Light-emitting diode chip with current spreading layer
US-9853188-B2 · Dec 26, 2017 · US
US10211370B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10211370-B2 |
| Application number | US-201815916768-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 9, 2018 |
| Priority date | Sep 11, 2015 |
| Publication date | Feb 19, 2019 |
| Grant date | Feb 19, 2019 |
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An infrared LED having a monolithic and stacked structure, having an n-doped base substrate, which includes GaAs, a lower cladding layer, an active layer for generating infrared radiation, an upper cladding layer, a current distribution layer and an upper contact layer. The layers being preferably disposed in the specified order. A first tunnel diode is disposed between the upper cladding layer and the current distribution layer, and the current distribution layer predominantly including an n-doped, Ga-containing layer having a Ga content>1%.
Opening claim text (preview).
What is claimed is: 1. An infrared LED having a monolithic and stacked structure, the infrared LED comprising: a n-doped base substrate that includes GaAs; a lower cladding layer; an active layer for generating infrared radiation; an upper cladding layer; a current distribution layer; an upper contact layer that is epitaxially grown; and a first tunnel diode disposed between the upper cladding layer and the current distribution layer, wherein the current distribution layer includes a n-doped Ga-containing layer having a Ga content>1%, the current distribution layer having a layer resistance R □ <75Ω, the current distribution layer being made from GaAs or AlGaAs or InGaP, and wherein the first tunnel diode has a thickness between 30 nm and 150 nm and includes an As-containing p layer doped with carbon having a dopant concentration>1×10 19 N/cm 3 , and the first tunnel diode includes a P-containing n layer doped with tellurium having a dopant concentration>3×10 18 N/cm 3 . 2. The infrared LED according to claim 1 , wherein a second tunnel diode is arranged between the current distribution layer and the upper contact layer, and wherein the upper contact layer is p-doped. 3. The infrared LED according to claim 1 , wherein the lower cladding layer includes a compound made from GaAs or from AlGaAs or from InGaAsP or from GaAsP or from InGaP or from AlInGaP. 4. The infrared LED according to claim 1 , wherein the upper cladding layer includes a compound made from GaAs or from AlGaAs or from InGaAsP or from GaAsP or from InGaP or from AlInGaP. 5. The infrared LED according to claim 1 , wherein the active layer is made from a multiple quantum well structure and has a thickness between 15 nm and 350 nm or between 30 nm and 300 nm. 6. The infrared LED according to claim 1 , wherein the current distribution layer has a thickness between 0.1 μm and 3.0 μm. 7. The infrared LED according to claim 1 , wherein the current distribution layer includes a n-doped Al x Ga 1-x As layer having an Al content x between 0% and 20%. 8. The infrared LED according to claim 1 , wherein the current distribution layer has a n-dopant concentration>1.0E18 N/cm 3 . 9. The infrared LED according to claim 1 , wherein the active layer is made from an In x Ga 1-x As/GaAs 1-y P y multiple quantum well structure, where 0.1≤x≤0.2 and 0.1≤y≤0.3. 10. The infrared LED according to claim 1 , wherein the lower cladding layer has a n doping, or wherein the upper cladding layer has a p doping. 11. The infrared LED according to claim 1 , wherein the tunnel diode is transparent to the radiation generated in the active layer. 12. The infrared LED according to claim 1 , wherein the current distribution layer has an absorption coefficient of less than 150/cm for the radiation generated in the active layer. 13. The infrared LED according to claim 2 , wherein the first tunnel diode or the second tunnel diode includes an As-containing layer, the As-containing layer being doped with carbon, or includes a P-containing layer, the P-containing layer being doped with tellurium. 14. The infrared LED according to claim 2 , wherein the first tunnel diode or the second tunnel diode includes a n-doped layer having a dopant concentration>3×10 18 N/cm 3 and a p-doped layer having a dopant concentration>1×10 19 N/cm 3 .
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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