Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin composition
US-2016336246-A1 · Nov 17, 2016 · US
US10214610B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10214610-B2 |
| Application number | US-201414913194-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 22, 2014 |
| Priority date | Aug 23, 2013 |
| Publication date | Feb 26, 2019 |
| Grant date | Feb 26, 2019 |
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The present invention relates to a novel multipurpose polymer and a composition containing the same. The polymer and the composition of the present invention are very useful for preparing a semiconductor device having very good mechanical and optical properties.
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What is claimed is: 1. A polymer represented by Chemical Formula 1 or 2 below: wherein A and B are each independently selected from (C6-C20)arylene and (C3-C20)heteroarylene; C is wherein R 11 , R 12 , and R 13 are independently selected from hydrogen, halogen, hydroxy and (C1-C20)alkyl; A and B may be further be independently substituted with hydroxy, halogen, (C1-C20)alkyl, (C1-C20)alkoxy, (C3-C20)cycloalkyl, (C6-C20)aryl and (C3-C20)heteroaryl; p and q are independently selected integers from 0 to 5, wherein p+q>0; r is an integer from 1 to 5; and m and n are each an independent integer from 1 to 1000. 2. The polymer of claim 1 , wherein the Chemical Formula 1 is represented by Chemical Formulas 3 or 4 below: 3. The polymer of claim 2 , wherein A and B are each independently selected from the following Structural Formulas 6-16: wherein, R 1 to R 4 are independently selected from hydrogen, halogen, hydroxy, (C1-C20)alkyl and (C6-C20)aryl. 4. The polymer of claim 1 , wherein A and B are each independently selected from the following Structural Formulas 6-16: wherein, R 1 to R 4 are independently selected from hydrogen, halogen, hydroxy, (C1-C20)alkyl and (C6-C20)aryl. 5. The polymer of claim 1 , wherein A is ,and B is 6. A composition comprising a polymer represented by Chemical Formula 1 or 2 below: wherein A and B are each independently selected from (C6-C20)arylene and (C3-C20)heteroarylene; C is wherein R 11 , R 12 , and R 13 are independently selected from hydrogen, halogen, hydroxy and (C1-C20)alkyl; A and B may be further be independently substituted with hydroxy, halogen, (C1-C20)alkyl, (C1-C20)alkoxy, (C3-C20)cycloalkyl, (C6-C20)aryl and (C3-C20)heteroaryl; p and q are independently selected integers from 0 to 5, wherein p+q>0; r is an integer from 1 to 5; and m and n are each an independent integer from 1 to 1000. 7. The composition of claim 6 , further comprising: a crosslinking agent and an acid catalyst. 8. The composition of claim 7 , wherein the composition includes 1 to 40 wt % of the polymer, 0.1 to 40 wt % of the crosslinking agent, 0.001 to 10 wt % of the acid catalyst, and residual amount of a solvent. 9. The composition of claim 7 , wherein the crosslinking agent is at least one selected from the group consisting of a melamine resin, an amino resin, a glycoluril compound and a bisepoxy compound. 10. The composition of claim 7 , wherein the acid catalyst is at least one selected from the group consisting of p-toluenesulfonic acid mono hydrate, pyridinium p-toluenesulfonic acid, p-toluenesulfonic acid amine salts including p-toluenesulfonic acid triethylamine salt, 2,4,4,6-tetrabromocyclohexadienone, benzoin tosylate, and 2-nitrobenzyl tosylate. 11. The composition of claim 6 , wherein the composition is used for a gap-fill process, a double patterning process, or a hard mask.
of masks comprising organic materials · CPC title
of aldehydes · CPC title
Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule · CPC title
Cross-linked structures · CPC title
having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title
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