Plasma processing apparatus and method therefor

Patent metadata

Field	Value
Publication number	US-10217617-B2
Application number	US-201414525712-A
Country	US
Kind code	B2
Filing date	Oct 28, 2014
Priority date	Nov 1, 2013
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

A dry etching apparatus plasma processes a wafer held by a carrier having a frame and a holding sheet. An electrode unit of a stage includes an electrostatic chuck. An area of an upper surface of the electrostatic chuck onto which the wafer is placed via the holding sheet is a flat portion and is not subject to backside gas cooling. A first groove structure is formed in the area onto which the wafer is placed via the holding sheet as well as in an area onto which a holding sheet between the wafer and the frame is placed. To a minute space defined by the first groove structure and the carrier, a heat transfer gas is supplied from a first heat transfer gas supply section through a heat transfer gas supply hole (backside gas cooling).

First claim

What is claimed is:

1. A plasma processing apparatus for plasma processing a substrate held by a carrier having a frame and a holding sheet, comprising:
a chamber having a pressure reducible internal space;
a process gas supply section configured to supply a process gas into the internal space;
a pressure reducing section configured to reduce pressure of the internal space;
a plasma generating section configured to generate plasma in the internal space;
a stage in the chamber and including an electrode unit on which the carrier is positioned;
a substantially flat portion in a first area of the electrode unit, the first area being an area in which the substrate is positioned via the holding sheet;
a first non-flat portion in a second area of the electrode unit, the second area including at least an area in which the frame is positioned via the holding sheet and an area in which the holding sheet between the substrate and the frame is positioned, the first non-flat portion having at least one concave portion recessed in a direction away from the carrier; and
a first heat transfer gas supply section configured to supply a heat transfer gas to a first minute space defined between the first non-flat portion and the carrier via at least one heat transfer gas supply hole,
wherein the at least one heat transfer gas supply hole is in the second area of the electrode unit and no heat transfer gas hole is in the first area of the electrode unit, and
wherein the substantially flat portion has no concave portion recessed in the direction away from the carrier, and the substantially flat portion has no concave portion formed by any heat transfer gas supply hole.

2. The plasma processing apparatus according to claim 1 , further comprising a cover capable of coming into and out of contact with the stage, the cover comprising:
a body covering the holding sheet and the frame of the carrier positioned on the electrode unit; and
a window formed to penetrate the body in a thickness direction so as to expose the substrate held in the carrier positioned on the electrode unit to the internal space.

3. The plasma processing apparatus according to claim 2 , further comprising:
a second non-flat portion in a third area of the electrode unit, the third area including an area in which the cover comes into contact with the electrode unit, the second non-flat portion including at least one concave portion recessed in the direction away from the carrier; and
a second heat transfer gas supply section configured to supply the heat transfer gas to a second minute space defined between the second non-flat portion and the cover.

4. The plasma processing apparatus according to claim 1 , further comprising a cooling section configured to cool the electrode unit.

5. The plasma processing apparatus according to claim 1 , further comprising a first electrostatic attraction electrode in the first area of the electrode unit.

6. The plasma processing apparatus according to claim 5 , further comprising a second electrostatic attraction electrode in the second area of the electrode unit.

7. The plasma processing apparatus according to claim 6 , wherein the second electrostatic attraction electrode is electrically independent from the first electrostatic attraction electrode.

8. The plasma processing apparatus according to claim 7 , wherein the second electrostatic attraction electrode extends to an area in which a cover comes into contact with the electrode unit.

9. The plasma processing apparatus according to claim 7 , wherein:
the first electrostatic attraction electrode is of unipolar type, and
the second electrostatic attraction electrode is of bipolar type.

10. The plasma processing apparatus according to claim 5 , wherein a direct current voltage is applied to the first electrostatic attraction electrode.

11. The plasma processing apparatus according to claim 5 , wherein the substantially flat portion covers the first area and the first electrostatic attraction electrode entirely.

12. The plasma processing apparatus according to claim 1 , wherein a top surface of the substantially flat portion and a top surface of the first non-flat portion are positioned at a same height.

13. A plasma processing apparatus for plasma processing a substrate held by a carrier having a frame and a holding sheet, comprising:
a chamber having a pressure reducible internal space;
a process gas supply section configured to supply a process gas into the internal space;
a pressure reducing section configured to reduce pressure of the internal space;
a plasma generating section configured to generate plasma in the internal space;
a stage in the chamber and including an electrode unit on which the carrier is positioned;
a cover comprising a body covering the holding sheet and the frame of the carrier positioned on the electrode unit, and a window formed to penetrate the body in a thickness direction of the body so as to expose the substrate held in the carrier positioned on the electrode unit to the internal space;
a substantially flat portion in a first area of the electrode unit, the first area being an area exposed through the window of the cover;
a first non-flat portion in a second area of the electrode unit, the second area including at least an area covered by the body of the cover, the first non-flat portion having at least one concave portion recessed in a direction away from the carrier; and
a heat transfer gas supply section configured to supply a heat transfer gas to a first minute space defined between the first non-flat portion and the carrier via at least one heat transfer gas supply hole,
wherein the at least one heat transfer gas supply hole is in the second area of the electrode unit and no transfer gas hole is in the first area of the electrode unit, and
wherein the substantially flat portion has no concave portion recessed in the direction away from the carrier, and the substantially flat portion has no concave portion formed by any heat transfer gas supply hole.

14. The plasma processing apparatus according to claim 13 , wherein a top surface of the substantially flat portion and a top surface of the first non-flat portion are positioned at a same height.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Okita Shogo

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title