Selective deposition of metal oxide
US-2024282572-A1 · Aug 22, 2024 · US
US10214808B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10214808-B2 |
| Application number | US-201715492941-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 20, 2017 |
| Priority date | Dec 12, 2012 |
| Publication date | Feb 26, 2019 |
| Grant date | Feb 26, 2019 |
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Official abstract text for this publication.
A deposition apparatus for performing a deposition process by using a mask with respect to a substrate, the deposition apparatus includes a chamber, a support unit in the chamber, the support unit including first holes and being configured to support the substrate, a supply unit configured to supply at least one deposition raw material toward the substrate, and movable alignment units through the first holes of the support unit, the alignment units being configured to support the mask and to align the mask with respect to the substrate.
Opening claim text (preview).
What is claimed is: 1. A deposition apparatus for performing a deposition process by using a mask with respect to a substrate, the deposition apparatus comprising: a deposition chamber including a transparent window at a lower part of the deposition chamber; a stationary support unit in the chamber, the support unit including a top surface and first holes extending through the top surface of the support unit, the support unit being configured to support the substrate; a supply unit configured to supply at least one deposition raw material toward the substrate; movable alignment units that extend through the first holes of the support unit, the alignment units being configured to support the mask and being movable in three dimensions to align the mask with respect to the substrate, and alignment confirmation members below the lower part of the deposition chamber, the alignment confirmation members to confirm an alignment state of the substrate and the mask through the transparent window of the deposition chamber and second holes in the support unit. 2. The deposition apparatus as claimed in claim 1 , wherein the alignment confirmation members are configured to check alignment of an alignment mark on the substrate and an alignment mark on the mask to confirm the alignment state of the substrate and the mask. 3. The deposition apparatus as claimed in claim 1 , wherein the second holes in the support unit are closer to a center region of the support unit than the first holes. 4. The deposition apparatus as claimed in claim 1 , wherein the alignment confirmation members are farther from the supply unit than the support unit. 5. The deposition apparatus as claimed in claim 1 , wherein the support unit is between the alignment confirmation members and the supply unit. 6. The deposition apparatus as claimed in claim 1 , wherein the chamber includes transparent windows overlapping the second holes, the alignment confirmation members being configured to confirm the alignment state of the substrate and the mask through the transparent windows. 7. The deposition apparatus as claimed in claim 1 , wherein a cross-sectional area of the alignment units is smaller than a size of the first holes, the alignment units being movable in three dimensions inside the first holes. 8. The deposition apparatus as claimed in claim 1 , wherein the alignment units are configured to move vertically and horizontally within the first hole while supporting the mask. 9. The deposition apparatus as claimed in claim 1 , wherein an upper surface of the support unit is curved. 10. The deposition apparatus as claimed in claim 9 , wherein a center region of the upper surface of the support unit protrudes upward relative to end regions of the upper surface of the support unit. 11. The deposition apparatus as claimed in claim 10 , wherein a lower surface of the support unit is curved in accordance with a curvature of the upper surface of the support unit. 12. The deposition apparatus as claimed in claim 10 , wherein a lower surface of the support unit is flat. 13. The deposition apparatus as claimed in claim 1 , further comprising lift pins through third holes in the support unit, the lift pins being configured to support the substrate and to move vertically in the third holes to dispose the substrate onto the support unit. 14. The deposition apparatus as claimed in claim 13 , wherein the third holes are closer to a center region of the support unit than the first holes. 15. The deposition apparatus as claimed in claim 1 , further comprising a base plate configured to support the supply unit, the base plate being positioned farther from the support unit than the supply unit. 16. The deposition apparatus as claimed in claim 1 , further comprising a power unit configured to apply voltage between the supply unit and the support unit to generate plasma. 17. The deposition apparatus as claimed in claim 1 , further comprising a cleaning unit configured to generate plasma and to insert the plasma into the chamber to clean inside of the chamber. 18. The deposition apparatus as claimed in claim 1 , wherein the support unit is movable along a normal thereto. 19. The deposition apparatus as claimed in claim 1 , wherein the chamber includes at least one doorway, the substrate or the mask being inserted to the chamber through the at least one doorway.
characterised by lifting arrangements, e.g. lift pins · CPC title
characterised by edge profile or support profile · CPC title
Mask-wafer alignment · CPC title
using optical controlling means · CPC title
using masks · CPC title
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