Active substrate alignment system and method

US10217657B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10217657-B2
Application numberUS-201515511542-A
CountryUS
Kind codeB2
Filing dateSep 4, 2015
Priority dateSep 15, 2014
Publication dateFeb 26, 2019
Grant dateFeb 26, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An active substrate alignment system for an ion implanter, the system including a platen, a registration device adapted to selectively move a substrate engagement surface disposed adjacent the platen for limiting movement of a substrate disposed on the platen, a camera configured to capture an image of the substrate before the substrate is disposed on the platen, and a controller in communication with the camera and the registration device, the controller configured to command the registration device to move the substrate engagement surface based on the image to limit movement of the substrate in a predetermined manner.

First claim

Opening claim text (preview).

The invention claimed is: 1. An active substrate alignment system for an ion implanter comprising: a platen; a registration device adapted to selectively move a substrate engagement surface disposed adjacent the platen for limiting movement of a substrate disposed on the platen; a camera configured to capture an image of the substrate before the substrate is disposed on the platen; and a controller in communication with the camera and the registration device, the controller configured to command the registration device to move the substrate engagement surface based on the image to limit movement of the substrate in a predetermined manner. 2. The substrate alignment system of claim 1 , further comprising a pusher disposed adjacent the platen and adapted to push the substrate into engagement with the substrate engagement surface. 3. The substrate alignment system of claim 2 , wherein the pusher comprises a first pusher and a second pusher disposed on a first side of the platen in a parallel relationship with one another. 4. The substrate alignment system of claim 1 , wherein the registration device comprises a first registration device and a second registration device disposed on a first side of the platen. 5. The substrate alignment system of claim 4 , further comprising a third registration device disposed on a second side of the platen. 6. The active substrate alignment system of claim 1 , wherein the camera is configured to capture an image of a first dopant pattern on the substrate before the substrate is disposed on the platen, and wherein the controller configured to command the registration device to move the substrate engagement surface based on the image so the first dopant pattern on the substrate will be aligned with a second dopant pattern projected onto the substrate after the substrate is positioned on the platen. 7. The active substrate alignment system of claim 1 , wherein the controller is configured to command the registration device to move the engagement surface based on the image so a dopant pattern projected onto the substrate after the substrate is positioned on the platen will be centered on the substrate. 8. An active substrate alignment system for an ion implanter comprising: a platen; first and second registration devices adapted to selectively move respective first and second substrate engagement surfaces disposed on a first side of the platen for limiting movement of a substrate disposed on the platen; a camera configured to capture an image of the substrate before the substrate is disposed on the platen; and a controller in communication with the camera and the first and second registration devices, the controller configured to command the first and second registration devices to move the first and second substrate engagement surfaces based on the image to limit movement of the substrate in a predetermined manner; and a first pusher and a second pusher disposed on a second side of the platen in a parallel relationship with one another and adapted to push the substrate into engagement with the first and second substrate engagement surfaces.

Assignees

Inventors

Classifications

  • H10P72/53Primary

    using optical controlling means · CPC title

  • for ion implantation · CPC title

  • using an image reference approach · CPC title

  • Ion implantation · CPC title

  • Object or beam position registration · CPC title

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What does patent US10217657B2 cover?
An active substrate alignment system for an ion implanter, the system including a platen, a registration device adapted to selectively move a substrate engagement surface disposed adjacent the platen for limiting movement of a substrate disposed on the platen, a camera configured to capture an image of the substrate before the substrate is disposed on the platen, and a controller in communicati…
Who is the assignee on this patent?
Varian Semiconductor Equipment Ass Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/53. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).