All-tungsten scheme for source/drain contact, source/drain via, and gate via
US-2024395618-A1 · Nov 28, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/535 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 4,802 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 76 |
| 2016 | 333 |
| 2017 | 548 |
| 2018 | 583 |
| 2019 | 577 |
| 2020 | 471 |
| 2021 | 405 |
| 2022 | 475 |
| 2023 | 461 |
| 2024 | 427 |
| 2025 | 363 |
| 2026 | 83 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Field effect transistor with contact via structures that are laterally spaced by a sub-lithographic distance and method of making the same
US-2024063062-A1 · Feb 22, 2024 · US
Self-aligned metal gate for multigate device and method of forming thereof
US-2024030066-A1 · Jan 25, 2024 · US
High voltage resistor with high voltage junction termination
US-2024014260-A1 · Jan 11, 2024 · US
Semiconductor device and method of fabricating the same
US-2015380354-A1 · Dec 31, 2015 · US
Semiconductor contacts and methods of fabrication
US-2015380250-A1 · Dec 31, 2015 · US
Metal-insulator-semiconductor (MIS) contact with controlled defect density
US-2015380309-A1 · Dec 31, 2015 · US
Connecting Through Vias to Devices
US-2015371928-A1 · Dec 24, 2015 · US
Semiconductor device
US-2015364465-A1 · Dec 17, 2015 · US
Method of forming contact hole and semiconductor structure with contact plug
US-9214392-B1 · Dec 15, 2015 · US
Method of self-correcting power grid for semiconductor structures
US-9214427-B2 · Dec 15, 2015 · US
Semiconductor device, manufacturing method thereof, and electronic device
US-2015348909-A1 · Dec 3, 2015 · US
Method for fabricating coa array substrate, array substrate and display device
US-2015340415-A1 · Nov 26, 2015 · US
Standard cell architecture with m1 layer unidirectional routing
US-2015333008-A1 · Nov 19, 2015 · US
Body contact layouts for semiconductor structures
US-2015325652-A1 · Nov 12, 2015 · US
Self-aligned silicide formation on source/drain through contact via
US-2015318395-A1 · Nov 5, 2015 · US
Methods of forming electrically conductive lines
US-9171750-B2 · Oct 27, 2015 · US
Semiconductor device with an electrode buried in a cavity
US-9171918-B2 · Oct 27, 2015 · US
Semiconductor device and method for manufacturing same
US-2015303200-A1 · Oct 22, 2015 · US
Semiconductor structure and method forming the same
US-9162874-B2 · Oct 20, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/535?
- CPC H01L23/535 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/535 (Electricity)?
- Our database includes 4,802 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/535 growing?
- Publication counts under this code: 427 in 2024 vs 363 in 2025 (latest complete years).