Component shielding structures with magnetic shielding

Patent metadata

Field	Value
Publication number	US-10225964-B2
Application number	US-201615250066-A
Country	US
Kind code	B2
Filing date	Aug 29, 2016
Priority date	Mar 31, 2016
Publication date	Mar 5, 2019
Grant date	Mar 5, 2019

Abstract

Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

First claim

What is claimed is:

1. Apparatus, comprising:
a substrate;
at least one electrical component mounted on the substrate; and
a shielding can attached to the substrate that covers and shields the electrical component, wherein the shielding can includes a plurality of layers of material including a layer of magnetic shielding material, the plurality of layers of material include first and second cladding layers on opposing sides of the layer of magnetic shielding material, the first and second cladding layers are larger than the layer of magnetic shielding material, edge portions of the first and second cladding layers are joined together without any intervening portions of the magnetic shielding material, and the edge portions of the first and second cladding layers are mounted on the substrate.

2. The apparatus defined in claim 1 wherein the layer of magnetic shielding material has a relative permeability of at least 500.

3. The apparatus defined in claim 1 wherein the layer of magnetic shielding material has a relative permeability of at least 1000.

4. The apparatus defined in claim 1 wherein at least one of the first and second cladding layers is a radio-frequency electromagnetic interference shielding layer.

5. The apparatus defined in claim 4 wherein the radio-frequency electromagnetic interference shielding layer is a metal layer.

6. The apparatus defined in claim 5 wherein the metal layer has a resistivity of less than 3×10 8 ohm-m.

7. The apparatus defined in claim 6 wherein the layer of magnetic shielding material is a printed layer of magnetic material on the metal layer.

8. The apparatus defined in claim 6 wherein the metal layer is a cold-rolled cladding layer on the layer of magnetic shielding material.

9. The apparatus defined in claim 8 wherein the layer of magnetic shielding material comprises a layer of stainless steel.

10. The apparatus defined in claim 9 wherein the stainless steel comprises a stainless steel selected form the group consisting of: 430 stainless steel and 444 stainless steel.

11. The apparatus defined in claim 6 wherein the layer of magnetic shielding material and the metal layer are stamped together and form walls for the shielding can.

12. The apparatus defined in claim 1 wherein the layer of magnetic shielding material comprises stainless steel.

13. The apparatus defined in claim 1 wherein the first and second cladding layers comprise a material selected from the group consisting of: nickel, gold, silver, and copper-nickel.

14. The apparatus defined in claim 1 wherein the edge portions of the first and second cladding layers are parallel to the layer of magnetic shielding material.

15. The apparatus defined in claim 1 wherein the layer of magnetic shielding material is a layer of stainless steel and the first and second cladding layers encapsulate the layer of stainless steel.

16. Shielded circuitry, comprising:
a support structure;
electrical components soldered to the support structure; and
a shielding structure that shields the electrical components and that is soldered to the support structure, wherein the shielding structure comprises a stainless steel layer with opposing first and second surfaces, the stainless steel layer has a first length, a first cladding layer on the first surface, and a second cladding layer on the second surface, the first and second cladding layers have second and third lengths that are longer than the first length, the first and second cladding layers extend beyond the stainless steel layer, and edge portions of the first and second cladding layers are joined together without any intervening portions of the stainless steel layer.

17. The shielded circuitry defined in claim 16 wherein the stainless steel layer has a relative permeability of at least 500.

18. The shielded circuitry defined in claim 16 wherein the stainless steel comprises a stainless steel selected from the group consisting of: 430 stainless steel and 444 stainless steel.

19. The shielded circuitry defined in claim 16 wherein the cladding layers comprise a metal with more solderability than the stainless steel layer.

20. The shielded circuitry defined in claim 16 wherein the shielding structure comprises a cowling that holds the electrical components to the support structure.

Assignees

• Apple Inc

Inventors

• Smith James B
• Jarvis Daniel W
• Pakula David A
• Stephens Gregory N
• Merz Nicholas G L
• Malek Shayan
• Bigdeli Sina

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H05K9/0031 Primary

  combining different shielding materials · CPC title

• H05K9/003 Primary

  made from non-conductive materials comprising an electro-conductive coating (H05K9/0031 takes precedence) · CPC title