Display device and manufacturing method thereof
US-2018019440-A1 · Jan 18, 2018 · US
US10209546B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10209546-B2 |
| Application number | US-201715571163-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 20, 2017 |
| Priority date | Jul 21, 2016 |
| Publication date | Feb 19, 2019 |
| Grant date | Feb 19, 2019 |
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Official abstract text for this publication.
Display panel and display device, and fabrication methods are provided. The method for fabricating the display panel includes forming a protective layer at least on a bending region, the bending region being in a non-display region containing peripheral circuits of the display panel, to cover the peripheral circuits, and folding the display panel at the bending region towards a back surface of the display panel. When the display panel is folded at the bending region towards the back surface of the display panel, the protective layer coated on the bending region provides protection for the peripheral circuits formed on the surface of the bending region.
Opening claim text (preview).
What is claimed is: 1. A method for fabricating a curved display panel, comprising: forming a protective layer at least on a bending region, the bending region being in a non-display region containing peripheral circuits of a display panel, to cover the peripheral circuits; and folding the display panel at the bending region towards a back surface of the display panel; wherein the protective layer is made of a material including a photosensitive adhesive; after forming the protective layer at least on the bending region, the method further includes half-curing at least a portion of the protective layer corresponding to the bending region in an exposure process using a mask plate; and after folding the display panel at the bending region towards a back surface of the display panel, the method further includes performing a secondary exposure process on the protective layer to completely cure the protective layer. 2. The method of claim 1 , prior to forming the protective layer at least on the bending region, further including: providing a first substrate at least on a display region of the display panel; providing a second substrate on the non-display region; and forming a base substrate of the display panel by joining the first substrate and the second substrate, wherein the second substrate is made of a flexible material. 3. The method of claim 1 , prior to forming the protective layer at least on the bending region, further including: providing a first substrate and a second substrate, wherein: the second substrate is provided on the non-display region and a display region of the display panel; and the first substrate is attached onto a top surface of the second substrate and above the display region, together forming a base substrate of the display panel, wherein the second substrate is made of a flexible material. 4. The method of claim 1 , prior to forming the protective layer at least on the bending region, further including: providing a substrate material layer on both a display region and the non-display region to form a base substrate of the display panel, wherein the substrate material layer is made of a flexible material. 5. The method of claim 2 , wherein the non-display region containing the peripheral circuits is formed by: forming a plurality of gate lines and a plurality of data lines in the display region of the base substrate, and simultaneously forming a plurality of signal leads or a plurality of driving circuits in the non-display region of the base substrate, wherein the plurality of gate lines and the plurality of data lines are vertically and horizontally crossed; and bonding a plurality of driving chips on the base substrate in the non-display region and respectively connected to the plurality of signal leads. 6. The method of claim 5 , wherein forming the protective layer at least on the bending region further includes: coating a protective layer on a surface of the plurality of driving circuits that is other than the plurality of driving chips. 7. The method of claim 2 , wherein the non-display region containing the peripheral circuits is formed by: forming a plurality of gate lines and a plurality of data lines in the display region of the base substrate, and a plurality of signal leads and a plurality of multi-level cascaded shift register units in the non-display region of the base substrate, wherein: the plurality of gate lines and the plurality of data lines are vertically and horizontally crossed; and the plurality of signal leads are connected to the multi-level cascaded shift register units. 8. The method of claim 7 , wherein: the plurality of multi-level cascaded shift register units form a plurality of gate driver on array (GOA) circuits. 9. The method of claim 1 , wherein: when bending the display panel at the bending region towards the back surface of the display panel, a bending angle is larger than or equal to 90°. 10. The method of claim 1 , prior to folding the display panel at the bending region towards the back surface of the display panel, further including: providing a back film on the back surface of the display panel.
Drivers integrated on the active matrix substrate (G02F1/136277 takes precedence) · CPC title
Flexible substrates, e.g. plastics, organic film · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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