of the first semiconductor region.

2. The semiconductor device according to claim 1 , having:
a function as a resistance element; and
a function as an electrostatic protection element.

3. The semiconductor device according to claim 2 ,
wherein the resistance element includes the resistance region, and
wherein the electrostatic protection element includes:
a parasitic bipolar transistor having:
the resistance region as an emitter;
the epitaxial layer and the buried semiconductor region as a base; and
the semiconductor substrate as a collector.

4. The semiconductor device according to claim 1 , further comprising:
an interlayer insulating film that covers the epitaxial layer;
a first plug that penetrates the interlayer insulating film to reach the resistance region;
a second plug that penetrates the interlayer insulating film to reach the first semiconductor region; and
a wiring that is formed over the interlayer insulating film and is electrically coupled to the first plug and the second plug.

5. The semiconductor device according to claim 1 ,
wherein the resistance region extends in a first direction in plan view, and
wherein the first semiconductor region extends, in plan view, in the first direction in parallel with the resistance region.

6. The semiconductor device according to claim 1 ,
wherein the resistance region and the first semiconductor region are arranged in a straight line in plan view.

7. The semiconductor device according to claim 1 ,
wherein the isolated semiconductor region surrounds the buried semiconductor region in plan view.

8. The semiconductor device according to claim 7 ,
wherein, in section view, a first distance between one end portion of the buried semiconductor region and the isolated semiconductor region and a second distance between the other end portion of the buried semiconductor region and the isolated semiconductor region are equal to each other.

9. The semiconductor device according to claim 7 ,
wherein, in section view, the first distance between the one end portion of the buried semiconductor region and the isolated semiconductor region is smaller than the second distance between the other end portion of the buried semiconductor region and the isolated semiconductor region.

10. The semiconductor device according to claim 1 , comprising:
an input terminal; and
an input transistor electrically coupled to the input terminal,
wherein the one end portion of the resistance region is electrically coupled to the input terminal, and
wherein the other end portion of the resistance region is electrically coupled to the input transistor.

11. The semiconductor device according to claim 1 ,
wherein the resistance region functions also as a component of a low-pass filter.

12. The semiconductor device according to claim 1 ,
wherein the first conductivity type is a p-type, and
wherein the second conductivity type is an n-type.

13. A semiconductor device comprising:
a semiconductor substrate;
an epitaxial layer formed over the semiconductor substrate;
a resistance element including a semiconductor region formed in the epitaxial layer; and
an electrostatic protection element including a bipolar transistor having the semiconductor region as a component;
a high concentration semiconductor region that is formed in the epitaxial layer, has an impurity concentration higher than that of the epitaxial layer, is electrically coupled to the resistance element, and has a conductivity type opposite to that of the semiconductor region; and
a first semiconductor region that is in direct contact with the high concentration region, reaches the surface of the epitaxial layer, and is electrically coupled to the resistance element, and has a higher impurity concentration than the epitaxial layer,
wherein the bipolar transistor includes:
the resistance element that functions as an emitter;
the high concentration semiconductor region that functions as a base; and
the semiconductor substrate that functions as a collector,
wherein the first semiconductor region includes:
a first portion extending, in plan view, in the first direction; and
a second portion extending, in plan view, in the first direction in parallel with the first portion,
wherein the resistance element is interposed, in plan view, between the first portion of the first semiconductor region and the second portion of the first semiconductor region, and
wherein the first portion of the first semiconductor region and the second portion of the first semiconductor region are separated from one another in a second direction perpendicular to the first direction in the plan view.

14. The semiconductor device according to claim 13 , further comprising:
an isolated semiconductor region that surrounds the high concentration semiconductor region in plan view, is electrically coupled to the semiconductor substrate, and has the same conductivity type as that of the semiconductor substrate.

15. A semiconductor device comprising:
a semiconductor substrate of a first conductivity type;
an epitaxial layer of a second conductivity type opposite to the first conductivity type;
a resistance region of the first conductivity type formed in the epitaxial layer;
a buried semiconductor region of the second conductivity type that is formed across a boundary between the semiconductor substrate and the epitaxial layer and has a higher impurity concentration than the epitaxial layer;
a first semiconductor region of the second conductivity type that is in direct contact with the buried semiconductor region, reaches the surface of the epitaxial layer, is electrically coupled to the resistance region, and has a higher impurity concentration than the epitaxial layer; and
an isolated semiconductor region of the first conductivity type that is formed to be spaced apart from the buried semiconductor region and is in contact with the semiconductor substrate,
wherein the resistance region extends in a first direction in plan view, and
wherein the first semiconductor region includes:
a first portion extending, in plan view, in the first direction; and
a second portion extending, in plan view,

Assignees

• Renesas Electronics Corp

Inventors

• Kodama Eisuke

Classifications

• H10W20/20

  Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] · CPC title

• H01L27/0288

  Electricity · mapped topic

• H01L27/0772

  Electricity · mapped topic

• H01L23/535

  Electricity · mapped topic

• H01L27/0248 Primary

  Electricity · mapped topic