Laser reseal including optimized intensity distribution

Patent metadata

Field	Value
Publication number	US-10207366-B2
Application number	US-201615368794-A
Country	US
Kind code	B2
Filing date	Dec 5, 2016
Priority date	Dec 8, 2015
Publication date	Feb 19, 2019
Grant date	Feb 19, 2019

Abstract

A method is described for manufacturing a micromechanical component including a substrate and a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. An access opening connecting the first cavity to surroundings of the micromechanical component is formed in the substrate or in the cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or of the cap with the aid of a laser. The introduction of the energy or heat is controlled with the aid of a laser beam, which includes a spatial laser pulse expansion.

First claim

What is claimed is:

1. A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the method comprising:
in a first method step, forming, in the substrate or the cap, an access opening connecting the first cavity to surroundings of the micromechanical component;
in a second method step, adjusting, in the first cavity, at least one of the first pressure and the first chemical composition;
in a third method step, sealing the access opening by introducing energy or heat into an absorbing part of the substrate or the cap, with the aid of a laser, wherein the introduction of the energy or heat is controlled with the aid of a laser beam, which includes a spatial laser pulse expansion extending along a surface of the substrate or the cap facing away from the first cavity and extending in parallel to a main extension plane of the substrate, and a laser pulse intensity to minimize internal stresses in the substrate or in the cap.

2. The method as recited in claim 1 , wherein the introduction of the energy or heat is controlled with the aid of the laser beam in such a way that the spatial laser pulse expansion is formed over an entire area or as a section area of a hollow cylinder extending perpendicularly in relation to the longitudinal axis of the hollow cylinder, the longitudinal axis being coincident with a center point of the access opening.

3. The method as recited in claim 1 , wherein the introduction of the energy or the heat is controlled with the aid of the laser beam in such a way that the laser pulse expansion includes a first laser pulse expansion area having at least one first laser pulse intensity and a second laser pulse expansion area having at least one second laser pulse intensity, a projection of the first laser pulse expansion area on the main extension plane and a projection of the access opening on the main extension plane at least partially overlapping.

4. The method as recited in claim 3 , wherein the introduction of the energy or heat is controlled with the aid of the laser beam in such a way that a projection of the first laser pulse expansion area on the main extension plane and a projection of the second laser pulse expansion area on the main extension plane are spaced apart from one another.

5. The method as recited in claim 3 , wherein the introduction of the energy or heat is controlled with the aid of the laser beam in such a way that a projection of the second laser pulse expansion area on the main extension plane and a projection of the access opening on the main extension plane are spaced apart from one another.

6. The method as recited in claim 3 , wherein the introduction of the energy or heat is controlled with the aid of the laser beam in such a way that a first material area of a first absorbing area of the absorbing part of the substrate or the cap enters a liquid aggregate state as a result of the first laser pulse intensity of the first laser pulse expansion area, a second material area of a second absorbing area of the absorbing part of the substrate or the cap entering a liquid aggregate state or remaining in a solid aggregate state as a result of the second laser pulse intensity of the second laser pulse expansion area.

7. The method as recited in claim 3 , wherein the introduction of the energy or heat is controlled with the aid of the laser beam in such a way that the second laser pulse expansion area includes a first subarea and a second subarea, a projection of the first subarea on the main extension plane and a projection of the second subarea on the main extension plane being spaced apart from one another.

8. The method as recited in claim 7 , wherein the introduction of the energy or heat is controlled with the aid of the laser beam in such a way that the first subarea and the second subarea are formed rotationally-symmetrically and in parallel to the surface.

9. The method as recited in claim 7 , wherein the introduction of the energy or heat is controlled with the aid of the laser beam in such a way that the second laser pulse expansion area includes further subareas, the further subareas being formed rotationally-symmetrically and in parallel to the surface and being situated rotationally-symmetrically around the access opening and in parallel to the surface with the first subarea and the second subarea.

10. A micromechanical component, comprising:
a substrate; and
a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the substrate or the cap including a sealed access opening;
wherein the substrate or the cap includes a material area which solidifies and seals the access opening after a controlled introduction of energy or heat into an absorbing part of the substrate or the cap with the aid of a laser beam, which includes a spatial laser pulse expansion extending along a surface of the substrate or the cap facing away from the first cavity and extending in parallel to a main extension plane of the substrate, and a laser pulse intensity to minimize internal stresses in the substrate or in the cap.

Assignees

• Bosch Gmbh Robert

Inventors

• Ilin Alexander
• Reinmuth Jochen
• Ametowobla Mawuli
• Kappe Philip

Classifications

• B23K2101/36

  Electric or electronic devices · CPC title

• B23K2103/54

  Glass · CPC title

• B23K26/0604

  by a combination of beams · CPC title

• B23K26/206 Primary

  Laser sealing · CPC title

• B23K2101/42

  Printed circuits · CPC title