Device and method for producing a device

Patent metadata

Field	Value
Publication number	US-10204880-B2
Application number	US-201615754872-A
Country	US
Kind code	B2
Filing date	Aug 23, 2016
Priority date	Aug 25, 2015
Publication date	Feb 12, 2019
Grant date	Feb 12, 2019

Abstract

A device and a method for producing a device are disclosed. In an embodiment the device includes a first component, a second component and a connecting element directly arranged between the first component and the second component, wherein the connecting element includes at least a first metal, which is formed as an adhesive layer, a diffusion barrier and a component of a first phase and a second phase of the connecting element, wherein the adhesive layer is arranged on the first component and/or the second component, wherein the first phase and/or the second phase includes, besides the first metal, further metals different from the first metal, wherein a concentration of the first metal in the first phase is greater than a concentration of the first metal in the second phase, and wherein the connecting element includes a layer of a silicide of the first metal.

First claim

The invention claimed is:

1. A device comprising:
a first component;
a second component; and
a connecting element directly arranged between the first component and the second component,
wherein the connecting element comprises at least a first metal, which is formed as an adhesive layer, a diffusion barrier and a component of a first phase and a second phase of the connecting element,
wherein the adhesive layer is arranged on the first component and/or the second component,
wherein the first phase and/or the second phase comprises, besides the first metal, further metals different from the first metal,
wherein a concentration of the first metal in the first phase is greater than a concentration of the first metal in the second phase, and
wherein the connecting element comprises a layer of a silicide of the first metal, which is arranged between the adhesive layer and the first component and/or the second component.

2. The device according to claim 1 , wherein the first metal is selected from a group consisting of nickel, platinum and palladium, and/or wherein a concentration of the first metal in the diffusion barrier is greater than the concentration of the first metal in the first phase.

3. The device according to claim 1 , wherein the first phase and/or the second phase are in each case shaped as layers, wherein the adhesive layer has a layer thickness d2, which is smaller, at least by a factor of 2, than the sum of the layer thicknesses of the first phase and/or the second phase.

4. The device according to claim 1 , wherein no further adhesive layers other than the adhesive layer of the first metal and/or no further diffusion barriers other than the diffusion barrier of the first metal are arranged between the first and second components.

5. The device according to claim 1 , wherein the connecting element is free of the following elements: titanium, tantalum, tungsten and/or nitrogen.

6. The device according to claim 1 , wherein the further metals comprise at least a second metal and/or a third metal, and wherein the second metal is indium and the third metal is tin.

7. The device according to claim 1 , wherein the further metals comprise at least a fourth metal, and wherein the fourth metal is gold.

8. The device according to claim 1 , wherein the concentration of the first metal in the first phase is between 40 and 65 atom %, and/or wherein the concentration of the first metal in the second phase is between 20 and 40 atom %.

9. The device according to claim 1 , wherein the concentration of the first metal in the first phase is between 11 and 25 atom %, and/or the concentration of the first metal in the second phase is 0 atom %.

10. The device according to claim 1 , wherein a concentration of the second metal in the first phase is between 5 and 25 atom %, and/or wherein a concentration of the second metal in the second phase is between 20 and 40 atom %.

11. The device according to claim 1 , wherein a concentration of the second metal in the first phase is between 0 and 23 atom %, and/or a concentration of the second metal in the second phase is between 13 and 29 atom %.

12. The device according to claim 1 , wherein a concentration of a third metal in the first phase is between 15 and 40 atom %, and/or wherein a concentration of the third metal in the second phase is between 30 and 50 atom %.

13. The device according to claim 1 , wherein a concentration of a third metal in the first phase is between 41 and 50 atom %, and/or wherein a concentration of the third metal in the second phase is between 0 and 10 atom %.

14. The device according to claim 1 , wherein a concentration of a fourth metal Me4 in the first phase and/or the second phase is between 0 and 5 atom %, and/or wherein the concentration of the fourth metal in the first phase is between 28 and 40 atom %, and/or a concentration of the fourth metal in the second phase is between 71 and 83 atom %.

15. A method for producing the device according to claim 1 , the method comprising:
providing the first component and the second component;
applying at least one adhesive layer made of the first metal with a layer thickness d1 on the first component and/or the second component;
applying at least one layer of a second metal and at least one layer of a third metal on the adhesive layer thereby forming an arrangement, wherein the first, second and third metals are different from each other;
heating the arrangement to a first temperature between 130° C. and 260° C. for forming of the first phase and the second phase, wherein the first and second phases comprise the first metal of the adhesive layer, the second metal and the third metal; and
thereafter, heating the arrangement to a second temperature between 230° C. and 400° C. to form a thermodynamically and mechanically stable first and second phase,
wherein, at least before heating the arrangement to the second temperature, the first and second components are connected to each other,
wherein, after heating the arrangement to the second temperature, the device comprises an adhesive layer with a layer thickness d2<d1, the adhesive layer being adhesive and in a diffusion-tight manner, and
wherein the adhesive layer is arranged between the first phase and the first component and/or the second component.

16. The method according to claim 15 , further comprising applying a layer of a fourth metal, which is a component of the first phase and/or the second phase, wherein the adhesive layer with the layer thickness d2, the first phase and the second phase are arranged between the first component and/or the second component of the device.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Behr Barbara
• Wendt Mathias
• Zenger Marcus

Classifications

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/322

  Multilayered die-attach connectors, e.g. a coating on a top surface of a core · CPC title

• H10W72/30

  Die-attach connectors · CPC title