Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

Patent metadata

Field	Value
Publication number	US-10217913-B2
Application number	US-201415036413-A
Country	US
Kind code	B2
Filing date	Oct 30, 2014
Priority date	Nov 14, 2013
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

First claim

The invention claimed is:

1. A method for producing a plurality of optoelectronic semiconductor devices, comprising the steps of:
a) providing a plurality of semiconductor chips, which are spaced from one another in a lateral direction;
b) forming a package body assembly, which is arranged at least in part between the semiconductor chips;
c) forming a plurality of fillets, which each adjoin a semiconductor chip and which are delimited in the lateral direction by a side face of the respective semiconductor chip and the package body assembly; and
d) singulating the package body assembly into a plurality of optoelectronic semiconductor devices, wherein each semiconductor device comprises at least one semiconductor chip and a part of the package body assembly as its package body and wherein the semiconductor chips are each free of package body material on a radiation exit face of the semiconductor device opposite a mounting surface,
wherein to form the fillets the semiconductor chips are encapsulated prior to step b) with an auxiliary material in such a way that the side faces of the semiconductor chips are at least partly covered and the auxiliary material is encapsulated in step b) by a molding composition for the package body assembly,
wherein the auxiliary material is applied to an auxiliary carrier and the semiconductor chips are pressed into the auxiliary material such that the auxiliary material covers the side faces of the semiconductor chips at least in part, and
wherein the semiconductor chips extend right through the package bodies body.

2. The method according to claim 1 , wherein the fillet is radiation-transmissive or has a reflectivity of at least 80%.

3. The method according to claim 1 , wherein the semiconductor chips are each free of package body material on the mounting surface of the semiconductor devices.

4. The method according to claim 1 , in which the semiconductor chips are arranged on an auxiliary carrier during application of the encapsulating material and the encapsulating material is applied such that it in each case at least partly covers the side faces of the semiconductor chips and the auxiliary carrier.

5. The method according to claim 1 , in which the encapsulating material is a filler material, which remains in the semiconductor devices.

6. The method according to claim 1 , in which the encapsulating material is an auxiliary material, which is removed after step b).

7. The method according to claim 1 , wherein step c) is performed after step b), wherein material of the package body assembly is removed to form the fillets.

8. The method according to claim 6 , in which the fillet is filled with a filler material after step b).

9. The method according to claim 1 , wherein the semiconductor chips are covered over in step b) and the package body assembly is then thinned, such that the semiconductor chips are uncovered in places.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Pindl Markus
• Schwarz Thomas
• Singer Frank
• Sobczyk Sandra

Classifications

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H01L21/568

  Electricity · mapped topic

• H01L2933/0058

  Electricity · mapped topic