Hybrid circuit assembly

Patent metadata

Field	Value
Publication number	US-10219375-B2
Application number	US-201615296198-A
Country	US
Kind code	B2
Filing date	Oct 18, 2016
Priority date	Sep 3, 2013
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.

First claim

What is claimed is:

1. A method of manufacturing a hybrid circuit assembly, comprising:
providing an integrated metal substrate (IMS), the IMS comprising a metal base plate including a recess formed in a first portion of an upper surface of the metal base plate, an insulating layer on a second portion of the upper surface of the metal base plate different from the first portion and adjacent to the recess, and a wiring layer on an upper surface of the insulating layer opposite the metal base plate, the wiring layer including a component mounting surface on a top surface of the wiring layer opposite the metal base plate;
providing a multi-layer wiring board (PWB), the PWB comprising conductive traces printed on two or more wiring layers separated by insulating material which include a bottom wiring layer with a bottom surface on one side of the PWB and a top wiring layer with a component mounting surface on an opposite side of the PWB;
attaching the PWB to the IMS within the recess of the metal base plate such that the bottom surface of the bottom wiring layer of the PWB is attached to a top surface of the recess and the component-mounting surface of the top wiring layer of the PWB is co-planar with the component-mounting surface of the wiring layer of the IMS.

2. The method of claim 1 , further comprising:
electrically connecting the PWB to the IMS.

3. The method of claim 1 , further comprising:
mounting electrical components onto the component-mounting surfaces of the PWB and the IMS in a single manufacturing pass.

4. The method of claim 1 , further comprising:
forming the recess of the metal base plate of the IMS to have a shape configured to conform to a shape of the PWB.

5. The method of claim 1 , wherein attaching the multi-layer PWB to the IMS includes mounting the multi-layer PWB to the metal base plate of the IMS via an insulating adhesive.

Assignees

• Raytheon Co

Inventors

• Morico Peter D
• Walker John D

Classifications

• H05K1/142 Primary

  Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit · CPC title

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title

• H05K3/36

  Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)} · CPC title