Techniques for a module connector design to improve pin connection
US-2024421516-A1 · Dec 19, 2024 · US
Electronic device
US10201086B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10201086-B2 |
| Application number | US-201615295010-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 17, 2016 |
| Priority date | Aug 2, 2016 |
| Publication date | Feb 5, 2019 |
| Grant date | Feb 5, 2019 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals, respectively. The stress generated by any one of the electrode terminals is distributed to all of the solder pads so as to prevent the electronic component from being offset during an assembly process.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic device, comprising: a circuit board having a plurality of conductive contacts, each of the conductive contacts comprising a plurality of solder pads with a gap existing between any two adjacent ones of the solder pads; and an electronic element disposed on the circuit board and having a plurality of electrode terminals, each of the electrode terminals being coupled to each corresponding one of the conductive contacts through the solder pads, and a single electrode terminal of the electrode terminals is coupled to the plurality of solder pads of a single conductive contact, wherein at least a portion of the single electrode terminal is located in a vertical projection area of the plurality of solder pads of the single conductive contact. 2. The electronic device of claim 1 , further comprising a plurality of conductive wires electrically connecting to the solder pads of the single conductive contact. 3. The electronic device of claim 2 , wherein the conductive wires are located in a region outside of a projecting area of the electronic element from a top view. 4. The electronic device of claim 2 , wherein the conductive wires are located within a projecting area of the electronic element from a top view. 5. The electronic device of claim 2 , wherein each of the conductive wires is in a shape of a straight line or a curved line. 6. The electronic device of claim 1 , further comprising a solder material coupling the single electrode terminal to the single conductive contact.
Assignees
Inventors
Classifications
Surface mounted components · CPC title
Divided layout, i.e. conductors divided in two or more parts · CPC title
- H05K1/111Primary
Pads for surface mounting, e.g. lay-out · CPC title
- H05K3/3442Primary
having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title
- H05K1/181Primary
associated with surface mounted components · CPC title
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Frequently asked questions
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- What does patent US10201086B2 cover?
- An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals, respectively. The stress generated by any one of the electrode termina…
- Who is the assignee on this patent?
- Siliconware Precision Industries Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K1/111. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).