Shadow mask alignment and management system

US10199660B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10199660-B2
Application numberUS-201615076523-A
CountryUS
Kind codeB2
Filing dateMar 21, 2016
Priority dateOct 27, 2009
Publication dateFeb 5, 2019
Grant dateFeb 5, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A magnetic handling assembly for thin-film processing of a substrate, a system and method for assembling and disassembling a shadow mask to cover a top of a workpiece for exposure to a processing condition. The assembly may include a magnetic handling carrier and a shadow mask disposed over, and magnetically coupled to, the magnetic handling carrier to cover a top of a workpiece that is to be disposed between the shadow mask and the magnetic handling carrier when exposed to a processing condition. A system includes a first chamber with a first support to hold the shadow mask, a second support to hold a handling carrier, and an alignment system to align the shadow mask a workpiece to be disposed between the carrier and shadow mask. The first and second supports are moveable relative to each other.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of handling a shadow mask to cover a top of a workpiece for exposure to a processing condition, the method comprising: disposing a handling carrier on a first support; disposing a shadow mask on a second support; aligning, with a computer-controlled multi-axis stage, a first pattern feature of the shadow mask to a second pattern feature of a workpiece by moving the first support a first distance relative to the second support based on a computerized pattern recognition system; and coupling the aligned shadow mask with the handling carrier by moving the first support a second distance relative to the second support to bring a bottom surface of the aligned shadow mask into a magnetic field of the handling carrier, wherein the magnetic field of the handling carrier comprises a plurality of defined magnetic regions across a surface of the handling carrier over which the shadow mask is secured, wherein the plurality of defined magnetic region have different field strengths. 2. The method of claim 1 , further comprising: disposing the workpiece on the handling carrier prior to aligning the first and second pattern features. 3. The method of claim 2 , further comprising: suspending the shadow mask while disposed on the first support over the workpiece while aligning the first and second pattern features. 4. The method of claim 1 , further comprising: transferring the handling carrier from a first module storing a plurality of handling carriers to the first support with a robotic handler; and transferring the shadow mask from a second module storing a plurality of shadow masks to the first support with the robotic handler. 5. The method of claim 1 , further comprising: removing, neutralizing, or overcoming the magnetic field of the handling carrier to physically separate the shadow mask from the workpiece. 6. The method of claim 5 , further comprising: disposing a second workpiece between the handling carrier and the shadow mask for assembly.

Assignees

Inventors

Classifications

  • fluorinated polymers · CPC title

  • Electrodes composed of, or comprising, active material · CPC title

  • C23C14/042Primary

    using masks · CPC title

  • H01M6/40Primary

    Printed batteries {, e.g. thin film batteries} · CPC title

  • Cross-Sectional Technologies · mapped topic

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Frequently asked questions

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What does patent US10199660B2 cover?
A magnetic handling assembly for thin-film processing of a substrate, a system and method for assembling and disassembling a shadow mask to cover a top of a workpiece for exposure to a processing condition. The assembly may include a magnetic handling carrier and a shadow mask disposed over, and magnetically coupled to, the magnetic handling carrier to cover a top of a workpiece that is to be d…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification C23C14/042. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).