Fluid device

Patent metadata

Field	Value
Publication number	US-10228075-B2
Application number	US-201715426233-A
Country	US
Kind code	B2
Filing date	Feb 7, 2017
Priority date	Aug 5, 2016
Publication date	Mar 12, 2019
Grant date	Mar 12, 2019

Abstract

Provided is a flow rate adjustment device including: a valve body portion configured to be movable along an axis line; a body portion having a valve bore and an upstream-side fluid chamber formed therein, the valve body portion being inserted into the valve bore, the upstream-side fluid chamber being configured to circulate a fluid; and a thin film-like first diaphragm portion which is coupled to the valve body portion and configured to isolate the upstream-side fluid chamber from a spring accommodation chamber adjacent to the upstream-side fluid chamber. The first diaphragm portion is formed of a conductive fluororesin material including a fluororesin material and carbon nanotubes dispersed in the fluororesin material, and the conductive fluororesin material has a volume resistivity of more than 1.0×103 Ω·cm and less than 1.0×104 Ω·cm.

First claim

The invention claimed is:

1. A fluid device that is installed in a pipe through which a fluid used for a semiconductor manufacturing apparatus is circulated, the fluid device comprising:
a valve body portion configured to be movable along an axis line;
a housing portion having a valve bore and a fluid flow channel formed therein, the valve body portion being inserted into the valve bore, the fluid flow channel being configured to circulate the fluid; and
a thin film-like diaphragm portion coupled to the valve body portion and configured to isolate the fluid flow channel from an adjacent space adjacent to the fluid flow channel, wherein:
the diaphragm portion is formed of a conductive fluororesin material including a fluororesin material and carbon nanotubes dispersed in the fluororesin material;
wherein the conductive fluororesin material contains the carbon nanotubes at a ratio of 0.020 weight % or more and 0.030 weight % or less; and
the conductive fluororesin material has a volume resistivity of more than 1.0×10 3 Ω·cm and less than 1.0×10 4 Ω·cm.

2. The fluid device according to claim 1 , further comprising a metal member disposed in the adjacent space.

3. The fluid device according to claim 2 , wherein the metal member is a spring configured to impart an urging force to the valve body portion in a direction along the axis line.

4. The fluid device according to claim 3 , further comprising a conductive member made of metal, the conductive member being attached in contact with the spring and the diaphragm portion.

5. The fluid device according to claim 1 , wherein the housing portion is formed of the conductive fluororesin material.

6. The fluid device according to claim 1 , wherein the valve body portion and the diaphragm portion coupled to the valve body portion are integrally formed of the conductive fluororesin material.

7. A fluid device comprising:
a valve body portion configured to be movable along an axis line;
a housing portion having a valve bore and a fluid flow channel formed therein, the valve body portion being inserted into the valve bore, the fluid flow channel being configured to circulate a fluid; and
a thin film-like diaphragm portion coupled to the valve body portion and configured to isolate the fluid flow channel from an adjacent space adjacent to the fluid flow channel, wherein:
the fluid device is configured to be installed in a pipe through which the fluid used for a semiconductor manufacturing apparatus is circulated;
the diaphragm portion is formed of a conductive fluororesin material including a fluororesin material and carbon nanotubes dispersed in the fluororesin material;
wherein the conductive fluororesin material contains the carbon nanotubes at a ratio of 0.020 weight % or more and 0.030 weight % or less; and
the conductive fluororesin material has a volume resistivity of more than 1.0×10 3 Ω·cm and less than 1.0×10 4 Ω·cm.

8. A system, comprising:
a semiconductor manufacturing apparatus;
a pipe through which a fluid for the semiconductor manufacturing apparatus circulates; and
a fluid device installed in the pipe, the fluid device comprising:
a valve body portion configured to be movable along an axis line;
a housing portion having a valve bore and a fluid flow channel formed therein, the valve body portion being inserted into the valve bore, the fluid flow channel being configured to circulate the fluid; and
a thin film-like diaphragm portion coupled to the valve body portion and configured to isolate the fluid flow channel from an adjacent space adjacent to the fluid flow channel, wherein:
the diaphragm portion is formed of a conductive fluororesin material including a fluororesin material and carbon nanotubes dispersed in the fluororesin material,
wherein the conductive fluororesin material contains the carbon nanotubes at a ratio of 0.020 weight % or more and 0.030 weight % or less; and
the conductive fluororesin material has a volume resistivity of more than 1.0×10 3 Ω·cm and less than 1.0×10 4 Ω·cm.

Assignees

• Surpass Ind Co Ltd

Inventors

• Imai Takashi
• Hasunuma Masahiro
• Hirai Kazuki

Classifications

• F16K31/1266 Primary

  one side of the diaphragm being acted upon by the circulating fluid · CPC title

• F16K31/1262 Primary

  one side of the diaphragm being spring loaded · CPC title

• F16K27/02

  of lift valves (for reducing the flow resistance of screw-spindle lift-valves F16K1/06) · CPC title

• F16K7/12

  with flat, dished, or bowl-shaped diaphragm · CPC title

• F16K51/00

  Other details not peculiar to particular types of valves or cut-off apparatus · CPC title