Fluidic device

Patent metadata

Field	Value
Publication number	US-9995415-B2
Application number	US-201615292662-A
Country	US
Kind code	B2
Filing date	Oct 13, 2016
Priority date	Oct 16, 2015
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

There is provided a flow rate adjustment apparatus including a main body inside which a fluid flow passage that guides a fluid has been formed, in which the main body is formed of a conductive fluorine resin material containing a fluorine resin material, and a carbon nanotube dispersed in the fluorine resin material, and in which a volume resistivity of the conductive fluorine resin material is more than 1.0×10 3 Ω·cm and less than 1.0×10 4 Ω·cm.

First claim

The invention claimed is:

1. A fluidic device that is installed in a piping through which a fluid used for a semiconductor manufacturing apparatus is made to flow, the fluidic device comprising:
a main body inside which a fluid flow passage that guides a fluid has been formed,
wherein the main body is formed of a conductive fluorine resin material containing a fluorine resin material, and a carbon nanotube dispersed in the fluorine resin material, and
wherein a volume resistivity of the conductive fluorine resin material is more than 1.0×10 3 Ω·cm and less than 1.0×10 4 ·Ω·cm.

2. The fluidic device according to claim 1 , further comprising a diameter reduction part that is arranged in the fluid flow passage, and locally decreases a flow passage cross-sectional area of the fluid flow passage.

3. The fluidic device according to claim 1 , further comprising a metal conduction member that is attached in a state of being in contact with the main body, and is connectable to a ground cable maintained to have a ground potential.

4. The fluidic device according to claim 1 , wherein the conductive fluorine resin material contains the carbon nanotube at a rate not less than 0.020 weight % and not more than 0.030 weight %.

5. The fluidic device according to claim 4 , wherein the fluid flow passage has:
an upstream-side flow passage that is communicated with an inflow port; and
a downstream-side flow passage that is communicated with an outflow port,
wherein the fluidic device further comprises: a valve chamber that is communicated with the upstream-side flow passage and the downstream-side flow passage; and a valve body part that is inserted into a valve hole that guides the fluid from the upstream-side flow passage to the valve chamber, and
wherein the diameter reduction part is a gap that is formed between the valve hole and the valve body part.

6. The fluidic device according to claim 5 , further comprising:
a biasing force generation part that generates a biasing force in a direction in which the valve body part is brought into contact with the valve hole along an axis line of the valve body part;
a diaphragm part that is coupled to an end of the valve body part inserted into the valve chamber, and has a thin film part annularly formed around the axis line; and
an opposing force generation part that generates an opposing force in a direction in which the valve body part is separated from the valve hole along the axis line of the valve body part through the diaphragm part.

7. The fluidic device according to claim 6 , wherein the biasing force generation part is a metal spring, and
wherein the fluidic device further comprises an antistatic member that electrically connects the spring and the main body.

8. The fluidic device according to claim 4 , wherein the fluid flow passage has: an upstream-side flow passage that is communicated with an inflow port; and a downstream-side flow passage that is communicated with an outflow port,
wherein the main body has: a first main body inside which the upstream-side flow passage has been formed; and a second main body inside which the downstream-side flow passage has been formed,
wherein the fluidic device further comprises:
a first valve hole that is formed in the first main body, and guides to the second main body the fluid having flowed in from the inflow port;
a first valve body part that is housed in the first main body, and is inserted into the first valve hole;
a first biasing force generation part that generates a first biasing force in a direction in which the first valve body part is brought into contact with the first valve hole along a first axis line of the first valve body part;
a second valve hole that is formed in the second main body, and guides to the downstream-side flow passage the fluid made to flow out from the outflow port;
a second valve body part that is housed in the second main body, and is inserted into the second valve hole; and
a second biasing force generation part that generates a second biasing force in a direction in which the second valve body part is brought into contact with the second valve hole along a second axis line of the second valve body part, and

wherein the diameter reduction parts are a first gap that is formed between the first valve hole and the first valve body part, and a second gap that is formed between the second valve hole and the second valve body part.

9. A fluidic device, the fluidic device comprising:
a main body inside which a fluid flow passage that guides a fluid has been formed,
wherein the main body is formed of a conductive fluorine resin material containing a fluorine resin material, and a carbon nanotube dispersed in the fluorine resin material,
wherein a volume resistivity of the conductive fluorine resin material is more than 1.0×10 3 Ω·cm and less than 1.0×10 4 ·Ω·cm, and
wherein the fluidic device is configured to be installed in a piping through which a fluid used for a semiconductor manufacturing apparatus is made to flow.

10. A system, comprising:
a semiconductor manufacturing apparatus;
a piping through which a fluid for the semiconductor manufacturing apparatus flows; and
a fluidic device installed in the piping, the fluidic device comprising:
a main body inside which a fluid flow passage that guides a fluid has been formed,

wherein the main body is formed of a conductive fluorine resin material containing a fluorine resin material, and a carbon nanotube dispersed in the fluorine resin material, and
wherein a volume resistivity of the conductive fluorine resin material is more than 1.0×10 3 Ω·cm and less than 1.0≤10 4 ·Ω·cm.

Assignees

• Surpass Ind Co Ltd

Inventors

• Imai Takashi
• Hasunuma Masahiro

Classifications

• H01B1/24

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

• H05K9/0064

  Earth or grounding circuit · CPC title

• F16K27/0236 Primary

  Diaphragm cut-off apparatus · CPC title

• F16L37/32

  at least one of two lift valves being opened automatically when the coupling is applied · CPC title

• F16K31/126

  the fluid acting on a diaphragm, bellows, or the like (F16K31/145, F16K31/165, F16K31/365, F16K31/385 take precedence) · CPC title