Platinum temperature sensor element

Patent metadata

Field	Value
Publication number	US-10222248-B2
Application number	US-201715784724-A
Country	US
Kind code	B2
Filing date	Oct 16, 2017
Priority date	Oct 17, 2016
Publication date	Mar 5, 2019
Grant date	Mar 5, 2019

Abstract

Internal electrodes, a protective film, and protective films covering the top parts of internal electrode sides of lead wires are formed on a top surface of a substrate of a temperature sensor element, thereby making the overall shape a quadrangular prism and the transverse cross-section nearly a square even at any portion in the axial direction. A heating part of the temperature sensor element is provided near the center along the length, the height, and the width of the element, thereby preventing deviation of heat generation and stabilizing heat release to the lead wires. This allows the temperature sensor element to suppress fluctuation in detected temperatures due to mounting angle.

First claim

What is claimed:

1. A platinum temperature sensor element comprising:
an insulating substrate having a planar rectangular shape made of an insulating material with a predetermined thickness;
a pattern made of a platinum resistance film formed on the insulating material;
a pair of electrodes formed on either end along a length of the insulating substrate;
lead wires that are joined to the respective paired electrodes and extend to an outside of the platinum temperature sensor element; and
a protective film that is formed on a top side of the insulating substrate to cover the pattern, the paired electrodes, and top surfaces of joined regions of the lead wires to the paired electrodes;
wherein the platinum temperature sensor element has an overall shape of a square column, and a transverse cross-sectional shape at a center along the length is quadrilateral where a ratio of length and breadth is 1:1 to 1.5; and wherein at the center along the length, a ratio between thickness of the insulating substrate and thickness of the protective film is approximately equal to 1.

2. The platinum temperature sensor element of claim 1 , wherein the center of the pattern is a heating part, and the heating part is positioned at nearly the center along the length of the insulating substrate and also at nearly the center along the height and the width of the platinum temperature sensor element.

3. The platinum temperature sensor element of claim 2 , wherein the heating part is made of a meander-shaped pattern.

4. The platinum temperature sensor element of claim 1 , wherein a thickness of the protective film on top of the joined regions is 130 to 180 μm.

5. The platinum temperature sensor element of claim 1 , wherein a ratio of width of the insulating substrate to height of the platinum temperature sensor element is 1:1 to 1.5, a ratio of width of the insulating substrate to diameter of the lead wires is 2.5:1 to 3:1, and a ratio of respective length of the paired electrodes to length of the insulating substrate is 1:4 to 1.5.

Assignees

• Koa Corp

Inventors

• Suzuki Ryusuke
• Fujiwara Hideki
• Kawahara Tatsuya

Classifications

• G01K7/183

  characterised by the use of the resistive element · CPC title

• H01C7/021

  formed with two or more layers · CPC title

• H05B3/20

  Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater (H05B3/62, H05B3/68, H05B3/78, H05B3/84 take precedence) · CPC title

• G01K7/18 Primary

  the element being a linear resistance, e.g. platinum resistance thermometer (G01K7/26 takes precedence) · CPC title

• G01F1/692 Primary

  Thin-film arrangements · CPC title