Nickel particle composition, bonding material, and bonding method in which said material is used

Patent metadata

Field	Value
Publication number	US-10207373-B2
Application number	US-201515323092-A
Country	US
Kind code	B2
Filing date	Jun 30, 2015
Priority date	Jun 30, 2014
Publication date	Feb 19, 2019
Grant date	Feb 19, 2019

Abstract

A nickel particle composition is shown, including: A) a nickel particle having an average particle size in the range of 0.5 μm to 20 μm obtained via a laser diffraction/scattering method and containing 50 wt % or more of a nickel element; B) a nickel fine particle having an average primary particle size in the range of 30 nm to 200 nm observed via a scanning electron microscope and containing 50 wt % or more of a nickel element; and C) an organic binder in the range of 0.1 wt % to 2.5 wt % relative to the total metal content; and the weight ratio of a component A to a component B (component A:component B) is in the range of 30:70 to 70:30.

First claim

What is claimed is:

1. A nickel particle composition, comprising the following component A to component C:
component A: a nickel particle having an average particle size in a range of 0.5 μm to 20 μm obtained via a laser diffraction/scattering method and containing 50 wt % or more of a nickel element;
component B: a nickel fine particle having an average primary particle size in a range of 30 nm to 200 nm observed via a scanning electron microscope and containing 50 wt % or more of the nickel element; and
component C: an organic binder in a range of 0.1 wt % to 2.5 wt % relative to a total metal content; and
a weight ratio of the component A to the component B (component A:component B) is in a range of 30:70 to 70:30.

2. The nickel particle composition of claim 1 , wherein a content of the nickel element of the component A is 99.0 wt % or more.

3. The nickel particle composition of claim 1 , wherein a content of the nickel element of the component B is in a range of 90 wt % to 99.0 wt %.

4. The nickel particle composition of claim 1 , wherein a content of the nickel element of the component A is 99.0 wt % or more, and a content of the nickel element of the component B is in a range of 90 wt % to 99.0 wt %.

5. The nickel particle composition of claim 1 , wherein a content of the nickel element of the component A is 99.0 wt % or more, a content of the nickel element of the component B is in a range of 90 wt % to 99.0 wt %, and a content of the component C to the total metal content is in a range of 0.3 wt % to 1.5 wt %.

6. A bonding material, comprising the nickel particle composition of claim 1 , wherein a content of the nickel particle composition is in a range of 70 wt % to 96 wt %.

7. The bonding material of claim 6 , further comprising an organic solvent having a boiling point in a range of 100° C. to 300° C., wherein a content of the organic solvent is in a range of 4 wt % to 30 wt %.

8. The bonding material of claim 7 , wherein relative to all of the organic solvent, the organic solvent contains at least one selected from the group consisting of 1-undecanol and tetradecane in a range of 15 wt % to 50 wt %.

9. A bonding method, comprising placing the bonding material of claim 6 between members to be bonded and performing heating at a temperature in a range of 200° C. to 400° C. in a reductive gas environment containing a reductive gas to form a bonding layer between the bonding members to be bonded.

Assignees

• Nippon Steel & Sumikin Chem Co
• Nippon Steel Chemical & Mat Co Ltd

Inventors

• Shimizu Takayuki

Classifications

• H10W72/07341

  Controlling the bonding environment, e.g. atmosphere composition or temperature · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title

• H10W72/30

  Die-attach connectors · CPC title