Package process method including disposing a die within a recess of a one-piece material

Patent metadata

Field	Value
Publication number	US-10224254-B2
Application number	US-201715497219-A
Country	US
Kind code	B2
Filing date	Apr 26, 2017
Priority date	Apr 26, 2017
Publication date	Mar 5, 2019
Grant date	Mar 5, 2019

Abstract

A package structure may include a one-piece metal carrier, a die, a mold layer and a redistribution layer. The one-piece metal carrier may include a bottom portion and a first supporting structure, and the one-piece metal carrier may have a recess defined by the bottom portion and the first supporting structure. The die may be disposed in the recess of the one-piece metal carrier, and the die may have a plurality of conductive bumps. The mold layer may be formed to encapsulate the die. The mold layer may expose a portion of each of the plurality of conductive bumps and a portion of the first supporting structure. The redistribution layer may be disposed on the mold layer and electrically connected to the plurality of conductive bumps.

First claim

What is claimed is:

1. A package structure comprising:
a one-piece metal carrier including a bottom portion, a first supporting structure, and a second supporting structure separated by spaces from and surrounding the first supporting structure, the one-piece metal carrier having a recess defined by the bottom portion and the first supporting structure;
a die disposed in the recess of the one-piece metal carrier, the die having a plurality of conductive bumps;
a mold layer formed to encapsulate the die and fill the spaces between the first supporting structure and the second supporting structure, wherein the mold layer exposes a portion of each of the plurality of conductive bumps, a portion of the first supporting structure, and a portion of the second supporting structure; and
a redistribution layer disposed on the mold layer, the first supporting structure, and the second supporting structure, and electrically connected to the plurality of conductive bumps.

2. The package structure of claim 1 , wherein the one-piece metal carrier is a single conductive substrate having a recess defined by the bottom portion and the first supporting structure.

3. The package structure of claim 1 , wherein the one-piece metal carrier is a single conductive substrate having the second supporting structure and a recess defined by the bottom portion and the first supporting structure.

4. The package structure of claim 1 , wherein the second supporting structure comprises a plurality of pillars.

5. The package structure of claim 1 , wherein at least a portion of the bottom portion and at least a portion of the second supporting structure is covered by a dielectric layer.

6. The package structure of claim 1 , wherein the first supporting structure is electrically connected to the redistribution layer.

7. The package structure of claim 1 , wherein the bottom portion of the one-piece metal carrier is exposed in the package structure.

8. The package structure of claim 1 , further comprising:
a plurality of first solder balls disposed on the redistribution layer.

9. The package structure of claim 1 , further comprising:
a protection layer disposed between the die and the one-piece metal carrier to adhere the die to the one-piece metal carrier such that die is thermal coupled with the bottom portion of the one-piece metal carrier, wherein the protection layer comprises at least one of an adhesive layer and a die attach film.

10. A package process method comprising:
forming a one-piece metal carrier having a bottom portion, a first supporting structure, and a second supporting structure separated by spaces from and surrounding the first supporting structure, the bottom portion and the first supporting structure forming a recess;
disposing a die within the recess;
forming a mold layer to encapsulate the die and fill the spaces between the first supporting structure and the second supporting structure;
grinding the mold layer to expose a portion of each of a plurality of conductive bumps of the die, a portion of the first supporting structure, and a portion of the second supporting structure; and
forming a redistribution layer on the mold layer, wherein the redistribution layer is electrically connected to the plurality of conductive bumps, the first supporting structure, and the second supporting structure.

11. The method of claim 10 , further comprising:
disposing a protection layer between the die and the bottom portion.

12. The method of claim 10 , further comprising:
disposing a plurality of first solder balls on the redistribution layer.

13. The method of claim 10 , wherein forming a one-piece metal carrier is etching a single conductive substrate to form the bottom portion and the first supporting structure.

14. The method of claim 10 , wherein forming a one-piece metal carrier is etching a single conductive substrate to form the bottom portion, the first supporting structure, and the second supporting structure.

15. The method of claim 14 , further comprising:
after forming the mold layer, etching the one-piece metal carrier to separate the second supporting structure from the bottom portion and the first supporting structure.

16. The method of claim 14 , further comprising:
forming a dielectric layer to cover at least a portion of the bottom portion and at least a portion of the second supporting structure.

17. The method of claim 14 , wherein the second supporting structure comprises a plurality of pillars.

18. The method of claim 17 , further comprising:
disposing a plurality of first solder balls correspondingly on the plurality of pillars of the second supporting structure.

19. The method of claim 10 , further comprising:
performing a cutting process to the one-piece metal carrier, the redistribution layer, and the mold layer to form a plurality of package structures.

20. The package structure of claim 4 , further comprising a plurality of second solder balls correspondingly on ends of the plurality of pillars of the second supporting structure opposite to ends of the plurality of pillars contacting the redistribution layer.

Assignees

• Powertech Technology Inc

Inventors

• Chen Ming-Chih
• Hsu Hsien-Wen
• Lan yuan-fu
• Hsu Hung-Hsin

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• H10W20/031

  of conductive parts of the interconnections · CPC title