Display panel and display device, and fabrication methods thereof

US10209546B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10209546-B2
Application numberUS-201715571163-A
CountryUS
Kind codeB2
Filing dateJun 20, 2017
Priority dateJul 21, 2016
Publication dateFeb 19, 2019
Grant dateFeb 19, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Display panel and display device, and fabrication methods are provided. The method for fabricating the display panel includes forming a protective layer at least on a bending region, the bending region being in a non-display region containing peripheral circuits of the display panel, to cover the peripheral circuits, and folding the display panel at the bending region towards a back surface of the display panel. When the display panel is folded at the bending region towards the back surface of the display panel, the protective layer coated on the bending region provides protection for the peripheral circuits formed on the surface of the bending region.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for fabricating a curved display panel, comprising: forming a protective layer at least on a bending region, the bending region being in a non-display region containing peripheral circuits of a display panel, to cover the peripheral circuits; and folding the display panel at the bending region towards a back surface of the display panel; wherein the protective layer is made of a material including a photosensitive adhesive; after forming the protective layer at least on the bending region, the method further includes half-curing at least a portion of the protective layer corresponding to the bending region in an exposure process using a mask plate; and after folding the display panel at the bending region towards a back surface of the display panel, the method further includes performing a secondary exposure process on the protective layer to completely cure the protective layer. 2. The method of claim 1 , prior to forming the protective layer at least on the bending region, further including: providing a first substrate at least on a display region of the display panel; providing a second substrate on the non-display region; and forming a base substrate of the display panel by joining the first substrate and the second substrate, wherein the second substrate is made of a flexible material. 3. The method of claim 1 , prior to forming the protective layer at least on the bending region, further including: providing a first substrate and a second substrate, wherein: the second substrate is provided on the non-display region and a display region of the display panel; and the first substrate is attached onto a top surface of the second substrate and above the display region, together forming a base substrate of the display panel, wherein the second substrate is made of a flexible material. 4. The method of claim 1 , prior to forming the protective layer at least on the bending region, further including: providing a substrate material layer on both a display region and the non-display region to form a base substrate of the display panel, wherein the substrate material layer is made of a flexible material. 5. The method of claim 2 , wherein the non-display region containing the peripheral circuits is formed by: forming a plurality of gate lines and a plurality of data lines in the display region of the base substrate, and simultaneously forming a plurality of signal leads or a plurality of driving circuits in the non-display region of the base substrate, wherein the plurality of gate lines and the plurality of data lines are vertically and horizontally crossed; and bonding a plurality of driving chips on the base substrate in the non-display region and respectively connected to the plurality of signal leads. 6. The method of claim 5 , wherein forming the protective layer at least on the bending region further includes: coating a protective layer on a surface of the plurality of driving circuits that is other than the plurality of driving chips. 7. The method of claim 2 , wherein the non-display region containing the peripheral circuits is formed by: forming a plurality of gate lines and a plurality of data lines in the display region of the base substrate, and a plurality of signal leads and a plurality of multi-level cascaded shift register units in the non-display region of the base substrate, wherein: the plurality of gate lines and the plurality of data lines are vertically and horizontally crossed; and the plurality of signal leads are connected to the multi-level cascaded shift register units. 8. The method of claim 7 , wherein: the plurality of multi-level cascaded shift register units form a plurality of gate driver on array (GOA) circuits. 9. The method of claim 1 , wherein: when bending the display panel at the bending region towards the back surface of the display panel, a bending angle is larger than or equal to 90°. 10. The method of claim 1 , prior to folding the display panel at the bending region towards the back surface of the display panel, further including: providing a back film on the back surface of the display panel.

Assignees

Inventors

Classifications

  • Drivers integrated on the active matrix substrate (G02F1/136277 takes precedence) · CPC title

  • Flexible substrates, e.g. plastics, organic film · CPC title

  • Electricity · mapped topic

  • Electricity · mapped topic

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US10209546B2 cover?
Display panel and display device, and fabrication methods are provided. The method for fabricating the display panel includes forming a protective layer at least on a bending region, the bending region being in a non-display region containing peripheral circuits of the display panel, to cover the peripheral circuits, and folding the display panel at the bending region towards a back surface of …
Who is the assignee on this patent?
Boe Technology Group Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02F1/133305. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 19 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).