Die sidewall interconnects for 3D chip assemblies

Patent metadata

Field	Value
Publication number	US-10199354-B2
Application number	US-201615385673-A
Country	US
Kind code	B2
Filing date	Dec 20, 2016
Priority date	Dec 20, 2016
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

A stacked-chip assembly including an IC chip or die that is electrically interconnected to another chip and/or a substrate by one or more traces that are coupled through sidewalls of the chip. Electrical traces extending over a sidewall of the chip may contact metal traces of one or more die interconnect levels that intersect the chip edge. Following chip fabrication, singulation may expose a metal trace that intersects the chip sidewall. Following singulation, a conductive sidewall interconnect trace formed over the chip sidewall is to couple the exposed trace to a top or bottom side of a chip or substrate. The sidewall interconnect trace may be further coupled to a ground, signal, or power rail. The sidewall interconnect trace may terminate with a bond pad to which another chip, substrate, or wire lead is bonded. The sidewall interconnect trace may terminate at another sidewall location on the same chip or another chip.

First claim

What is claimed is:

1. An integrated circuit (IC) chip assembly, comprising:
a first IC die comprising a first interconnect metallization level below a second interconnect metallization level; and
a sidewall interconnect trace in contact with a conductive trace in the first interconnect metallization level that intersects an edge sidewall of the first IC die, wherein the sidewall interconnect trace is electrically coupled to at least one of:
a second conductive trace intersecting an edge sidewall of the first IC die;
a second IC die; or
a substrate of the assembly.

2. The IC chip assembly of claim 1 , wherein:
the sidewall interconnect trace is over a length of the edge sidewall that separates the conductive trace from the second trace, the second IC die, or substrate to which the sidewall interconnect trace is coupled.

3. The IC chip assembly of claim 2 , wherein the sidewall interconnect trace has a width less than 300 μm and has a thickness, from an underlying interface with the edge sidewall, that is less than 30 μm.

4. The IC chip assembly of claim 3 , wherein the sidewall interconnect trace comprises Ag, Au, Al, or Cu.

5. The IC chip assembly of claim 4 , wherein the sidewall interconnect trace comprises an epoxy resin with a metallic filler including the Ag or Cu.

6. The IC chip assembly of claim 4 , wherein the sidewall interconnect trace is a metal comprising the Ag, Au, Al, or Cu.

7. The IC chip assembly of claim 1 , wherein:
a first side of the first IC die includes a plurality of first metal interconnect features bonded to corresponding metal interconnect features on the substrate; and
the sidewall interconnect trace is coupled to the second IC die.

8. The IC chip assembly of claim 7 , wherein:
the sidewall interconnect trace comprises a pad to which a metal interconnect feature on a first side of the second IC die is electrically coupled.

9. The IC chip assembly of claim 1 , wherein:
a die-attach paste or film is in contact with a side of the first or second IC die; and
the sidewall interconnect trace is over a thickness of the die-attach paste or film.

10. The IC chip assembly of claim 9 , wherein:
a first side of the first IC die includes a plurality of first metal interconnect features bonded to corresponding metal interconnect features on the substrate;
a first side of the second IC die is attached to a second side of the first IC die by the die-attach paste or film; and
the sidewall interconnect trace contacts a conductive trace that intersects an edge sidewall of the second IC die.

11. The IC chip assembly of claim 1 , wherein:
a first side of the first IC die includes a plurality of first metal interconnect features bonded to corresponding metal interconnect features on the substrate;
the first side of the first IC die includes a plurality of second metal interconnect features bonded to corresponding metal interconnect features on a side of the second IC die; and
the sidewall interconnect trace is electrically coupled to the substrate through a bond wire.

12. An integrated circuit (IC) chip assembly, comprising:
a first IC chip; and
a sidewall interconnect trace in contact with a conductive trace that intersects an edge sidewall of the first IC chip, wherein the sidewall interconnect trace is electrically coupled to a second IC chip;
a first side of the first IC chip includes a plurality of first metal interconnect features bonded to corresponding metal interconnect features of the second IC chip;
the sidewall interconnect trace extends from the edge sidewall to a second side of the first IC chip; and
the sidewall interconnect trace is electrically coupled through a bond wire to a substrate of the assembly.

13. The IC chip assembly of claim 12 , wherein:
a first side of the second IC chip is attached to the substrate by a die-attach paste or film; and
a second sidewall interconnect trace contacts a conductive trace intersecting an edge sidewall of the second IC chip and couples the conductive trace to the first IC chip or the substrate through another bond wire.

14. An integrated circuit (IC) chip assembly, comprising:
an IC chip comprising a first conductive trace that intersects an edge sidewall of the IC chip; and
a sidewall interconnect trace in contact with the first conductive trace, wherein:
the first conductive trace is within a level of interconnect metallization on a first side of the IC chip, and is separated from a second conductive trace that intersects the edge sidewall by a thickness of semiconductor, the second trace within a level of interconnect metallization on a second side of the IC chip; and
the sidewall interconnect trace contacts the second conductive trace, electrically coupling interconnect metallization levels on opposite sides of the IC chip.

15. The IC chip assembly of claim 1 , wherein the sidewall trace interconnects a plurality of conductive traces that intersect the edge sidewall of the first IC die.

16. A memory chip assembly, comprising:
a package substrate including a plurality of signal pads;
a first memory IC die comprising a first interconnect metallization level below a second interconnect metallization level;
a second memory IC die; and
a sidewall interconnect trace in contact with a conductive trace in the first interconnect metallization level, wherein the conductive trace intersects an edge sidewall of the first die, and the sidewall interconnect trace is electrically coupled to at least one of: the first die; the second die; or one of the signal pads.

17. The memory chip assembly of claim 16 , wherein:
the first and second IC die are NAND flash memory die; and
the second end of the sidewall interconnect trace contacts a conductive trace within the second die that intersects an edge sidewall of the second die.

Assignees

• Intel Corp

Inventors

• Modi Mitul
• Raorane Digvijay A

Classifications

• H10W72/834

  Interconnections on sidewalls of chips · CPC title

• H10W72/01

  Manufacture or treatment · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title