Co-molded ceramic and polymer structure

Patent metadata

Field	Value
Publication number	US-9750322-B2
Application number	US-201514816277-A
Country	US
Kind code	B2
Filing date	Aug 3, 2015
Priority date	Mar 8, 2015
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.

First claim

What is claimed is:

1. A housing component for an electronic device, comprising:
a ceramic shell comprising a central surface surrounded by a flange extending away from the central surface, the central surface and the flange defining a cavity; and
a polymer material coating the central surface and the flange and bonded to the central surface and to the flange by mechanical interaction between the polymer material and microstructures of the ceramic shell without any adhesive between the polymer material and the ceramic shell.

2. The housing component of claim 1 , wherein the ceramic shell is a unitary piece of ceramic material.

3. The housing component of claim 1 , wherein the polymer material is co-molded with the ceramic shell.

4. The housing component of claim 1 , wherein the flange completely surrounds the central surface.

5. The housing component of claim 1 , wherein:
the ceramic shell is coupled to an additional housing component to form a housing for an electronic device;
the ceramic shell and the additional housing component define an interior volume that is configured to receive electronic device components.

6. The housing component of claim 1 , wherein the polymer material has a substantially uniform thickness.

7. The housing component of claim 1 , wherein the ceramic shell includes a void in the central surface, and the polymer material is further coupled to the central surface by mechanical interaction between the polymer material and the void.

8. The housing component of claim 7 , wherein the void includes an undercut.

9. A housing for an electronic device, comprising:
a first housing portion formed from a ceramic material and defining a surface having a cavity therein; and
a retaining component mechanically engaged with the cavity, thereby coupling the retaining component to the first housing portion, the retaining component including an arm extending away from the first housing portion and configured to engage a retaining feature associated with a second housing portion, thereby retaining the first and second housing portions together; wherein:
the retaining component is formed from a polymer material; and
the retaining component is co-molded with the first housing portion.

10. The housing of claim 9 , wherein:
the retaining component includes a mounting base; and
the mounting base is molded to the surface of the first housing portion.

11. The housing of claim 10 , wherein the mounting base and the arm are formed as a unitary component.

12. The housing of claim 9 , wherein the retaining component is coupled directly to the surface of the first housing portion.

13. The housing of claim 9 , the arm further comprising a latch configured to engage the retaining feature of the second housing portion.

14. The housing of claim 9 , wherein the retaining component further comprises an additional arm extending away from the first housing portion and configured to engage with an additional retaining feature of the second housing portion.

15. The housing of claim 14 , wherein the arm and the additional arm each include an elongate member extending along more than half of a length of the first housing portion.

16. The housing of claim 9 , wherein a void defines an undercut.

17. The housing of claim 9 , wherein the retaining component is coupled to the surface of the first housing portion without any adhesive between the retaining component and the surface of the first housing portion.

18. A housing for an electronic device, comprising:
a first housing component, including:
a housing portion formed from a ceramic material; and
a retaining component coupled to a surface of the housing portion, the retaining component extending away from the housing portion, wherein the retaining component is formed from a polymer material;

a second housing component including a retaining feature engaged with the retaining component, thereby retaining the second housing component in fixed relationship to the first housing component, the first housing component and the second housing component defining an interior volume that is configured to receive electronic device components; and
an elastomeric biasing member disposed between a first face of the first housing component and an opposing second face of the second housing component
and.

19. The housing of claim 18 , wherein the biasing member is coupled directly to the first housing component or the second housing component.

20. The housing of claim 18 , wherein the biasing member is injection molded into a gap between the first face of the first housing component and the second face of the second housing component.

21. The housing of claim 18 , wherein:
the retaining component defines a latch configured to engage the retaining feature of the second housing component; and
the biasing member applies a force between the first and the second housing components such that the latch and the retaining feature remain engaged.

22. The housing of claim 21 , wherein the retaining feature forms a shoulder that engages with the latch.

23. A method of manufacturing a housing component for an electronic device, comprising:
placing a component formed from a ceramic material in a mold, the mold comprising:
a first section defining a first cavity configured to receive the component; and
a second section defining a second cavity that is in communication with the first cavity when the mold is closed, and is in a shape of a feature that is to be joined to the ceramic material;

injecting a polymer material into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material; and
curing the polymer material;
wherein the component and the feature together form the housing component for an electronic device.

24. The method of claim 23 , wherein the polymer material is formed between the ceramic material and a portion of the second cavity of the mold.

25. The method of claim 23 , further comprising, prior to placing the component in the mold, treating a surface of the component to create a roughened surface, wherein the polymer feature is bonded to the roughened surface.

26. The method of claim 25 , wherein:
the component includes an anchoring cavity;
the operation of injecting the polymer material into the second cavity comprises injecting the polymer material into the anchoring cavity such that, when the polymer material is cured, the polymer feature is anchored to the component via the anchoring cavity.

27. The method of claim 25 , wherein:
the component includes an anchoring protrusion; and
the operation of injecting the polymer material into the second cavity comprises injecting the polymer material around the anchoring protrusion such that, when the polymer material is cured, the polymer feature is anchored to the component via the anchoring protrusion.

28. The method of claim 23 , wherein the feature is a coating of polymer material over a surface of the component.

29. The method of claim 23 , wherein the feature is a retaining feature that is configured to mate with a complementary retaining feature on an additional housing component for the electronic device.

30. The method of claim 29 , wherein the housing component and the additional housing component, when retained together via the retaining feature an

Assignees

• Apple Inc

Inventors

• Nazzaro David I
• Poole Joseph C
• Kenney Kevin M
• Matsuyuki Naoto

Classifications

• B29K2709/02

  Ceramics · CPC title

• B29C39/10

  incorporating preformed parts or layers, e.g. casting around inserts or for coating articles {(coating a surface by casting in general B05D1/30, B29C39/126 takes precedence)} · CPC title

• B29K2101/12

  Thermoplastic materials · CPC title

• B29L2031/3481

  Housings or casings incorporating or embedding electric or electronic elements · CPC title

• B29K2995/0026

  Transparent · CPC title