Co-finishing surfaces

US10207387B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10207387-B2
Application numberUS-201514714876-A
CountryUS
Kind codeB2
Filing dateMay 18, 2015
Priority dateMar 6, 2015
Publication dateFeb 19, 2019
Grant dateFeb 19, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.

First claim

Opening claim text (preview).

We claim: 1. A method for co-finishing surfaces, comprising: bonding a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface, the first structure having a chamfered edge; co-lapping the first surface and the second surface to reduce the offset; and co-polishing the first surface and the second surface such that the first surface and the second surface are flush; wherein: at least one of the operation of co-lapping or the operation of co-polishing removes the chamfered edge. 2. The method of claim 1 , further comprising chamfering an edge of the first surface prior to the operation of co-lapping, thereby forming the chamfered edge. 3. The method of claim 1 , wherein at least one of the operation of co-lapping or the operation of co-polishing changes a shape of the first surface. 4. The method of claim 1 , further comprising filling a gap between the bonded first structure and a side of the aperture. 5. The method of claim 1 , wherein the second material comprises zirconia and the first material comprises one of glass, chemically strengthened glass, zirconia, alumina, and sapphire. 6. The method of claim 1 , wherein the operation of co-polishing polishes the first surface at a first polishing speed and the second surface at a second polishing speed. 7. The method of claim 1 , further comprising lapping the first surface prior to the operation of bonding. 8. A method for co-finishing surfaces, comprising: adhesively bonding a sapphire window to a zirconia structure such that a combined surface formed by a first surface of the sapphire window and a second surface of the zirconia structure is uneven; placing a fill material in a gap between the sapphire window and the zirconia structure; and co-finishing the sapphire window and the zirconia structure, thereby: removing a chamfered edge of the sapphire window; making the combined surface even; and conforming a first geometry of the first surface to a second geometry of the second surface. 9. The method of claim 8 , wherein the first geometry of the first surface is flat and the second geometry of the second surface is curved. 10. The method of claim 8 , wherein the fill material absorbs side force during the operation of co-finishing. 11. The method of claim 8 , wherein the sapphire window has an additional chamfered edge that is removed by the operation of co-finishing. 12. The method of claim 8 , wherein the sapphire window is transparent after the operation of co-finishing. 13. The method of claim 8 , wherein the operation of co-finishing includes grinding the first surface and the second surface. 14. A method for co-finishing surfaces, comprising: providing a first material having a first surface with an aperture defined therein; attaching, to the first material and in the aperture, a second material having a second surface and a chamfered edge adjacent the second surface, the second material positioned relative to the first material such that the first and second surfaces are non-contiguous; and co-finishing the first material and the second material to make the first and second surfaces contiguous and to remove the chamfered edge; wherein at least one of the first and second surfaces is non-planar. 15. The method of claim 14 , wherein the second material is attached to the first material such that the second surface is proud of the first surface prior to co-finishing. 16. The method of claim 14 , wherein the second material is attached to the first material such that the first surface is proud of the second surface prior to co-finishing. 17. The method of claim 14 , wherein the first material and the second material are brittle. 18. The method of claim 14 , wherein the operation of attaching the second material to the first material includes bonding the second material to the first material using a heat activated film, a two part adhesive, or an adhesive. 19. The method of claim 14 , wherein the first material is reflective after the operation of co-finishing and the second material is translucent after the operation of co-finishing. 20. The method of claim 14 , further comprising placing an epoxy fill between the second surface and the first surface perpendicular to a direction of the co-finishing.

Assignees

Inventors

Classifications

  • Filling cavities in the preformed part (for joining B29C70/84) · CPC title

  • characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced · CPC title

  • designed for working spherical surfaces · CPC title

  • B24B37/042Primary

    operating processes therefor · CPC title

  • designed for working surfaces of revolution · CPC title

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What does patent US10207387B2 cover?
A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and secon…
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification B24B37/042. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 19 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 10 related publications on this page (citations in our corpus or others sharing the same primary CPC).