Electronic substrates having embedded inductors
US-2024331921-A1 · Oct 3, 2024 · US
in a bonding agent · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01F1/37 |
| Official title | in a bonding agent |
| Display label | in a bonding agent |
| Total patents | 286 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 14 |
| 2017 | 20 |
| 2018 | 19 |
| 2019 | 23 |
| 2020 | 14 |
| 2021 | 40 |
| 2022 | 38 |
| 2023 | 39 |
| 2024 | 28 |
| 2025 | 30 |
| 2026 | 6 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2024331921-A1 · Oct 3, 2024 · US
US-2018352688-A1 · Dec 6, 2018 · US
US-2018315527-A1 · Nov 1, 2018 · US
US-10102959-B2 · Oct 16, 2018 · US
US-10059621-B2 · Aug 28, 2018 · US
US-2018236724-A1 · Aug 23, 2018 · US
US-10008311-B2 · Jun 26, 2018 · US
US-2018068775-A1 · Mar 8, 2018 · US
US-2018061548-A1 · Mar 1, 2018 · US
US-2018009677-A1 · Jan 11, 2018 · US
US-9859043-B2 · Jan 2, 2018 · US
US-2017369672-A1 · Dec 28, 2017 · US
US-2017345543-A1 · Nov 30, 2017 · US
US-2017341975-A1 · Nov 30, 2017 · US
US-9776154-B2 · Oct 3, 2017 · US
US-2017278603-A1 · Sep 28, 2017 · US
US-2017263355-A1 · Sep 14, 2017 · US
US-2017261632-A1 · Sep 14, 2017 · US
US-2017250133-A1 · Aug 31, 2017 · US
US-2017250134-A1 · Aug 31, 2017 · US
Answers are generated from the same data shown on this page.